Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2013
10/10/2013US20130264621 Semiconductor device having fin-shaped field effect transistor and manufacturing method thereof
10/10/2013US20130264620 Integrated circuit having ferroelectric memory with dense via barrier
10/10/2013US20130264613 Semiconductor structure and process thereof
10/10/2013US20130264612 Device and method for forming sharp extension region with controllable junction depth and lateral overlap
10/10/2013US20130264608 Self-Protected Drain-extended metal-oxide-semiconductor Transistor
10/10/2013US20130264576 Semiconductor device and manufacturing method of the same
10/10/2013US20130264574 Semiconductor device, and display device and electronic device using the same
10/10/2013US20130264572 Transparent thin film having conductive and nonconductive portions, method of patterning the portions, thin-film transistor array substrate including the thin film and method of manufacturing the same
10/10/2013US20130264533 Reram device structure
10/10/2013US20130264498 System and method of ion neutralization with multiple-zoned plasma flood gun
10/10/2013US20130264492 Enriched silicon precursor compositions and apparatus and processes for utilizing same
10/10/2013US20130264335 Induction heating apparatus and induction heating method
10/10/2013US20130264214 Metal plating for ph sensitive applications
10/10/2013US20130264201 Method and apparatus for high aspect ratio dielectric etch
10/10/2013US20130264015 Control of bevel etch film profile using plasma exclusion zone rings larger than the wafer diameter
10/10/2013US20130263900 Wet processing apparatuses
10/10/2013US20130263446 Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process
10/10/2013US20130263427 Installation fixture for elastomer bands and methods of using the same
10/10/2013DE112011104624T5 Verfahren und Vorrichtung zum Herstellen einer Halbleitervorrichtung Method and apparatus for manufacturing a semiconductor device
10/10/2013DE112011103266T5 Ätzresistente Beschichtung auf Sensor-Wafern für in situ-Messungen Etch-resistant coating on sensor wafers for in situ measurements
10/10/2013DE112010003053B4 Verfahren zum Herstellen einer Siliziumkarbid-Halbleitervorrichtung A method of manufacturing a silicon carbide semiconductor device
10/10/2013DE112005002324B4 Verfahren zum Herstellen eines Silicon-On-Insulator (SOI) Wafers mit einer Ätzstoppschicht A method for manufacturing a Silicon-On-Insulator (SOI) wafer having an etch stop layer
10/10/2013DE112004001654T5 Verfahren des Verarbeitens dicker ILD Schichten mit Hilfe von Spritzbeschichten oder Laminieren für einen C4 integrierten Dickmetallprozeßablauf auf Waferebene Method of processing thicker ILD layers using spray coating or lamination for a C4 integrated metal thickness at the wafer level process flow
10/10/2013DE102013205126A1 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
10/10/2013DE102013205068A1 Passivieren von Punktdefekten in Gatedielektrikumsschichten mit großer Dielektrizitätskonstante während der Gatestapelbildung Passivation of point defects in the gate dielectric with a high dielectric constant while the gate stack formation
10/10/2013DE102013103300A1 Halbleitervorrichtungen mit einem Schutzring und zugehörige Halbleitersysteme Semiconductor devices with a guard ring and related semiconductor systems
10/10/2013DE102013103119A1 Pcb-basierter fensterrahmen für hf-leistungspackage Pcb-based window frame for hf-performance package
10/10/2013DE102013102857A1 Klemmrahmen-Halbleitergehäuse und Verfahren zu ihrer Herstellung Clamping frame semiconductor package and process for its preparation
10/10/2013DE102012207470B3 Method for manufacturing semiconductor module arrangement i.e. converter, involves cooling body such that recess is reduced and composite is developed between semiconductor module and body, where sides exhibit surface of preset size
10/10/2013DE102012205616A1 Vorrichtung zum Abscheiden einer Schicht auf einer Halbleiterscheibe mittels Gasphasenabscheidung An apparatus for depositing a layer on a semiconductor wafer by chemical vapor deposition
10/10/2013DE102012205590A1 Power module for use with inverter for engine mounted in e.g. electric vehicle, has capillary and/or porous element which is provided with three common boundary surfaces for mold compound, circuit carrier and heat sinks respectively
10/10/2013DE102012107287A9 System und Verfahren zum identifizieren von Fehlern in einem Material System and method for identifying defects in a material
10/10/2013DE102012021144B3 Verfahren zur Erzeugung von Metallisierungen in Sackloch-Vias Process for the production of metallizations in blind vias
10/10/2013DE102012007115A1 Method for manufacturing thin film solar cell in industrial field, involves separating passivation layer with resistivity larger than base layer resistivity, on back surface portion, and separating conductive layer on carrier substrate
10/10/2013DE102010063159B4 Halbleitervorrichtung und ihr Herstellungsverfahren A semiconductor device and its manufacturing method
10/10/2013DE102009042920B4 Verfahren zur Herstellung eines Halbleiter-Bauelements und Verfahren zur Herstellung mehrerer Halbleiter-Bauelemente A process for producing a semiconductor device and methods for manufacturing a plurality of semiconductor devices
10/10/2013DE102008056390B4 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same
10/10/2013DE102008008513B4 Vorrichtung mit Zentrifuge zum Herstellen verlängerter Lothügel und zugehöriges Verfahren Centrifuge device for producing extended solder bumps and associated method
10/10/2013DE102005022354B4 Verfahren zum Bearbeiten von Objekten mittels Laserstrahlung A method for machining objects using laser radiation
