Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2004
02/17/2004US6693043 Method for removing photoresist from low-k films in a downstream plasma system
02/17/2004US6693042 Method for etching a dielectric layer formed upon a barrier layer
02/17/2004US6693041 Self-aligned STI for narrow trenches
02/17/2004US6693040 Method for cleaning the contact area of a metal line
02/17/2004US6693039 Process for forming a buried cavity in a semiconductor material wafer and a buried cavity
02/17/2004US6693038 Method for forming electrical contacts through multi-level dielectric layers by high density plasma etching
02/17/2004US6693036 Method for producing semiconductor device polishing apparatus, and polishing method
02/17/2004US6693035 Methods to control film removal rates for improved polishing in metal CMP
02/17/2004US6693034 Deadhesion method and mechanism for wafer processing
02/17/2004US6693033 Method of removing an amorphous oxide from a monocrystalline surface
02/17/2004US6693032 Method of forming a contact structure having an anchoring portion
02/17/2004US6693031 Formation of a metallic interlocking structure
02/17/2004US6693030 Reactive preclean prior to metallization for sub-quarter micron application
02/17/2004US6693029 Method of forming an insulative substrate having conductive filled vias
02/17/2004US6693028 Semiconductor device having multilayer wiring structure and method for manufacturing the same
02/17/2004US6693026 Semiconductor device and method for fabricating the same
02/17/2004US6693025 Local interconnect structures for integrated circuits and methods for making the same
02/17/2004US6693024 Semiconductor component with a semiconductor body having a multiplicity of pores and method for fabricating
02/17/2004US6693023 Ion implantation method and ion implantation equipment
02/17/2004US6693022 CVD method of producing in situ-doped polysilicon layers and polysilicon layered structures
02/17/2004US6693021 GaN single crystal substrate and method of making the same
02/17/2004US6693020 Method of preparing copper metallization die for wirebonding
02/17/2004US6693019 Method of manufacturing an electronic power device monolithically integrated on a semiconductor and comprising a first power region, a second region, and an isolation structure of limited planar dimension
02/17/2004US6693018 Method for fabricating DRAM cell transistor having trench isolation structure
02/17/2004US6693017 MIMcap top plate pull-back
02/17/2004US6693016 Method of fabricating a trench-structure capacitor device
02/17/2004US6693015 Method for improved processing and etchback of a container capacitor
02/17/2004US6693014 Method of improving static refresh
02/17/2004US6693013 Semiconductor transistor using L-shaped spacer and method of fabricating the same
02/17/2004US6693012 Method and device to reduce gate-induced drain leakage (GIDL) current in thin gate oxide MOSFETs
02/17/2004US6693011 Power MOS element and method for producing the same
02/17/2004US6693010 Split gate memory cell with a floating gate in the corner of a trench
02/17/2004US6693009 Flash memory cell with minimized floating gate to drain/source overlap for minimizing charge leakage
02/17/2004US6693008 Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit device
02/17/2004US6693007 Methods of utilizing a sacrificial layer during formation of a capacitor
02/17/2004US6693006 Method for increasing area of a trench capacitor
02/17/2004US6693005 Trench capacitor with expanded area and method of making the same
02/17/2004US6693004 Interfacial barrier layer in semiconductor devices with high-K gate dielectric material
02/17/2004US6693003 Semiconductor device and manufacturing method of the same
02/17/2004US6693002 Semiconductor device and its manufacture
02/17/2004US6693000 Semiconductor device and a method for forming patterns
02/17/2004US6692999 Polysilicon film forming method
02/17/2004US6692998 Integrated high quality diode
02/17/2004US6692997 Thin film transistors with dual layered source/drain electrodes and manufacturing method thereof, and active matrix display device and manufacturing method thereof
02/17/2004US6692996 Active layer of a thin film transistor can be crystallized into single crystalline silicon by filtering a crystal component having a uniform crystal orientation from a poly-crystal region
02/17/2004US6692995 Physically deposited layer to electrically connect circuit edit connection targets
02/17/2004US6692991 Resin-encapsulated semiconductor device and method for manufacturing the same
02/17/2004US6692990 Method for manufacturing a semiconductor device
02/17/2004US6692989 Plastic molded type semiconductor device and fabrication process thereof
02/17/2004US6692988 Method of fabricating a substrate-based semiconductor package without mold flash
02/17/2004US6692983 Method of forming a color filter on a substrate having pixel driving elements
