| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/12/2004 | US20040026713 Semiconductor device with high structural reliability and low parasitic capacitance |
| 02/12/2004 | US20040026708 Sub-mount for high power light emitting diode |
| 02/12/2004 | US20040026704 III-V compound semiconductor device with an AIxByInzGa1-x-y-zN1-a-bPaAsb non-continuous quantum dot layer |
| 02/12/2004 | US20040026701 Group 4 nitride; reducing electrical resistance |
| 02/12/2004 | US20040026700 Light emitting element and manufacturing method for the same |
| 02/12/2004 | US20040026697 Four terminal memory cell, a two-transistor SRAM cell, a SRAM array, a computer system, a process for forming a SRAM cell, a process for turning a SRAM cell off, a process for writing a SRAM cell and a process for reading data from a SRAM cell |
| 02/12/2004 | US20040026696 Semiconductor element and semiconductor device using the same |
| 02/12/2004 | US20040026694 Storage device, especially for the intermediate storage of test wafers |
| 02/12/2004 | US20040026692 Semiconductor apparatus and process for its production |
| 02/12/2004 | US20040026687 Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions |
| 02/12/2004 | US20040026634 Electron beam proximity exposure apparatus |
| 02/12/2004 | US20040026633 Inspection method and inspection apparatus using electron beam |
| 02/12/2004 | US20040026629 Emission source having carbon nanotube, electron microscope using this emission source, and electron beam drawing device |
| 02/12/2004 | US20040026627 Electron beam monitoring sensor and electron beam monitoring method |
| 02/12/2004 | US20040026598 Adjustable support leg for semiconductor device manufacturing equipment |
| 02/12/2004 | US20040026580 Adjustable support leg for semiconductor device manufacturing equipment |
| 02/12/2004 | US20040026519 Semiconductor devices and manufacturing method therefor and electronic commerce method and transponder reader |
| 02/12/2004 | US20040026515 Descriptor for identifying a defective die site and methods of formation |
| 02/12/2004 | US20040026486 Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
| 02/12/2004 | US20040026484 Multi-functional solder and articles made therewith, such as microelectronic components |
| 02/12/2004 | US20040026483 Methods for lead penetrating clamping system |
| 02/12/2004 | US20040026480 Wire bonding method, method of forming bump and bump |
| 02/12/2004 | US20040026479 Continuous mode solder jet apparatus |
| 02/12/2004 | US20040026478 Bondhead lead clamp apparatus |
| 02/12/2004 | US20040026403 Ceramic heater for semiconductor manufacturing and inspecting devices |
| 02/12/2004 | US20040026402 Ceramic heater for semiconductor manufacturing and inspecting equipment |
| 02/12/2004 | US20040026400 LED heat lamp arrays for CVD heating |
| 02/12/2004 | US20040026386 Method for improving ash rate uniformity in photoresist ashing process equipment |
| 02/12/2004 | US20040026382 Using laser water jets; silicon wafer adhesively bonded to carrier using radiation transparent adhesive |
| 02/12/2004 | US20040026374 Assembly line processing method |
| 02/12/2004 | US20040026371 Two-compartment chamber for sequential processing method |
| 02/12/2004 | US20040026364 Method of etching dual damascene structure |
| 02/12/2004 | US20040026361 Surface acoustic wave device its manufacturing method and electronic circuit device |
| 02/12/2004 | US20040026358 Method for producing defined polycrystalline silicon areas in an amorphous silicon layer |
| 02/12/2004 | US20040026257 Methods and apparatus for improved current density and feature fill control in ECD reactors |
| 02/12/2004 | US20040026255 Plating substrate; electrolytic cell containing ion exchanging membrane |
| 02/12/2004 | US20040026121 Transistors; light emitting diodes; adjusting organic polymer using base or oxidizer |
| 02/12/2004 | US20040026119 Semiconductor device having amorphous barrier layer for copper metallurgy |
| 02/12/2004 | US20040026107 Electronic devices incorporating electrical interconnections with improved reliability and methods of fabricating same |
| 02/12/2004 | US20040026044 Method and apparatus for application of adhesive tape to semiconductor devices |
| 02/12/2004 | US20040026041 Semiconductor-processing reaction chamber |
| 02/12/2004 | US20040026040 Plasma processing apparatus |
| 02/12/2004 | US20040026039 Microwave plasma processing apparatus, microwave processing method and microwave feeding apparatus |
| 02/12/2004 | US20040026038 Plasma treatment apparatus |
| 02/12/2004 | US20040026037 Device and method for processing substrate |
| 02/12/2004 | US20040026036 Substrate processing apparatus and substrate processing method |
