| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/11/2004 | US20040045866 Packaged radiation sensitive coated workpiece process for making and method of storing same |
| 03/11/2004 | US20040045865 Wafer guides for processing semiconductor substrates |
| 03/11/2004 | US20040045837 Method for treating the surface of object and apparatus thereof |
| 03/11/2004 | US20040045832 Methods for using the solutions and products formed by using such methods and solutions in which the solutions contain copper alkanesulfonate salts and free alkanesulfonic acids, wherein the free acid has a concentration from about 0.05 to |
| 03/11/2004 | US20040045831 Apparatus for electro-chemically depositing a metal onto a substrate. The apparatus generally includes a head assembly having a cathode and a wafer holder disposed above the cathode. The apparatus further includes a process kit disposed |
| 03/11/2004 | US20040045813 Wafer processing apparatus, wafer stage, and wafer processing method |
| 03/11/2004 | US20040045737 Processes for manufacturing flexible wiring boards |
| 03/11/2004 | US20040045679 Sample processing system |
| 03/11/2004 | US20040045675 Plasma etching apparatus |
| 03/11/2004 | US20040045674 Radial antenna and plasma device using it |
| 03/11/2004 | US20040045668 Semiconductor device manufacturing line |
| 03/11/2004 | US20040045667 Laser-driven cleaning using reactive gases |
| 03/11/2004 | US20040045657 Method for forming a multi-layer ceramic electronic device |
| 03/11/2004 | US20040045656 Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package |
| 03/11/2004 | US20040045592 A cleansing apparatus comprising: a table 3 for supporting a semiconductor substrate 30 horizontally; a high frequency solution injector 20 capable of injecting a solution to the upper surface 30a and the side surface 30c of the |
| 03/11/2004 | US20040045589 Method and apparatus for removing a liquid from a surface of a substrate |
| 03/11/2004 | US20040045588 Methods and compositions for etch cleaning microelectronic substrates in carbon dioxide |
| 03/11/2004 | US20040045580 Cleaning method of silicon wafer for obtaining a silicon wafer in which micro roughness thereof under spatial frequency of 20/ mu m is 0.3 to 1.5 nm3 in terms of power spectrum density, by passing a process of oxidizing the silicon wafer with |
| 03/11/2004 | US20040045579 Surface purification apparatus and surface purification method |
| 03/11/2004 | US20040045578 Selective preparation (cleaning and modification) of a critical substrate surface prior to, during, or following manufacturing and assembly operations such as coating, bonding, patterning, sealing, dicing, cutting, drilling, |
| 03/11/2004 | US20040045575 Apparatus and method for processing a substrate |
| 03/11/2004 | US20040045574 Semiconductor fabrication equipment parts includes determining a definition for a clean part including multiple maximum acceptable impurity levels; determining an initial multiple impurity levels of a part prior to its cleaning process and |
| 03/11/2004 | US20040045509 Reduced friction lift pin |
| 03/11/2004 | US20040045507 Apparatus for plasma doping |
| 03/11/2004 | US20040045504 One of the layers is formed from a material produced by a redox reaction occurring in a deposited solution. |
| 03/11/2004 | US20040045503 Method for treating a surface of a reaction chamber |
| 03/11/2004 | US20040045502 Apparatus for and method of processing substrate |
| 03/11/2004 | US20040045499 Source and drain elements |
| 03/11/2004 | US20040045263 Container with an adjustable inside dimension that restricts movement of items within the container |
| 03/11/2004 | US20040045188 Apparatus for drying a substrate using an isopropyl alcohol vapor |
| 03/11/2004 | US20040045185 Apparatus for drying semiconductor wafer using vapor dry method |
| 03/11/2004 | US20040045184 Gas treatment apparatus |
| 03/11/2004 | US20040045157 Flexible wiring boards |
| 03/11/2004 | DE4126216B4 Vorrichtung für Dünnschichtverfahren zur Behandlung großflächiger Substrate Apparatus for thin-film processes for the treatment of large area substrates |
| 03/11/2004 | DE29724788U1 Manufacturing LED with hermetically sealed casing |
| 03/11/2004 | DE20318462U1 Anordnung elektronischer Halbleiterbauelemente auf einem Trägersystem zur Behandlung der Halbleiterbauelemente mit einem flüssigen Medium Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium |
| 03/11/2004 | DE19600300B4 Supraleitende Verdrahtung und diese verwendende Halbleitervorrichtung Superconducting wiring and use this semiconductor device |
| 03/11/2004 | DE10341046A1 Vacuum suction device and operating process for sucking and transporting light objects such as chip elements has valve control of suction and releasing overpressure |
| 03/11/2004 | DE10339717A1 Production of a microstructure, e.g. in the manufacture of semiconductor devices, comprises crosslinking a film with acid released by a resist structure |
| 03/11/2004 | DE10338292A1 Etching metal layer for semiconductor device, comprises etching exposed portions of metal layer with etching gas formed by mixing chlorine and nitrogen |