02/17/2004US6692982 Optical semiconductor integrated circuit device and manufacturing method for the same
02/17/2004US6692981 Interposing an intermediate layer containing p or n type impurity between a silicon thin film and a substrate, subjecting part/all of structure to heat treatment to diffuse impurity from intermediate layer into silicon thin film to
02/17/2004US6692978 Methods for marking a bare semiconductor die
02/17/2004US6692976 Post-etch cleaning treatment
02/17/2004US6692951 Protein particle for use as genetic engineering tool in expression of heterologous proteins in bacillus
02/17/2004US6692903 Substrate cleaning apparatus and method
02/17/2004US6692901 Method for fabricating a resist pattern, a method for patterning a thin film and a method for manufacturing a micro device
02/17/2004US6692898 Self-aligned conductive line for cross-point magnetic memory integrated circuits
02/17/2004US6692894 Composite film for near field light generation having nonlinear optical material such as antimony sandwiched between two dielectric layers; rapid formation; reuse
02/17/2004US6692893 Onium salts, photoacid generators, resist compositions, and patterning process
02/17/2004US6692892 Composition for antireflection coating
02/17/2004US6692891 Semiconductor
02/17/2004US6692884 Sulfonium, n-hydroxyimidesulfonate or a disulfonyldiazomethane acid generator; and a resin capable of decomposing by the action of an acid to increase the solubility in an alkali developing solution
02/17/2004US6692877 Mask for beam exposure having membrane structure and stencil structure and method for manufacturing the same
02/17/2004US6692833 By chemical vapor deposition on a non-conductive substrate using as precursor a metal halide and/or organometallic compound and a reducing agent; allows another metal conducting layer to be deposited by electrolysis
02/17/2004US6692795 Method for fabricating semiconductor device having ruthenium layer and equipment for fabricating the same
02/17/2004US6692649 Inductively coupled plasma downstream strip module
02/17/2004US6692648 Method of plasma heating and etching a substrate
02/17/2004US6692633 Of aluminum metallization layer; installing a dicing blade having a sacrificial anode, flooding the work surface with cooling high purity water solution, dicing the wafer
02/17/2004US6692629 Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer
02/17/2004US6692622 Plasma processing apparatus with an electrically conductive wall
02/17/2004US6692617 Sustained self-sputtering reactor having an increased density plasma
02/17/2004US6692613 Reactor for processing a semiconductor wafer
02/17/2004US6692610 Oled packaging
02/17/2004US6692588 Rinsing with mineral acids and deionized water; plated semiconductors
02/17/2004US6692580 Method of cleaning a dual damascene structure
02/17/2004US6692579 Vapor phase condensation with a thermally vaporized cleaning agent, a hydrocarbon vaporized by pressure variation, or a combination of the two
02/17/2004US6692576 Wafer support system
02/17/2004US6692569 A-site-and/or b-site-modified pbzrtio3 materials and (pb, sr, ca, ba, mg) (zr, ti,nb, ta)o3 films having utility in ferroelectric random access memories and high performance thin film microactuators
02/17/2004US6692568 Sputtering a group iii metal in a nitrogen or ammonia environment and depositing it on a growth surface
02/17/2004US6692546 For use in polishing metal films in semiconductor interconnection procedures
02/17/2004US6692342 Wafer abrasive machine
02/17/2004US6692341 Abrasive machine
02/17/2004US6692338 Through-pad drainage of slurry during chemical mechanical polishing
02/17/2004US6692249 Hot liner insertion/removal fixture
02/17/2004US6692221 Method of adhering wafer and wafer adhering device
02/17/2004US6692219 Reduced edge contact wafer handling system and method of retrofitting and using same
02/17/2004US6692165 Substrate processing apparatus
02/17/2004US6692094 Apparatus and method of material deposition using compressed fluids
02/17/2004US6692049 Intelligent integrated circuit wafer handling system with fail safe system
02/17/2004US6691911 Avoiding gold rich phases in the solder by using a solder consisting essentially of from 78 wt % to less than 79.5 wt % gold and the balance tin
02/17/2004US6691876 Semiconductor wafer cassette
02/17/2004US6691726 System and method for using bent pipes in high-purity fluid handling systems
02/17/2004US6691719 Adjustable nozzle for wafer bevel cleaning
02/17/2004US6691718 Wafer container cleaning system
02/17/2004US6691697 Method for cutting thin film filter work pieces
02/17/2004US6691696 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
02/17/2004US6691430 High-pressure drying apparatus, high-pressure drying method and substrate processing apparatus
02/17/2004CA2272653C Laser based method and system for integrated circuit repair or reconfiguration