Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2004
02/05/2004US20040021172 Fully isolated dielectric memory cell structure for a dual bit nitride storage device and process for making same
02/05/2004US20040021171 Non-volatile semiconductor memory device, method for manufacturing same and method for controlling same
02/05/2004US20040021170 Method and apparatus for injecting charge onto the floating gate of a nonvolatile memory cell
02/05/2004US20040021169 Integrated structure effective to form a MOS component in a dielectrically insulated well
02/05/2004US20040021168 Semiconductor memory device having a memory region and a peripheral region, and a manufacturing method thereof
02/05/2004US20040021167 Nonvolatile semiconductor memory device comprising high concentration diffused region
02/05/2004US20040021165 Semiconductor device with capacitor electrodes and method of manufacturing thereof
02/05/2004US20040021164 DRAM semiconductor device and method for fabricating the same
02/05/2004US20040021163 Method for fabricating a vertical transistor, and semiconductor memory cell having a trench capacitor and an associated vertical selection transistor
02/05/2004US20040021162 DRAM cell structure with buried surrounding capacitor and process for manufacturing the same
02/05/2004US20040021161 Forming a multi-layer poly-metal structure over semiconductor substrate; forming etch stop layer in polysilicon region; removing portions of poly-metal structure; covering with oxidation barrier layer forming a full poly-metal stack
02/05/2004US20040021160 Semiconductor device, a method of manufacturing the semiconductor device and a method of deleting information from the semiconductor device
02/05/2004US20040021159 Semiconductor integrated circuit device and a method of manufacture thereof
02/05/2004US20040021158 Ferroelectric memory device and method for fabricating the same
02/05/2004US20040021157 Gate length control for semiconductor chip design
02/05/2004US20040021154 Maskless middle-of-line liner deposition
02/05/2004US20040021153 Semiconductor device and manufacturing method thereof
02/05/2004US20040021147 Semiconductor light emitting device and fabrication method thereof
02/05/2004US20040021143 III-nitride light emitting device with p-type active layer
02/05/2004US20040021141 Thin film transistor, method of producing the same, liquid crystal display, and thin film forming apparatus
02/05/2004US20040021140 Selective solder bump application
02/05/2004US20040021139 Semiconductor dice having backside redistribution layer accessed using through-silicon vias, methods of fabrication and assemblies
02/05/2004US20040021137 Semiconductor device
02/05/2004US20040021131 Enhanced adhesion and resolution of printed films; electrical conductivity; useful in printing conductive portions of thin film transistors such as sources and drains
02/05/2004US20040021125 To polish and remove a barrier metal film
02/05/2004US20040021095 Electron beam writing equipment
02/05/2004US20040021092 Adjustable implantation angle workpiece support structure for an ion beam implanter
02/05/2004US20040021076 Contact opening metrology
02/05/2004US20040020973 Bump formation method and bump forming apparatus to semiconductor wafer
02/05/2004US20040020930 Cover body for sheet supporting container and sheet supporting container
02/05/2004US20040020905 Method and apparatus for cleaning surfaces
02/05/2004US20040020901 Circuit singulation system and method
02/05/2004US20040020898 Contaminant removal by laser-accelerated fluid
02/05/2004US20040020897 Method for manufacturing thin-film structure
02/05/2004US20040020894 High selectivity etching of a lead overlay structure
02/05/2004US20040020891 Low Cu percentages for reducing shorts in AlCu lines
02/05/2004US20040020823 Display substrate accommodating tray and apparatus and method for removing the display substrate
02/05/2004US20040020789 For planarizing a substrate surface
02/05/2004US20040020788 For electrochemical mechanical polishing and/or electropolishing
02/05/2004US20040020781 Electro-chemical deposition cell for face-up processing of single semiconductor substrates
02/05/2004US20040020780 Connecting a power supply between a conductive layer on substrate and an electrode positioned in processing solution; immersing substrate into the processing solution; applying a forward electrical bias to conductive layer during immersion
02/05/2004US20040020770 Auxiliary electromagnets in a magnetron sputter reactor
02/05/2004US20040020768 Asymmetric rotating sidewall magnet ring for magnetron sputtering
02/05/2004US20040020759 Sputtering cathode adapter assembly and method
02/05/2004US20040020634 Adjustable pedestal thermal interface
02/05/2004US20040020602 Field-assisted fusion bonding
02/05/2004US20040020601 Process and an integrated tool for low k dielectric deposition including a pecvd capping module
02/05/2004US20040020600 Semiconductor device manufacturing equipment having gate providing multiple seals between adjacent chambers
02/05/2004US20040020599 Treating device
02/05/2004US20040020521 Method of reducing water spotting and oxide growth on a semiconductor structure
02/05/2004US20040020520 Apparatus for cleaning a wafer
02/05/2004US20040020518 Providing enclosed pressure vessel containing supercritical carbon dioxide; adding a second fluid to vessel, forming an interface between supercritical fluid and second fluid; displacing supercritical fluid from vessel with pressure
02/05/2004US20040020513 Methods of thinning a silicon wafer using HF and ozone
02/05/2004US20040020512 Megasonic cleaner and dryer system
02/05/2004US20040020511 Method of providing high flux of point of use activated reactive species for semiconductor processing
02/05/2004US20040020438 Managing work-piece deflection
02/05/2004US20040020437 Vaporizer for MOCVD and method of vaporizing raw material solutions for MOCVD
02/05/2004US20040020436 CVD reactor with graphite-foam insulated, tubular susceptor
02/05/2004US20040020434 Focused ion beam deposition
02/05/2004US20040020431 Plasma treatment apparatus
