Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2004
02/12/2004US20040029386 Method of patterning inter-metal dielectric layers
02/12/2004US20040029385 Semiconductor substrate with trenches of varying depth
02/12/2004US20040029384 Method and apparatus for production of metal film or the like
02/12/2004US20040029382 Pattering method
02/12/2004US20040029381 Reduction of metal (copper) oxides by vaporation of carboxylic acid from storage tank using a carburetor; uniform electrodes and wirings; cleaning
02/12/2004US20040029380 Method for forming a capping layer on a copper interconnect
02/12/2004US20040029379 Thin film forming method and thin film forming device
02/12/2004US20040029378 Method for forming a silicide film of a semiconductor device
02/12/2004US20040029377 Refractory metal nitride barrier layer with gradient nitrogen concentration
02/12/2004US20040029376 Method for fabricating cobalt salicide contact
02/12/2004US20040029375 Method of planarizing a surface of a semiconductor device and a semiconductor device manufactured according to the same
02/12/2004US20040029374 Compact semiconductor structure and method for producing the same
02/12/2004US20040029373 Method of manufacturing semiconductor device
02/12/2004US20040029372 Semiconductor memory devices having contact pads with silicide caps thereon and related methods
02/12/2004US20040029371 Buried digit line stack and process for making same
02/12/2004US20040029370 Memory transistor and methods
02/12/2004US20040029369 Fabrication method of semiconductor integrated circuit device
02/12/2004US20040029368 Hypercontacting
02/12/2004US20040029367 Br2SbCH3 a solid source ion implant and CVD precursor
02/12/2004US20040029365 Methods of fabricating gallium nitride microelectronic layers on silicon layers and gallium nitride microelectronic structures formed thereby
02/12/2004US20040029364 Method of manufacturing device, device, and electronic apparatus
02/12/2004US20040029363 Method for producing semiconductor device
02/12/2004US20040029362 Method and apparatus for cutting devices from substrates
02/12/2004US20040029360 Wafer-level package with silicon gasket
02/12/2004US20040029359 Methods for fabricating a substrate
02/12/2004US20040029358 Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same
02/12/2004US20040029357 Method for fabricating and identifying integrated circuits and self-identifying integrated circuits
02/12/2004US20040029355 Semiconductor device and method for fabricating the same
02/12/2004US20040029354 Methods for manufacturing stacked gates including oxide/nitride/oxide (ono) interlayer dielectrics using pre-annealing and/or post-annealing in nitrogen
02/12/2004US20040029353 Method of forming a shallow trench isolation structure featuring a group of insulator liner layers located on the surfaces of a shallow trench shape
02/12/2004US20040029352 Triple oxide fill for trench isolation
02/12/2004US20040029350 Process for optimizing junctions formed by solid phase epitaxy
02/12/2004US20040029349 Methods of fabricating a MOSFET
02/12/2004US20040029348 Method for forming silicide wires in a semiconductor device
02/12/2004US20040029347 Methods of code programming a mask rom
02/12/2004US20040029346 DRAM with vertical transistor and trench capacitor memory cells and method of fabrication
02/12/2004US20040029345 Damascene architecture electronics storage and method for making same
02/12/2004US20040029344 Transmission circuit and manufacture method for the same
02/12/2004US20040029343 Method for patterning ceramic layers
02/12/2004US20040029342 Self-aligned trench-type dram strucutre and its manufacturing methods
02/12/2004US20040029341 Gap diode device
02/12/2004US20040029340 Sample preparation apparatus and method
02/12/2004US20040029339 Plasma processing apparatus and plasma processing method
02/12/2004US20040029338 Semiconductor device and method of fabricating the same
02/12/2004US20040029336 Bonding methods and articles produced thereby
02/12/2004US20040029335 Novel set of three level concurrent word line bias conditions for a NOR type flash memory array
02/12/2004US20040029334 Method for passivating a semiconductor substrate
02/12/2004US20040029333 Polishing device and method of manufacturing semiconductor device
02/12/2004US20040029332 Semiconductor device and method of manufacturing the same
02/12/2004US20040029331 Conductive structure for microelectronic devices and methods of fabricating such structures
02/12/2004US20040029330 Ohmic metal contact and channel protection in GaN devices using an encapsulation layer
02/12/2004US20040029329 Method for transferring and stacking of semiconductor devices
02/12/2004US20040029328 Methods for forming dual gate oxides
