Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2004
02/14/2004CA2436759A1 Method for modifying the impedance of semiconductor devices using a focused heating source
02/14/2004CA2398166A1 Method for modifying the impedance of semiconductor devices using a focused heating source
02/12/2004WO2004015779A1 Method of creating a high performance organic semiconductor device
02/12/2004WO2004014114A1 Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board
02/12/2004WO2004013928A1 Transmission line and semiconductor integrated circuit device
02/12/2004WO2004013922A2 Organic electronic devices
02/12/2004WO2004013919A1 Magnetoresistance effect element and magnetic memory unit
02/12/2004WO2004013913A1 Thin film transistor array panel
02/12/2004WO2004013912A1 Iii group nitride semiconductor substrate and method for preparation thereof, and iii group nitride semiconductor element and method for preparation thereof
02/12/2004WO2004013908A1 Method of manufacturing multi-level contacts by sizing of contact sizes in integrated circuits
02/12/2004WO2004013907A1 Dual damascene trench depth monitoring
02/12/2004WO2004013906A1 Ozone processing apparatus
02/12/2004WO2004013905A1 Etching method
02/12/2004WO2004013904A1 Complementary division mask having alignment mark, method for forming alignment mark of the complementary division mask, semiconductor device manufactured by using the complementary division mask, and its manufacturing method
02/12/2004WO2004013903A2 Wafer batch processing system and method
02/12/2004WO2004013902A2 Hot plate annealing
02/12/2004WO2004013901A2 Batch furnace
02/12/2004WO2004013900A2 System and method for manufacturing embedded conformal electronics
02/12/2004WO2004013867A2 An optical device for directing x-rays having a plurality of optical crystals
02/12/2004WO2004013861A2 Magnetic element utilizing spin transfer and an mram device using the magnetic element
02/12/2004WO2004013723A2 Model and parameter selection for optical metrology
02/12/2004WO2004013715A1 Method, system, and medium for handling misrepresentative metrology data within an advanced process control system
02/12/2004WO2004013698A1 High-density interconnection of temperature sensitive electronic devices
02/12/2004WO2004013697A2 Micro-contact printing method
02/12/2004WO2004013696A1 Pattern size correcting device and pattern size correcting method
02/12/2004WO2004013695A1 Photomask
02/12/2004WO2004013694A1 Method of forming a rim phase shifting mask and using the rim phase shifting mask to form a semiconductor device
02/12/2004WO2004013674A1 Method and system for correction of intrinsic birefringence in uv microlithography
02/12/2004WO2004013656A2 Uniform thin films produced by magnetorheological finishing
02/12/2004WO2004013381A2 Insoluble anode loop in copper electrodeposition cell for interconnect formation
02/12/2004WO2004013375A1 Installation for the vacuum treatment of substrates
02/12/2004WO2004013371A2 Method and apparatus for plasma implantation without deposition of a layer of byproduct
02/12/2004WO2004013242A2 Polishing slurry system and metal poslishing and removal process
02/12/2004WO2004013038A2 Etch stop control for mems device formation
02/12/2004WO2004012996A1 Automatic refill system for ultra pure or contamination sensitive chemicals
02/12/2004WO2004012896A1 Method and appartus for high volume assembly of radio frequency identification tags
02/12/2004WO2004001841A3 Method and system for realtime critical dimention microloading control
02/12/2004WO2004001797A9 Sensitized chemically amplified photoresist for use in photomask fabrication and semiconductor processing
02/12/2004WO2003103041A3 Semiconductor device and method of manufacturing same
02/12/2004WO2003100843A3 Etching gas and method for dry etching
02/12/2004WO2003096234A3 Optimization of die placement on wafers
02/12/2004WO2003095940A3 Compensation for geometric effects of beam misalignments in plane mirror interferometers
02/12/2004WO2003094234A3 Component
02/12/2004WO2003092337A3 Method and apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates
02/12/2004WO2003090253A8 Single axis manipulator with controlled compliance
02/12/2004WO2003088310A3 Substrate and method for producing a substrate
02/12/2004WO2003086958A3 Method for producing a product having a structured surface
02/12/2004WO2003085674A3 Synthetic-ferrimagnet sense-layer for high density mram applications
02/12/2004WO2003077305B1 Method for making a semiconductor device by variable chemical mechanical polish downforce
02/12/2004WO2003075319A3 Self-aligned transistor and diode topologies
02/12/2004WO2003060977A3 Method for preventing undesirable etching of contact hole sidewalls in a preclean etching step
