Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2013
10/16/2013CN103354215A Quartz bracket
10/16/2013CN103354214A Front opening wafer box with elliptical latch structure
10/16/2013CN103354213A Wafer treatment apparatus and barrel used therein
10/16/2013CN103354212A Method for measuring and calculating alignment deviation of contact holes and polycrystalline silicon gates
10/16/2013CN103354211A Method for measuring and calculating alignment deviation of contact holes and polycrystalline silicon gates
10/16/2013CN103354210A Bonding method and bonding structure formed by adopting the same
10/16/2013CN103354209A Display panel and packaging method
10/16/2013CN103354208A Preparation method of silicon carbide grooved JFET (junction field effect transistor)
10/16/2013CN103354207A Manufacturing method of anti-ESD integration SOI LDMOS device unit
10/16/2013CN103354206A Through-hole manufacturing method, display-panel manufacturing method and display panel
10/16/2013CN103354205A Method for improving stability of etching process of polycrystalline silicon gate
10/16/2013CN103354204A Systems and methods for preparation of epitaxially textured thick films
10/16/2013CN103352201A Cathode liner and processing chamber having same
10/16/2013CN102539324B Detection device used for testing welding pulling force of patch type diode
10/16/2013CN102509716B Silicon chip taking and placing device
10/16/2013CN102496567B III-V family semiconductor nickel metallization manufacture method
10/16/2013CN102473622B Polishing agent, concentrated one-pack type polishing agent, two-pack type polishing agent and method for polishing substrate
10/16/2013CN102412173B Cut/ground silicon wafer surface cleaning apparatus
10/16/2013CN102412127B Manufacturing method of T-shaped metal gate electrode
10/16/2013CN102403272B Preparation method for high voltage complementary metal oxide semiconductor
10/16/2013CN102386230B Semiconductor devices and method for forming FinFETs
10/16/2013CN102376569B Manufacturing method of micrometering structure for position measurement in laser processing
10/16/2013CN102362146B Reflectance distribution curve modeling method, thickness measurement scheme and thickness measurement reflectometer using same
10/16/2013CN102347214B Preparation method for graphical template used for growing thick-film GaN material
10/16/2013CN102324390B Rectifier diode core manufacturing method
10/16/2013CN102324383B Ion implantation method and method for adjusting ion beam scanning rate
10/16/2013CN102280375B Manufacturing method of laminated metal gate structure in gate first process
10/16/2013CN102270654B Resistive random access memory device and manufacturing and operating methods thereof
10/16/2013CN102260461B Smoke-free polishing treatment solution for high-gloss aluminum sectional material and use method thereof
10/16/2013CN102237305B Array substrate and manufacturing method thereof, and liquid crystal display
10/16/2013CN102232190B Probe card
10/16/2013CN102201352B Trolley for transporting receiving container for dustproof thin film component
10/16/2013CN102176427B Method for manufacturing semiconductor device
10/16/2013CN102171801B Resin sealing compression molding method for electronic component and device therefor
10/16/2013CN102169876B Resin-sealed electronic control device and method of fabricating the same
10/16/2013CN102157396B Apparatus and method for embedding components in small-form-factor, system-on-packages
10/16/2013CN102130157B Semiconductor device with metal carrier and manufacturing method
10/16/2013CN102117774B Method for fabricating an integrated circuit device
10/16/2013CN102097334B Manufacture method for wiring board and stitch arrangement device
10/16/2013CN102089877B Methods of forming a plurality of capacitors
10/16/2013CN102084463B Dielectric cap above floating gate
10/16/2013CN102082129B Semiconductor device and manufacturing method thereof
10/16/2013CN102074515B Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same
10/16/2013CN102047397B Method for joining substrate and object to be mounted using solder paste
10/16/2013CN102034743B Method for forming metallic electrode of semiconductor device and metallic electrode forming device
10/16/2013CN102017070B Method for manufacturing silicon thin film transfer insulating wafer
10/16/2013CN102005434B Printed wiring board and method for manufacturing the same
10/16/2013CN102005419B Power semiconductor device and manufacturing method for the same