| 03/11/2004 | DE10338252A1 Semiconductor device comprises an insulating film formed on a semiconductor substrate, a bit line surrounded by the insulating film, and a bit line covering layer protruding from the insulating film |
| 03/11/2004 | DE10328577A1 Nichtflüchtige Speicherzelle und Herstellungsverfahren A non-volatile memory cell, and manufacturing method |
| 03/11/2004 | DE10316567A1 Statische Halbleiterspeichervorrichtung The static semiconductor memory device |
| 03/11/2004 | DE10311316A1 Halbleitereinrichtung mit einer Nitridschicht A semiconductor device comprising a nitride layer |
| 03/11/2004 | DE10244077A1 Production of a semiconductor component used in microelectronics comprises dry etching a hole in the substrate of a component, lining the hole with an insulating layer, removing the insulating layer, and producing an electrical connection |
| 03/11/2004 | DE10241891A1 Electronic switching part for high frequency applications, e.g. a distance radar in a vehicle, comprises an electrical/electronic component with contact elements arranged on a substrate |
| 03/11/2004 | DE10241173A1 Halbleiterspeicher mit vertikalen Speichertransistoren in einer Zellenfeldanordnung mit 1-2F2-Zellen Semiconductor memory with vertical memory transistors in a cell array with 1-2F2 cells |
| 03/11/2004 | DE10241154A1 Integrated switching arrangement comprises a metallization layer, a conducting pathway dielectric, a conducting pathway intermediate material, conducting connecting sections, dielectric, and connecting section intermediate material |
| 03/11/2004 | DE10240771B3 Container for semiconductor discs or flat image screen elements used for transporting discs between successive treatment stations during manufacturing process |
| 03/11/2004 | DE10240460A1 Universelles Halbleitergehäuse mit vorvernetzten Kunststoffeinbettmassen und Verfahren zur Herstellung desselben Of the same semiconductor package with a universal pre-crosslinked Kunststoffeinbettmassen and methods for preparing |
| 03/11/2004 | DE10240449A1 Verfahren zur Herstellung einer dielektrischen Schicht mit geringem Leckstrom, wobei eine erhöhte kapazitive Kopplung erzeugt wird A process for preparing a dielectric layer having a low leakage current, wherein an increased capacitive coupling is generated |
| 03/11/2004 | DE10240116A1 Production of a layer with a high melting metal nitride used in the production of local connecting barrier layers in metal connecting structures of integrated circuits |
| 03/11/2004 | DE10240115A1 Verfahren und System zum Handhaben von Substraten in einer Produktionslinie mit einer Cluster-Anlage und einer Messanlage Method and system for handling substrates in a production line with a cluster system and a measuring system |
| 03/11/2004 | DE10240114A1 Verfahren zur Reduzierung eines Defektpegels nach dem chemisch mechanischen Polieren eines Kupfer enthaltenden Substrats durch Spülen des Substrats mit einer oxidierenden Lösung A method for reducing a defect level after the chemical mechanical polishing of a substrate containing copper by rinsing the substrate with an oxidizing solution |
| 03/11/2004 | DE10240106A1 Ausbildung einer elektrischen Verbindung zwischen Strkturen in einem Halbleitersubstrat Forming an electrical connection between Strkturen in a semiconductor substrate, |
| 03/11/2004 | DE10240099A1 Production of a semiconductor structure comprises preparing a semiconductor substrate, providing a lower first, a middle second and an upper third mask layer on a surface of the substrate, and further processing |
| 03/11/2004 | DE10240002A1 Optisches Teilsystem insbesondere für eine Projektionsbelichtungsanlage mit mindestens einem in mindestens zwei Stellungen verbringbaren optischen Element Optical subsystem particular for a projection exposure apparatus having at least one verbringbaren at least two positions optical element |
| 03/11/2004 | DE10239656A1 Ätzpasten für Titanoxid-Oberflächen Etching pastes for titanium oxide surfaces |
| 03/11/2004 | DE10239081A1 Production of a semiconductor device used as a wafer level/chip size package, involves applying conductor strips to a semiconductor substrate, structuring the strips, and applying a solder layer to the structured strips |
| 03/11/2004 | DE10239045A1 Verfahren zum Herstellen eines elektromagnetische Strahlung emittierenden Halbleiterchips und elektromagnetische Strahlung emittierender Halbleiterchip A method for producing a electromagnetic radiation-emitting semiconductor chips and electromagnetic radiation emitting semiconductor chip |
| 03/11/2004 | DE10238835A1 Halbleiterchip, Chipanordnung mit zumindest zwei Halbleiterchips und Verfahren zur Überprüfung der Ausrichtung zumindest zweier übereinander liegender Halbleiterchips in einer Chipanordnung Semiconductor chip, chip assembly having at least two semiconductor chip and method for checking the alignment of at least two superimposed semiconductor chips in a chip assembly |