02/12/2004WO2003052800B1 Semiconductor wafer carrier mapping sensor
02/12/2004WO2003050615A3 Photomask and method for qualifying the same with a prototype specification
02/12/2004WO2003049156A3 System and method for micro electro mechanical etching
02/12/2004WO2003046977A3 Insulation trench for an integrated circuit and method for production thereof
02/12/2004WO2003041157A3 Large area silicon carbide devices and manufacturing methods therefor
02/12/2004WO2003030254A3 Process for assembling systems and structure thus obtained
02/12/2004WO2003030220A3 Method for fabricating a power semiconductor device having a voltage sustaining layer with a terraced trench facilitating formation of floating islands
02/12/2004WO2003029515A3 Formation of composite tungsten films
02/12/2004WO2003026001A3 Integrated equipment set for forming an interconnect on a substrate
02/12/2004WO2003003470A3 Field effect transistor and method for the production thereof
02/12/2004WO2002099881A3 Heatsink assembly and method of manufacturing the same
02/12/2004WO2002091190A3 Memory with a bit line block and/or a word line block for preventing reverse engineering
02/12/2004WO2002076666A3 A laser machining system and method
02/12/2004WO2002075808A3 Self-aligned mram contact and method of fabrication
02/12/2004WO2002062680A9 Conveyorized storage and transportation system
02/12/2004US20040031011 Method for designing interconnects in an LSI
02/12/2004US20040031010 Wire layout design apparatus and method for integrated circuits
02/12/2004US20040031007 Automatic placement and routing apparatus automatically inserting a capacitive cell
02/12/2004US20040031006 Layout data saving method, layout data converting device and graphic verifying device
02/12/2004US20040031005 Electronic cad system and layout data producing method therefor
02/12/2004US20040031004 Semiconductor integrated circuit device and fabrication method thereof
02/12/2004US20040030999 Method and system for debugging using replicated logic
02/12/2004US20040030978 Semiconductor integrated circuit device having operation test function
02/12/2004US20040030517 Descriptor for identifying a defective die site and methods of formation
02/12/2004US20040030437 Process recipe modification in an integrated circuit fabrication apparatus
02/12/2004US20040030430 Waferless metrology recipe generator and generating method
02/12/2004US20040030079 Radiation transparent; bonding strength; lithography
02/12/2004US20040029992 Mixture of polymer and filler
02/12/2004US20040029753 Resist stripping liquid containing fluorine compound
02/12/2004US20040029495 Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
02/12/2004US20040029494 Post-CMP cleaning of semiconductor wafer surfaces using a combination of aqueous and CO2 based cryogenic cleaning techniques
02/12/2004US20040029493 Uniform thin films produced by magnetorheological finishing
02/12/2004US20040029483 Electroluminescent display device manufacturing method
02/12/2004US20040029413 Film material comprising spikes and method for the production thereof
02/12/2004US20040029404 High performance system-on-chip passive device using post passivation process
02/12/2004US20040029403 Method of fabricating annealed wafer
02/12/2004US20040029402 Use of linear injectors to deposit uniform selective ozone TEOS oxide film by pulsing reactants on and off
02/12/2004US20040029401 Organic insulating film forming method, semiconductor device manufacture method, and TFT substrate manufacture method
02/12/2004US20040029400 Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition
02/12/2004US20040029399 Dielectric device and method of manufacturing dielectric device
02/12/2004US20040029398 Methods of forming gate oxide films in integrated circuit devices using wet or dry oxidization processes with reduced chloride
02/12/2004US20040029397 Method for fabricating semiconductor device
02/12/2004US20040029394 Method and structure for preventing wafer edge defocus
02/12/2004US20040029393 Method for removal of residue from a magneto-resistive random access memory (MRAM) film stack using a sacrificial mask layer
02/12/2004US20040029392 Methods using a peroxide-generating compound to remove group VIII metal-containing residue
02/12/2004US20040029391 Method for improving a physical property defect value of a gate dielectric
02/12/2004US20040029390 Method for evaluating a crystalline semiconductor substrate
02/12/2004US20040029389 Method of forming shallow trench isolation structure with self-aligned floating gate
02/12/2004US20040029388 Method and apparatus for dissolving a gas into a liquid for single wet wafer processing