10/16/2013CN101958345B Compound semiconductor device and method for manufacturing the same
10/16/2013CN101937872B Semiconductor device and manufacturing method, and display device
10/16/2013CN101914811B One hundred millimeter high purity semi-insulating single crystal silicon carbide wafer
10/16/2013CN101893799B Liquid crystal display panel and manufacturing method thereof
10/16/2013CN101889328B Systems and methods for delivery of fluid-containing process material combinations
10/16/2013CN101853697B Gain cell embedded dynamic random access memory (eDRAM) unit, memory and preparation method thereof
10/16/2013CN101828118B A system for and method of integrating test structures into an integrated circuit
10/16/2013CN101826473B Forming method of penetrating electrode and semiconductor substrate
10/16/2013CN101825847B Cleanup method for optics in immersion lithography
10/16/2013CN101809190B Process for making thin film transistors by atomic layer deposition
10/16/2013CN101802120B Adhesive sheet and process for manufacturing electronic part
10/16/2013CN101740419B Protective film forming method and apparatus
10/16/2013CN101734484B Substrate conveyer
10/16/2013CN101711430B Assemblage of radiofrequency chips
10/16/2013CN101689410B Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material
10/16/2013CN101622296B Silicon-based antifrelective coating compositions
10/16/2013CN101599464B Method for manufacturing semiconductor device
10/16/2013CN101599453B Method for manufacturing semiconductor substrate
10/16/2013CN101595551B Critical dimension reduction and roughness control
10/16/2013CN101567314B Technique for controlling trench profile in semiconductor structures
10/16/2013CN101512741B Method and apparatus for manufacturing semiconductor element
10/16/2013CN101504930B Manufacturing method of SOI substrate
10/16/2013CN101501817B Method and device for removing pollution from a confined environment
10/16/2013CN101481797B Gas injection unit and thin film deposition apparatus having the same
10/16/2013CN101442068B Method for manufacturing organic electroluminescent device and organic electroluminescent device
10/16/2013CN101032003B Method for stripping photoresist from etched wafer
10/15/2013USRE44538 Indium gallium nitride channel high electron mobility transistors, and method of making the same
10/15/2013US8560977 Drop recipe creating method, database creating method and medium
10/15/2013US8560107 Substrate processing system
10/15/2013US8559697 Mask inspection apparatus and image generation method
10/15/2013US8559185 Integrated circuit package system with stackable devices and a method of manufacture thereof
10/15/2013US8559000 Method of inspecting a semiconductor device and an apparatus thereof
10/15/2013US8558989 Lithographic apparatus and device manufacturing method
10/15/2013US8558983 Liquid crystal display device and manufacturing method thereof
10/15/2013US8558947 Solid-state image pickup element, a method of manufacturing the same and electronic apparatus using the same
10/15/2013US8558773 EL display device, driving method thereof, and electronic equipment provided with the EL display device
10/15/2013US8558764 Light emitting device and method of driving the same
10/15/2013US8558643 Micromechanical device including N-type doping for providing temperature compensation and method of designing thereof
10/15/2013US8558392 Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant
10/15/2013US8558380 Stack package and method for manufacturing the same
10/15/2013US8558378 Bump-on-lead flip chip interconnection
10/15/2013US8558374 Electronic package with thermal interposer and method of making same
10/15/2013US8558368 Bi-directional, reverse blocking battery switch
10/15/2013US8558360 Flip chip package and method of manufacturing the same
10/15/2013US8558357 Ultra thin image sensor package structure and method for fabrication
10/15/2013US8558352 Semiconductor integrated circuit device and process for manufacturing the same
10/15/2013US8558350 Metal-oxide-metal capacitor structure
10/15/2013US8558349 Integrated circuit for a high-side transistor driver
10/15/2013US8558348 Variable resistance memory device and methods of forming the same
10/15/2013US8558347 Semiconductor devices and methods of manufacturing the same
10/15/2013US8558346 Semiconductor structure
10/15/2013US8558345 Integrated decoupling capacitor employing conductive through-substrate vias