| 02/12/2004 | US20040026031 Methods and apparatus for fluidic self assembly |
| 02/12/2004 | US20040026019 Method and device for carrying out working steps on miniaturised modules |
| 02/12/2004 | US20040026006 Chip mounting device and callibration method therein |
| 02/12/2004 | US20040025983 Method of manufacturing silicon |
| 02/12/2004 | US20040025911 Apparatus for cleaning a semiconductor substrate by vibrating cleaning solution supplied onto the substrate |
| 02/12/2004 | US20040025908 Supercritical fluid delivery system for semiconductor wafer processing |
| 02/12/2004 | US20040025904 Methods and compositions for removing group VIII metal-containing materials from surfaces |
| 02/12/2004 | US20040025901 Stationary wafer spin/spray processor |
| 02/12/2004 | US20040025790 Apparatus for supplying cooling gas in semiconductor device manufacturing equipment |
| 02/12/2004 | US20040025789 CVD process capable of reducing incubation time |
| 02/12/2004 | US20040025788 Plasma processing device and exhaust ring |
| 02/12/2004 | US20040025787 System for depositing a film onto a substrate using a low pressure gas precursor |
| 02/12/2004 | US20040025782 Process for producing low defect density, ideal oxygen precipitating silicon |
| 02/12/2004 | US20040025733 EUV lithographic projection apparatus comprising an optical element with a self-assembled monolayer, optical element with a self-assembled monolayer, method of applying a self-assembled monolayer, device manufacturing method and device manufactured thereby |
| 02/12/2004 | US20040025605 Clamping element with an integrated force sensor |
| 02/12/2004 | US20040025444 Mixture of oxidizer and abrasive; activation free radicals; for semiconductors, integrated circuits |
| 02/12/2004 | DE20317166U1 Sealable container, especially SMIF box for silicon wafers, has slanting surfaces on struts for pushing goods back into holder device when container is closed |
| 02/12/2004 | DE19843959B4 Verfahren zum Herstellen eines Halbleiterbauelements mit einem sperrenden pn-Übergang A method of manufacturing a semiconductor device having a blocking pn junction |
| 02/12/2004 | DE19841996B4 Halbleiterbauelement im Chip-Format und Verfahren zu seiner Herstellung A semiconductor device in chip format and process for its preparation |
| 02/12/2004 | DE19819039B4 Halbleiterspeichervorrichtung A semiconductor memory device |
| 02/12/2004 | DE19756929B4 Zellenarray und Leseverstärkerstruktur mit verbesserten Rauscheigenschaften und verringerter Größe Cell array and sense amplifier structure with improved noise characteristics and reduced size |
| 02/12/2004 | DE19730864B4 Neuronen-MOS-Transistor und Verfahren zu seiner Ausbildung Neuron MOS transistor and method of training |
| 02/12/2004 | DE19721114B4 Verfahren zum Erzeugen einer Oxidschicht auf Siliciumcarbid und Verwendung des Verfahrens A method of producing an oxide layer on silicon carbide and using the method |
| 02/12/2004 | DE19706763B4 Verfahren zum Ätzen einer Metallschicht A method for etching a metal layer |
| 02/12/2004 | DE19636288B4 Verfahren zur Plasmaätzung bei der Herstellung eines Halbleiterbauelements A method of plasma etching in the manufacture of a semiconductor device |
| 02/12/2004 | DE19500655B4 Chipträger-Anordnung zur Herstellung einer Chip-Gehäusung Chip carrier assembly for producing a chip-Gehäusung |
| 02/12/2004 | DE10335096A1 Maskenlose Mittellinien-Belag-Aufbringung Maskless Axis lining application |
| 02/12/2004 | DE10332914A1 Continuous process and device for thermal diffusion in semiconductor and solar cell production transports workpieces through tube on stacked short carriers |
| 02/12/2004 | DE10332155A1 Quality control method for checking silicon wafers for surface smoothness by subdivision of the wafer into overlapping areas and determination of a thickness representing normal vector for each area |
| 02/12/2004 | DE10331826A1 Transflektives Flüssigkristalldisplay und Verfahren zur Herstellung desselben A transflective liquid crystal display and method of manufacturing the same |
| 02/12/2004 | DE10331195A1 Verfahren für ein verbessertes epitaktisches Wiederaufwachsen amorpher Polysilizium-CB-Kontakte Method for an improved epitaxial regrowth of amorphous poly-CB contacts |
| 02/12/2004 | DE10331033A1 Cleaning composition, used for removing resist or residues of resist or from dry etching in semiconductor device production, contains fluoride of non-metal base, water-soluble organic solvent, acid and water |
| 02/12/2004 | DE10330901A1 Electrostatic fixing element, used in semiconductor lithography, in vacuum deposition devices and in clean rooms, has an electrically conducting electrode structure formed between a dielectric upper part and a body |
