Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2004
02/12/2004DE10234589A1 Layer system used in the production of micro-electromechanical structures comprises a passivating layer consisting of an inorganic partial layer and a polymeric partial layer formed on a silicon layer
02/12/2004DE10234165A1 Verfahren zum Füllen einer in einer Materialschicht gebildeten Öffnung mit einem isolierenden Material A method for filling an aperture with an insulating material formed in a material layer
02/12/2004DE10233641A1 Circuit and process for connecting an integrated circuit to a substrate in chip size and wafer level packages uses a frame and elastic contact between electrical contacts
02/12/2004DE10233607A1 Semiconductor chip and carrier are connected by wire with nail head contact points and a wedge and through contact on the carrier
02/12/2004DE10233421A1 Forming dual-implanted gate
02/12/2004DE10232941A1 Motor vehicle sensor protection circuit for protection of sensors with a lower voltage supply than that of the vehicle power supply, comprises a current measurement unit linked to a current limiter or switch
02/12/2004DE10232938A1 Verfahren zur Herstellung einer vergrabenen Bitleitung für einen Halbleiterspeicher A process for producing a buried bit line for a semiconductor memory
02/12/2004DE10232914A1 Wiederverwendbarer Trägerwafer und Verfahren zur Herstellung desselben A reusable carrier wafer and method for manufacturing the same
02/12/2004DE10232636A1 Verfahren und Klebstoff zur Flip-Chip-Kontaktierung The method and adhesive for flip-chip bonding
02/12/2004DE10232478A1 Wafer lifting device for semiconductor electronics and chip production and testing has guides for lifting pins which are attached to the wafer holder
02/12/2004DE10232469A1 Transport container system esp. for micro systems components has stacker with carrier unit moved between compact transport and expanded handling position, by varying distances between stacked part carriers
02/12/2004DE10231966A1 Field effect transistor used as control transistor comprises a doped channel region, doped connecting regions, a control region, and an electrical insulating region arranged between the control region and the channel region
02/12/2004DE10231965A1 Verfahren zur Herstellung einer T-Gate-Struktur sowie eines zugehörigen Feldeffekttransistors A method for preparing a T-gate structure as well as of an associated field effect transistor
02/12/2004DE10228770A1 Dielektrikum mit Sperrwirkung gegen Kupferdiffusion Dielectric barrier action against copper diffusion
02/12/2004DE10164175B4 Prozeßgerät mit zwei Raumeinheiten und einer die zwei Raumeinheiten verbindenden dritten Raumeinheit mit jeweils einer gegenüber der Umgebung verminderten Dichte kontaminierter Teilchen und Verfahren zum Betrieb des Prozeßgerätes Process device with two room units and connecting the two room units of a third unit space, each having a reduced density relative to the environment contaminated particles and method of operation of the process device
02/12/2004DE10151700B4 Feldeffekt-Halbleiterbauelement und zugehöriges Herstellungsverfahren Field-effect semiconductor device and manufacturing method thereof
02/12/2004CA2494487A1 Method and apparatus for high volume assembly of radio frequency identification tags
02/12/2004CA2450611A1 Method of creating a high performance organic semiconductor device
02/11/2004EP1388907A1 Broadband planar coupled spiral balun
02/11/2004EP1388897A1 Thin film transistor and active matrix type display unit production methods therefor
02/11/2004EP1388896A1 Memory of silicon on insulator type
02/11/2004EP1388895A2 System and method to reduce noise in a substrate
02/11/2004EP1388892A2 A triple gate oxide process with high-gate dielectric
02/11/2004EP1388891A1 System and method for heat treating semiconductor
02/11/2004EP1388890A1 Method for manufacturing electronic component
02/11/2004EP1388889A2 Method to form a gate insulator layer comprised with multiple dielectric constants and multiple thicknesses
02/11/2004EP1388888A1 Combination differential and absolute pressure transducer for load lock control
02/11/2004EP1388884A2 Electron beam proximity exposure apparatus
02/11/2004EP1388882A2 Particle-optical systems
02/11/2004EP1388810A2 Radio frequency identification device and reader therefor
02/11/2004EP1388548A2 Interlayer insulating film, method for forming the same and polymer composition
02/11/2004EP1388376A2 Cleaning using CO2 and N2O
02/11/2004EP1388179A1 Switching element having memory effect
02/11/2004EP1388173A2 Non-volatile memory cells utilizing substrate trenches
02/11/2004EP1388172A1 Eeprom cell with asymmetric thin window
02/11/2004EP1388168A2 Method for producing an electronic component, especially a memory chip
02/11/2004EP1388167A2 Method of removing oxide from copper bond pads
02/11/2004EP1388166A1 Production method for a semiconductor component
02/11/2004EP1388165A2 Substrate transport container
