Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2003
10/14/2003US6632710 Method for forming semiconductor device
10/14/2003US6632709 Electronic device manufacture
10/14/2003US6632708 Semiconductor device and method of manufacturing the same
10/14/2003US6632707 Method for forming an interconnect structure using a CVD organic BARC to mitigate via poisoning
10/14/2003US6632706 Three dimensional structure integrated circuit fabrication process
10/14/2003US6632704 Molded flip chip package
10/14/2003US6632703 Method and apparatus for positioning a semiconductor pellet
10/14/2003US6632700 Method to form a color image sensor cell while protecting the bonding pad structure from damage
10/14/2003US6632696 Manufacturing method of active matrix substrate plate and manufacturing method therefor
10/14/2003US6632691 Apparatus and method for determining doping concentration of a semiconductor wafer
10/14/2003US6632690 Method of fabricating reliable laminate flip-chip assembly
10/14/2003US6632689 Method for processing semiconductor wafers in an enclosure with a treated interior surface
10/14/2003US6632688 Method for evaluating impurity concentrations in epitaxial reagent gases
10/14/2003US6632685 Apparatus and method for determining various processes of wafer fabrication in a semiconductor device manufacturing technology
10/14/2003US6632683 Method for forming a capacitor of a semiconductor device
10/14/2003US6632612 Synthesis of chemical tags
10/14/2003US6632593 Pattern-forming method using photomask, and pattern-forming apparatus
10/14/2003US6632592 Resist pattern forming method
10/14/2003US6632586 Irradiation acid generator and resin which decomposed on acidification; increasing solubility in alkaline developing solution
10/14/2003US6632582 Using an organosilicon compounds
10/14/2003US6632581 Improved resist performance-sensitivity and resolution using resin derived from alicyclic unsaturated carboxylic acid ester and acid generator suitable for excimer laser lithography using argon/krypton fluoride; semiconductor processing
10/14/2003US6632574 Mask having pattern areas whose transmission factors are different from each other
10/14/2003US6632549 Alkaline earth fluoride protective layer on aluminium nitride base
10/14/2003US6632532 Particle material anisotropic conductive connection and anisotropic conductive connection material
10/14/2003US6632512 Ceramic substrate
10/14/2003US6632482 Very short high voltage, low duty cycle ionization pulses, in conjunction with a synchronously produced electron flow to neutralize positively charged semiconductor wafer surfaces; shallow junction devices
10/14/2003US6632478 Forming dielectrics; annealing with ozone
10/14/2003US6632476 Spreading thin liquid film, semiconductors
10/14/2003US6632411 Silicon wafer and method for producing silicon single crystal
10/14/2003US6632377 Chemical-mechanical planarization of metallurgy
10/14/2003US6632345 Filling voids in noncontinuous copper seed layer to form conformal layer covering all of first layer by contacting with alkaline copper solution, electroplating copper onto seed layer in acidic copper solution to fill microrecesses
10/14/2003US6632335 Filling a metal such as copper in fine interconnection pattern recesses on a semiconductor
10/14/2003US6632334 Distributed power supplies for microelectronic workpiece processing tools
10/14/2003US6632325 Article for use in a semiconductor processing chamber and method of fabricating same
10/14/2003US6632324 System for the plasma treatment of large area substrates
10/14/2003US6632322 Switched uniformity control
10/14/2003US6632321 Method and apparatus for monitoring and controlling wafer fabrication process
10/14/2003US6632320 Connecting protuberant electrode of electronic component to terminal electrode of circuit board using adhesive containing curable resin and inorganic particles with specific surface area and particle sizes satisfying specified equations
10/14/2003US6632314 Method of making a lamination and surface planarization for multilayer thin film interconnect
10/14/2003US6632292 Selective treatment of microelectronic workpiece surfaces
10/14/2003US6632289 Use of an acid liquid agent in a cleaning cup; remaining acid washed out by use of pure water; alkaline liquid agent emitted to substrate surface to neutralize the acid left on surface
10/14/2003US6632288 Alkaline solutions are used with a nitrogen environment to clean a semiconductor device's copper surface of residues following chemical mechanical polishing and plasma etching steps; reduces alkaline etch rate of copper surface
10/14/2003US6632284 Apparatus and method for forming deposited film
10/14/2003US6632283 System and method for illuminating a semiconductor processing system
10/14/2003US6632281 Substrate processing apparatus and substrate processing method
10/14/2003US6632279 Method for growing thin oxide films
10/14/2003US6632278 Low defect density epitaxial wafer and a process for the preparation thereof
10/14/2003US6632277 Optimized silicon wafer gettering for advanced semiconductor devices
10/14/2003US6632259 Mixtures of copolymers, abrasives, oxidizers, corrosion inhibitors and complexing agents, used for selectively etching copper layers from semiconductor substrates