10/09/2013EP2648234A1 Light receiving element, semiconductor epitaxial wafer, method for manufacturing the light receiving element and the semiconductor epitaxial wafer, and detecting apparatus
10/09/2013EP2648220A1 Floating gate memory device with trench isolation and method for manufacturing thereof
10/09/2013EP2648215A2 Method and apparatus providing integrated circuit system with interconnected stacked device wafers
10/09/2013EP2648214A1 Semiconductor device with interconnection via in the substrate and method of production
10/09/2013EP2648213A1 Apparatus and method for the transport on a liquid
10/09/2013EP2648212A1 Semiconductor device
10/09/2013EP2648211A1 Coating liquid for impurity diffusion
10/09/2013EP2648210A1 Composite substrate and production method
10/09/2013EP2647693A1 Substrate cleaner for copper wiring, and method for cleaning copper wiring semiconductor substrate
10/09/2013EP2647686A2 Resin Composition And Semiconductor Device Produced By Using The Same
10/09/2013EP2647264A1 Method for converting semiconductor layers
10/09/2013EP2647043A1 Method for treating wafers and dies
10/09/2013EP2647040A2 Stacked microelectronic assembly with tsvs formed in stages and carrier above chip
10/09/2013EP2647039A1 Coating liquid for forming metal oxide thin film, metal oxide thin film, field effect transistor, and method for producing the field effect transistor
10/09/2013EP2647038A2 Silicon and silicon germanium nanowire structures
10/09/2013EP2647037A1 Method for the hydrogen passivation of semiconductor layers
10/09/2013EP2647036A2 Ion implanter system including remote dopant source, and method comprising same
10/09/2013EP2647035A2 High rate electric field driven nanoelement assembly on an insulated surface
10/09/2013EP2647034A1 Direct wafer bonding
10/09/2013EP2647033A2 Thin-film photovoltaic device and fabrication method
10/09/2013EP2647032A2 Making semiconductor bodies from molten material using a free-standing interposer sheet
10/09/2013EP2646895A1 Display device with light diffusive glass panel
10/09/2013EP2646605A1 Epitaxial deposition apparatus, gas injectors, and chemical vapor management system associated therewith
10/09/2013EP2646602A1 Method of manufacturing an x-ray diffraction grating microstructure for imaging apparatus
10/09/2013EP2646194A2 Method of separating surface layer of semiconductor crystal using a laser beam perpendicular to the separating plane
10/09/2013EP2263252B1 Methods for etching carbon nano-tube films for use in non-volatile memories
10/09/2013CN203232901U Hand-held single sucker group
10/09/2013CN203232868U 智能功率模块 Intelligent Power Module
10/09/2013CN203232862U Suction pen barrel device for PECVD
10/09/2013CN203232861U High-performance intelligent bonding device
10/09/2013CN203232860U Stepping positioning mechanism for PCB electronic carrier plate type contact type IC card module
10/09/2013CN203232859U Wax pasting device for sapphire substrate
10/09/2013CN203232858U Restriction member with protection sleeve
10/09/2013CN203232857U A SOP-type integrated circuit separating mould detecting apparatus
10/09/2013CN203232856U Dual-bonding device
10/09/2013CN203232855U Antiskid acid washing board
10/09/2013CN203231572U Solar collecting board washing system
10/09/2013CN103348776A Method and apparatus for multizone plasma generation
10/09/2013CN103348485A Method for manufacturing organic element, method for bonding organic molecular crystal layer, method for manufacturing fine linear conductor, organic element, and fine linear conductor
10/09/2013CN103348484A Active matrix substrate, display panel, and display device
10/09/2013CN103348483A Thin-film transistor, manufacturing method therefor, and display device
10/09/2013CN103348481A Finfet structure having fully silicided fin
10/09/2013CN103348479A 半导体器件 Semiconductor devices
10/09/2013CN103348478A Silicon carbide semiconductor device and method for manufacturing the same
10/09/2013CN103348473A Trap rich layer for semiconductor device
10/09/2013CN103348464A 半导体装置及其制造方法 Semiconductor device and manufacturing method
10/09/2013CN103348463A Method and apparatus for improved singulation of light emitting device
10/09/2013CN103348462A Apparatus and method for transferring substrate
10/09/2013CN103348461A Fabrication of through-silicon vias on silicon wafers
10/09/2013CN103348460A Tap tape for electronic devices with reinforced lead crack and method of manufacturing the same
10/09/2013CN103348459A Adhesive compound and method for encapsulating an electronic arrangement
10/09/2013CN103348458A A method to enable the process and enlarge the process window for silicide, germanide or germanosilicide formation in structures with extremely small dimensions
10/09/2013CN103348457A Semiconductor device including high field regions and related method
10/09/2013CN103348456A Radical steam cvd
10/09/2013CN103348455A Methods of forming rutile titanium dioxide and associated methods of forming semiconductor structures
10/09/2013CN103348454A Component for plasma etching apparatus and method for manufacturing of component for plasma etching apparatus
10/09/2013CN103348453A Compound semiconductor single crystal substrate and method for manufacturing same
10/09/2013CN103348452A Process for selectively removing nitride from substrate
10/09/2013CN103348451A Substrate cleaning apparatus including non-contact rotation unit
10/09/2013CN103348450A Apparatus and method for forming an aperture in substrate
10/09/2013CN103348449A Composition for forming n-type diffusion layer, process for producing n-type diffusion layer, and process for producing solar cell
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