02/11/2004EP1388164A2 Apparatus and method for substrate preparation implementing a surface tension reducing process
02/11/2004EP1388163A2 Device for loading and unloading silicon wafers in an oven from a multiple-cassette station
02/11/2004EP1388162A1 Universal backplane assembly and methods
02/11/2004EP1388159A1 Magnetic mirror plasma source
02/11/2004EP1388027A1 Photoresist composition for deep ultraviolet lithography
02/11/2004EP1388026A1 Use of partially fluorinated polymers in applications requiring transparency in the ultraviolet and vacuum ultraviolet
02/11/2004EP1387898A1 Substituted cycloalkene new copper precursors for chemical vapor deposition of copper metal thin films
02/11/2004EP1387808A1 Device for gripping and holding an object in a contactless manner
02/11/2004EP1387807A1 Integrated substrate handler having pre-aligner and storage pod access mechanism
02/11/2004EP1228526B1 Device for assembly of component supports for microsystems
02/11/2004EP1214174B1 Windowless belt and method for in-situ wafer monitoring
02/11/2004EP1204976B1 Method and apparatus for reading a magnetoresistive memory
02/11/2004EP1190122B1 Method and apparatus for epitaxially growing a material on a substrate
02/11/2004EP1082764B1 Semiconductor current-switching device having operational enhancer and method therefor
02/11/2004EP1066555B1 Integration of security modules in an integrated circuit
02/11/2004EP0910869B1 A METHOD FOR PRODUCING A CHANNEL REGION LAYER IN A SiC-LAYER FOR A VOLTAGE CONTROLLED SEMICONDUCTOR DEVICE
02/11/2004EP0882308B1 Optimizing the power connection between chip and circuit board for a power switch
02/11/2004EP0813748B1 Multilayered electrostatic chuck and method of manufacture thereof
02/11/2004EP0786071B1 On-axis mask and wafer alignment system
02/11/2004EP0691034B1 Bipolar transistor structure using ballast resistor
02/11/2004EP0645806B1 Semiconductor device
02/11/2004CN2603508Y Chip structure
02/11/2004CN2603401Y Automatic electronic component detection equipment
02/11/2004CN1475036A Solid embossing of polymer devices
02/11/2004CN1475034A Semiconductor device with reduced line-to-line capacitance and cross talk noise
02/11/2004CN1475032A Method of forming shallow trench isolation in silicon
02/11/2004CN1475031A FET with notched gate and method of manufacturing same
02/11/2004CN1475029A Method for producing semiconductor device
02/11/2004CN1475027A Semiconductor structure having high dielectric constant material
02/11/2004CN1475026A Apparatuses and methods for resistively heating thermal processing system
02/11/2004CN1475014A Integrated magnetoresistive semiconductor memory system
02/11/2004CN1474962A Method for forming pattern and treating agent for use therein
02/11/2004CN1474960A Lithographic method of manufacturing device
02/11/2004CN1474752A Polymer anti-reflective coatings deposited by plasma enhanced chemical vapor deposition
02/11/2004CN1474734A Method of chemical polishing
02/11/2004CN1474507A Output and input circuit, electronic circuit, multipath multiplexer and de-multiplexer
02/11/2004CN1474485A 激光二极管 Laser diode
02/11/2004CN1474466A Laminous element and its producing method
02/11/2004CN1474460A Novel metal semiconductor field effect transistor (MESFET) device and its producing process
02/11/2004CN1474459A Semiconductor device with high structure reliability and low parasitic capacitance
02/11/2004CN1474458A Single-electron storage designed based on coulomb damping principle and its preparing method
02/11/2004CN1474457A Non-volatile semiconductor storage device
02/11/2004CN1474454A Integrated circuit structure with metal-metal capacitors and its forming method
02/11/2004CN1474452A 半导体器件 Semiconductor devices
02/11/2004CN1474449A Operation method of silion nitride read-only memory element
02/11/2004CN1474447A Method for preparing capacitor in semiconductor assembly
02/11/2004CN1474446A Aligning device for concentric circles
02/11/2004CN1474445A Evaluating method for semiconductor crystal chip
02/11/2004CN1474444A Simply up-graded high capacity type semiconductor wafer test set
02/11/2004CN1474443A Pressure welding method and pressure welding device
02/11/2004CN1474442A lead key closing method and salient point forming method and salient
02/11/2004CN1474441A Bottom layer packing and sealing treatment in assembling flip chip and its device
02/11/2004CN1474440A Method for preparing transistor by full automatic alignment prcess
02/11/2004CN1474439A Method for reducing cracking and deformation of copper wire
02/11/2004CN1474438A Dielectric structure between metal layers
02/11/2004CN1474437A Method for producing p-type III nitride material
02/11/2004CN1474436A Semiconductor device with self-aligning section contact hole and its producing method
02/11/2004CN1474434A Method for producing silicon nano wire
02/11/2004CN1474411A Stable semiconductor storage device with pseudo storage unit
02/11/2004CN1474355A Semiconductor device and its information reader
02/11/2004CN1474308A Preserving method of layout data, layout data changer and figure detector