10/14/2003US6632129 Fixed abrasive article for use in modifying a semiconductor wafer
10/14/2003US6632124 Optical monitoring in a two-step chemical mechanical polishing process
10/14/2003US6632115 Method for forming transparent conductive film using chemically amplified resist
10/14/2003US6632068 Wafer handling system
10/14/2003US6632065 Substrate handling robot with a batch loader and individual vacuum control at batch loader paddles
10/14/2003US6631935 Detection and handling of semiconductor wafer and wafer-like objects
10/14/2003US6631934 Silicon carbide cantilever paddle
10/14/2003US6631807 Chip tray
10/14/2003US6631726 Dielectric barrier discharge lamp irradiates substrate with ultraviolet light; moistened inert gas supplied to space; splitting into reducing and oxidizing members; semiconductors
10/14/2003US6631692 Plasma CVD film-forming device
10/14/2003US6631662 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions
10/11/2003CA2425289A1 Semiconductor structure and method for processing such a structure
10/10/2003CA2424211A1 A memory device
10/09/2003WO2003084297A1 Wiring structure and its manufacturing method
10/09/2003WO2003084065A1 Integrated circuit, integrated circuit device, method for structuring integrated circuit device, and method for manufacturing integrated circuit device
10/09/2003WO2003084043A2 Device for handling flat panels in a vacuum
10/09/2003WO2003083960A1 Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained
10/09/2003WO2003083953A1 Solar cell and method of manufacturing the same
10/09/2003WO2003083951A1 Semiconductor device having a retrograde dopant profile in a channel region and method for fabricating the same
10/09/2003WO2003083950A1 Doped group iii-v nitride materials, and microelectronic devices and device precursor structures comprising same
10/09/2003WO2003083949A1 Nanowire and electronic device
10/09/2003WO2003083947A2 Folded bit line dram with vertical ultra thin body transistors
10/09/2003WO2003083946A1 Method of forming ferroelectric film, ferroelectric memory, process for producing ferroelectric memory, semiconductor device and process for producing semiconductor device
10/09/2003WO2003083945A1 Method of forming ferroelectric film, ferroelectric memory, process for producing ferroelectric memory, semiconductor device and process for producing semiconductor device
10/09/2003WO2003083942A2 Semiconductor device with components embedded in backside diamond layer
10/09/2003WO2003083939A1 Magnetic shield package and seal material of magnetic non-volatile memory element
10/09/2003WO2003083937A2 Source-side stacking fault body-tie for partially-depleted soi mosfet hysteresis control
10/09/2003WO2003083936A1 Method for forming an improved metal silicide contact to a silicon-containing conductive region
10/09/2003WO2003083935A1 Semiconductor device and its manufacturing method
10/09/2003WO2003083934A1 Semiconductor device formed over a multiple thickness buried oxide layer, and methods of making same
10/09/2003WO2003083933A1 Treating device for element to be treated and treating method
10/09/2003WO2003083931A1 Method for producing a plurality of gate stacks of approximately the same height and with the same interval on a semiconductor substrate
10/09/2003WO2003083930A1 Method for handling semiconductor layers in such a way as to thin same
10/09/2003WO2003083929A1 Ion implantation of silicon oxid liner to prevent dopant out-diffusion from so urce/drain extensions
10/09/2003WO2003083928A2 A method for making nanoscale wires and gaps for switches and transistors
10/09/2003WO2003083927A1 Methods for manufacturing compound semiconductor and compound insulator using chemical reaction and diffusion by heating, compound semiconductor and compound insulator manufactured using the method, and photocell, electronic circuit, transistor, and memory using the same
10/09/2003WO2003083926A2 The microwave enhanced method of silicon etching and the system for microwave enhanced semiconductors etching
10/09/2003WO2003083925A1 Method for forming insulation film
10/09/2003WO2003083924A1 Production method for ferroelectric thin film
10/09/2003WO2003083923A1 Plasma processing device and baffle plate thereof
10/09/2003WO2003083922A1 Plasma processor electrode and plasma processor
10/09/2003WO2003083921A1 Method of etching
10/09/2003WO2003083920A1 Tantalum barrier removal solution
10/09/2003WO2003083919A2 Method of manufacturing nanowires and electronic device
10/09/2003WO2003083918A1 Polishing pad and semiconductor substrate manufacturing method using the polishing pad
10/09/2003WO2003083917A1 Double side polishing device for wafer and double side polishing method
10/09/2003WO2003083916A1 Memory wordline hard mask extension
10/09/2003WO2003083915A1 Method for forming thin film
10/09/2003WO2003083913A1 Mask pattern correction method, semiconductor device manufacturing method, mask manufacturing method, and mask
10/09/2003WO2003083912A2 Field-assisted fusion bonding
10/09/2003WO2003083908A2 Packaging system for semiconductor devices
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