02/05/2004US20040020429 Pressure regulating system of plasma processing equipment
02/05/2004US20040020427 Device and process for liquid treatment of wafer-shaped articles
02/05/2004US20040020135 For chemical mechanical polishing conducted in a step of forming a buried type copper-based metal interconnection of a semiconductor device
02/05/2004US20040020134 Cmp slurry composition and a method for planarizing semiconductor device using the same
02/05/2004US20040020072 Apparatus and method for drying semiconductor wafers using IPA vapor drying method
02/05/2004US20040020046 Deforming conductive particles by application of a stress; mixing the deformed conductive particles with a binder that includes a thermosetting resin as a main component
02/05/2004US20040020045 Method for connecting electronic parts
02/05/2004US20040020043 Apparatus and method for mounting component
02/05/2004US20040020040 Attaching a wafer to a surface of a tape structure; forming a grid of grooves in wafer to separate dies on the surface of the tape structure; causing to harden into a grid shaped structure
02/05/2004US20040020039 Multi-barrel die transfer apparatus and method for transferring dies therewith
02/05/2004US20040020038 Positioning second surface to be closely adjacent to the first surface that has dies attached; reducing a distance between first surface and second surface until dies contact second surface and attach to the second surface; moving apart
02/05/2004US20040020037 Die frame apparatus and method of transferring dies therewith
02/05/2004US20040020036 Method and apparatus for high volume assembly of radio frequency identification tags
02/05/2004DE4438616B4 Halbton-Phasenverschiebermaske Halftone Phasenverschiebermaske
02/05/2004DE19823212B4 Halbleitereinrichtung mit einer Feldabschirm-Isolationsstruktur und Verfahren zur Herstellung derselben A semiconductor device with a field shield isolation structure and method for manufacturing the same
02/05/2004DE10331811A1 Leiterpaste, Verfahren zum Drucken der Leiterpaste und Verfahren zur Herstellung einer Keramikleiterplatte Conductor paste method for printing the conductor paste and method of manufacturing a ceramic circuit board
02/05/2004DE10310073A1 Process for selecting a mask producer for a photomask for semiconductor wafer processing compares at least two masks
02/05/2004DE10252835A1 Support for vehicle bumper comprises profile with trapezium-shaped cross-section and has two internal braces forming triangle and parallel to side walls
02/05/2004DE10234250A1 Device for monitoring the crystallization of a medium, especially silicon, used in photovoltaic applications comprises a measuring unit for acquiring the volume of the medium, and an evaluating unit operating with the measuring unit
02/05/2004DE10233209A1 Irradiating resist during the production of integrated switching arrangement comprises forming radiation-sensitive resist layer arrangement after producing layer to be structured and irradiating the resist layer arrangement
02/05/2004DE10232984A1 Düsenanordnung zum Aufbringen einer Flüssigkeit auf ein Substrat Nozzle arrangement for applying a liquid to a substrate
02/05/2004DE10232781A1 Vorrichtung zur Wafer-Inspektion Apparatus for wafer inspection
02/05/2004DE10232731A1 Be- und Entladevorrichtung für eine Beschichtungseinrichtung Loading and unloading of a coating device
02/05/2004DE10232689A1 Mit Strahlen geladener Teilchen arbeitende Anwendungen With charged particle beams working applications
02/05/2004DE10232190A1 Verfahren zur Herstellung eines Bauelements mit tiefliegenden Anschlußflächen Method for manufacturing a device with deep pads
02/05/2004DE10232080A1 Elektrostatischer Greifer und Verfahren zu dessen Herstellung An electrostatic gripper and process for its preparation
02/05/2004DE10232002A1 Integrierter Halbleiterspeicher und Herstellungsverfahren Integrated semiconductor memory and manufacturing processes
02/05/2004DE10232001A1 Production of integrated semiconductor memory comprises etching trench in a substrate forming bars, forming first insulating layer on the base of the trench and on the upper sides and on the side walls of the bars and further processing
02/05/2004DE10231202A1 Vertical transistor memory cell comprises a substrate containing a trench, electrically insulated storage regions side walls of the trench, gates region arranged in the trench, and source/drain regions
02/05/2004DE10231199A1 Halbleiterbauelement Semiconductor device
02/05/2004DE10228762A1 Dicarbonsäuren für Dielektrika mit Sperrwirkung gegen Kupferdiffusion Dicarboxylic acids for dielectrics with barrier action against copper diffusion
02/05/2004DE10212640B4 Logische Bauteile aus organischen Feldeffekttransistoren Logical components of organic field-effect transistors
02/05/2004DE10204386B4 Leuchtdiode und Verfahren zu ihrer Herstellung Light-emitting diode and methods for their preparation
02/05/2004DE10146146B4 Verfahren zur elektrischen Isolation nebeneinander liegender metallischer Leiterbahnen und Halbleiterbauelement mit voneinander isolierten metallischen Leiterbahnen A method for electrical isolation of adjacent metallic conductor tracks and semiconductor device comprising mutually insulated metallic conductor tracks
02/05/2004DE10135393B4 Elektronisches Bauteil, Herstellverfahren, sowie Verfahren zum Herstellen einer elektrischen Verbindung zwischen dem Bauteil und einer Leiterplatte An electronic component manufacturing method, and to methods for making an electrical connection between the component and a printed circuit board
02/05/2004DE10109542B4 Anordung zur Verbindung eines auf einer Leiterplatte angebrachten Bauelementes mit einer flexiblen Schichtanordnung Arrangement for connecting a mounted component on a circuit board with a flexible layer arrangement
02/05/2004CA2493926A1 Fluorinated polymers, photoresists and processes for microlithography
02/04/2004EP1387494A1 CMOS circuits with protection for a single event upset
02/04/2004EP1387493A2 Input protection circuit
02/04/2004EP1387473A2 Device for moving components in vacuum apparatuses