| 02/12/2004 | DE10322742A1 Halbleitervorrichtung Semiconductor device |
| 02/12/2004 | DE10318412A1 Halbleitervorrichtung mit einem Kondensator mit MIM-Aufbau A semiconductor device having a MIM capacitor having a structure |
| 02/12/2004 | DE10317924A1 Layoutentwurfsverfahren und System zum Liefern einer Umgehungskapazität und einer konformen Dichte in einer integrierten Schaltung Layout design method and system for providing a by-pass capacity and a conformal density in an integrated circuit |
| 02/12/2004 | DE10315246A1 Halbleiter-Speichermodul A semiconductor memory module |
| 02/12/2004 | DE10310074A1 Halbleitervorrichtung und Verfahren zur Herstellung der Halbleitervorrichtung A semiconductor device and method of manufacturing the semiconductor device |
| 02/12/2004 | DE10300765A1 Semiconductor device pattern formation comprises performing etching process of formed antireflective films to form micro-bends, and coating photoresist above anti-reflective films with micro-bends, and exposing coated films to light source |
| 02/12/2004 | DE10246830A1 Production of a wiring surface on a semiconductor wafer for producing a circuit board comprises applying an insulating layer on a wafer, structuring to form strip conductor trenches, depositing a barrier layer, and further processing |
| 02/12/2004 | DE10235455A1 Magnetic field particle optical device for using a magnetic field to deflect charged particles in a beam has a magnetic-flux-conducting body, a current conductor and a temperature moderator |
| 02/12/2004 | DE10235074A1 Vertical field effect power transistor used as a trench gate DMOS transistor has source regions formed vertically to the surface of the silicon wafer by the polysilicon filling height of the trench |
| 02/12/2004 | DE10235020A1 Device for etching large surface semiconductor wafers in a trough-shaped receiver containing a liquid electrolyte used in semiconductor manufacture comprises a testing head provided with a device for holding at least one wafer |
| 02/12/2004 | DE10234998A1 Method of cleaning semiconductor substrate, especially silicon wafer, uses sequence giving hydrophobic surface, then cleaning with aqueous solution of organic nitrogen base giving hydrophilic surface and rinsing |
| 02/12/2004 | DE10234978A1 Surface-mounted semiconductor component used in the production of luminescent diodes in mobile telephone keypads comprises a semiconductor chip, external electrical connections, and a chip casing |
| 02/12/2004 | DE10234976A1 Surface emitting semiconductor laser chip comprises a semiconductor body having a crystal structure with main directions, a radiation collision surface and side surfaces laterally delimiting the semiconductor body |
| 02/12/2004 | DE10234956A1 Verfahren zum Steuern des chemisch mechanischen Polierens von gestapelten Schichten mit einer Oberflächentopologie A method for controlling the chemical mechanical polishing of stacked layers with a surface topology |
| 02/12/2004 | DE10234951A1 Production of a semiconductor module used e.g. in computers comprises applying a structured connecting layer on a substrate, applying active and/or passive switching units, connecting using a filler and applying electrical connecting units |
| 02/12/2004 | DE10234943A1 Process and device for semiconductor wafers especially for laser fuses has rotational and position detecting device on the wafer support and the tool mount |
| 02/12/2004 | DE10234735A1 Structurization of process area inclined or perpendicular to substrate surface, used in trench in semiconductor, especially in capacitor production, involves depositing liner of uniform thickness from precursors only in upper part |
| 02/12/2004 | DE10234734A1 Processing a surface used in the production of transistors and capacitors comprises covering first sections of the surface with a metal oxide, forming second sections and modifying the surface exposed in the second sections |
| 02/12/2004 | DE10234699A1 Production of a trench isolation in a semiconductor component comprises forming a trench in the substrate, depositing a semiconductor layer in the trench, converting partially into an oxide and filling with an insulating material |
| 02/12/2004 | DE10234694A1 Oxidizing a layer comprises inserting the substrate carrying a layer stack into a heating unit, feeding an oxidation gas onto the substrate, heating to a process temperature, and regulating or controlling the temperature |
| 02/12/2004 | DE10234659A1 Connecting arrangement used in a chip card comprises an integrated electronic component with contact surfaces electrically insulated from each other, a switching circuit support and electrically conducting connections |