02/12/2004US20040029327 Semiconductor device with an improved gate electrode pattern and a method of manufacturing the same
02/12/2004US20040029326 Thin-film transistors formed on a flexible substrate
02/12/2004US20040029325 Method for making a soi semiconductor substrate with thin active semiconductor layer
02/12/2004US20040029324 Method for fabricating semiconductor device by forming damascene interconnections
02/12/2004US20040029323 Semiconductor device and method for fabricating the same
02/12/2004US20040029322 Method of forming a memory transistor comprising a Schottky contact
02/12/2004US20040029321 Method for forming gate insulating layer having multiple dielectric constants and multiple equivalent oxide thicknesses
02/12/2004US20040029320 Method to fabricate elevated source/drain structures in mos transistors
02/12/2004US20040029319 Method to remove an oxide seam along gate stack edge, when nitride space formation begins with an oxide liner surrounding gate stack
02/12/2004US20040029318 A substrate having a wiring comprises a plurality of recesses arranged in a direction crossing the longitudinal direction of the wiring, and wherein the thickness of the wiring is 30 nm or more at the bottom of each of the plurality of recesses; noncracking; antipeeling agents
02/12/2004US20040029317 Semiconductor device production method and semiconductor device
02/12/2004US20040029316 Method for assembling planar workpieces
02/12/2004US20040029315 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
02/12/2004US20040029314 Semiconductor device and manufacturing method thereof
02/12/2004US20040029311 Methods of and device for encapsulation and termination of electronic devices
02/12/2004US20040029310 Organic field-effect transistor (ofet), a production method therefor, an integrated circut constructed from the same and their uses
02/12/2004US20040029308 Method for manufacturing contact structures of wirings
02/12/2004US20040029307 Method for manufacturing electronic circuits integrated on a semiconductor substrate
02/12/2004US20040029306 Method of search and identify reference die
02/12/2004US20040029300 Semiconductor processing system and method of transferring workpiece
02/12/2004US20040029299 Dynamic targeting for a process control system
02/12/2004US20040029298 Ferroelectric memory cell and corresponding manufacturing method
02/12/2004US20040029297 Directed assembly of nanometer-scale molecular devices
02/12/2004US20040029296 Magnetoresistive memory and method of manufacturing the same
02/12/2004US20040029065 Device for thermal treatment of substrates
02/12/2004US20040029052 Method of forming fine patterns using silicon oxide layer
02/12/2004US20040029051 Stripping agent composition and method of stripping
02/12/2004US20040029050 Computer control; coating semiconductor substrate with photoresist; circuit pattern; doping with phosphorus
02/12/2004US20040029049 Layout of windows and blocking strips; masking read only memory
02/12/2004US20040029041 Lithography; curable thermoplastic resin; transferring patterns
02/12/2004US20040029036 Solvents and photoresist compositions for 193 nm imaging
02/12/2004US20040029028 Window between pattern layout; projecting laser beams; determination, calibration reflection
02/12/2004US20040029027 Adjustment, varying focusing, dosage; projecting pattern; coating with poassivation layer; uniform etching, development, oxidation, cleaning
02/12/2004US20040029026 Supplying gas to substrate; conveying substrate; development photoresist
02/12/2004US20040029025 Method for exposing at least one or at least two semiconductor wafers
02/12/2004US20040029024 Reflective masking; dividing pattern forming using light wavelength; photolithography; miniatruizing circuit
02/12/2004US20040029023 Photomask, productyion method of the same, pattern forming method using the photomask
02/12/2004US20040029021 Method of forming a rim phase shifting mask and using the rim phase shifting mask to form a semiconductor device
02/12/2004US20040028952 Hafnium oxide mixture; crystal structure
02/12/2004US20040028916 Fluorine-free plasma curing process for porous low-k materials
02/12/2004US20040028915 Silica-based organic film and method of manufacturing the same, and base material comprising organic film
02/12/2004US20040028882 Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof
02/12/2004US20040028828 Porous siliceous film having low permittivity, semiconductor devices and coating composition
02/12/2004US20040028821 Cyclization of polyhydroxylamide by heating; electronics
02/12/2004US20040028811 Bismuth titanium silicon oxide, bismuth titanium silicon oxide thin film, and method for forming the thin film
02/12/2004US20040028809 Applying zeolite
02/12/2004US20040028327 Monolithic three-dimensional structures