| 03/11/2004 | DE10238816A1 Production of connecting regions of an integrated circuit comprises applying a dielectric on the circuit, applying an oxidizable and/or corrodable metallization, applying a protective unit, and structuring the protective unit |
| 03/11/2004 | DE10238784A1 Nichtflüchtiges Halbleiterspeicherelement sowie zugehöriges Herstellungs- und Ansteuerverfahren Nonvolatile semiconductor memory device and associated manufacturing and driving |
| 03/11/2004 | DE10238601A1 Wafer for handling substrates in the semiconductor industry comprises a first surface on which an adhesive layer is applied to keep a substrate mechanically stable for subsequent processing, a second surface, and a feed line for solvent |
| 03/11/2004 | DE10238593A1 Production of a semiconductor wafer from a semiconducting workpiece comprises subjecting a conducting tool as electrode to an electrical current from a direct voltage source, and applying to the workpiece in the presence of an electrolyte |
| 03/11/2004 | DE10238590A1 Verfahren zur Erzeugung einer Struktur auf einem Substrat Method for producing a structure on a substrate |
| 03/11/2004 | DE10238582A1 Integrated circuit used in wafer level packages comprises an elastically deformable protrusion on a switching substrate, a contact unit arranged on the protrusion for producing an electrical connection, and a rewiring unit |
| 03/11/2004 | DE10238024A1 Integration of air as dielectric in semiconductor device involves applying and structurizing dielectric, metallization, applying organic dielectric, and contact with fluorine compound to replace first dielectric with air |
| 03/11/2004 | DE10237508A1 Verfahren zum Bilden einer Maskierschicht auf einem Substrat A method of forming a masking layer on a substrate |
| 03/11/2004 | DE10237338A1 Herstellung einer Umverdrahtungslage auf einem Trägermaterial Preparing a rewiring layer on a carrier material |
| 03/11/2004 | DE10237280A1 Verfahren zum Verbinden von Oberflächen, Halbleiter mit verbundenen Oberflächen sowie Bio-Chip und Bio-Sensor A method of joining surfaces, semiconductor surfaces and associated with bio-chip, and bio-sensor |
| 03/11/2004 | DE10235814B3 Process for detachably mounting a semiconductor substrate to be processed on a supporting wafer used in the production of semiconductor components comprises thinly grinding the substrate and removing the substrate from the wafer |
| 03/11/2004 | DE10059234B4 Elektrisch leitende Paste und Verfahren zur Bildung eines Schaltkreises Electrically conductive paste and process for forming a circuit |
| 03/11/2004 | CA2496654A1 Fixtures and methods for facilitating the fabrication of devices having thin film materials |
| 03/10/2004 | EP1396914A1 MULTI−BEAM SEMICONDUCTOR LASER ELEMENT |
| 03/10/2004 | EP1396890A1 Lateral junction type field effect transistor |
| 03/10/2004 | EP1396889A2 Electronic device substrate structure and electronic device |
| 03/10/2004 | EP1396884A2 Interlayer insulation film used for multilayer interconnect of semiconductor integrated circuit and method of manufacturing the same |
| 03/10/2004 | EP1396883A2 Substrate and manufacturing method therefor |
| 03/10/2004 | EP1396882A2 Method of manufacturing an integrated electronic component and electric device incorporating such component |
| 03/10/2004 | EP1396881A1 Conductive thin film for semiconductor device, semiconductor device, and methods for producing them |
| 03/10/2004 | EP1396880A2 Doping method and semiconductor device fabricated using the method |
| 03/10/2004 | EP1396879A1 Method of fabricating semiconductor wafer and susceptor used therefor |
| 03/10/2004 | EP1396878A1 Production method for semiconductor substrate and semiconductor element |
| 03/10/2004 | EP1396877A2 Substrate for electronic devices, manufacturing method therefor, and electronic device |
| 03/10/2004 | EP1396876A2 Method for transferring a semiconductor thin film on a flexible substrate |
| 03/10/2004 | EP1396875A2 3-D spiral stacked inductor on semiconductor material |
| 03/10/2004 | EP1396874A2 Substrate carrier handler that unloads substrate carriers directly from a moving conveyor |
| 03/10/2004 | EP1396873A1 Electron beam writing equipment |
| 03/10/2004 | EP1396867A1 Room temperature ferromagnetic semiconductor grown by plasma enhanced molecular beam epitaxy and use |
| 03/10/2004 | EP1396778A2 Semiconductor device including encryption section, semiconductor device including external interface, and content reproduction method |
| 03/10/2004 | EP1396760A2 Differential pumping system and exposure apparatus |
| 03/10/2004 | EP1396758A2 Differential pumping system and exposure apparatus |
| 03/10/2004 | EP1396757A2 Reticle focus measurement system and method using multiple interferometric beams |
| 03/10/2004 | EP1396636A2 Fluid pump system |
| 03/10/2004 | EP1396323A1 Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor |
| 03/10/2004 | EP1396032A1 Structure and method for forming a body contact for vertical transistor cells |
| 03/10/2004 | EP1396031A1 Dmos with zener diode for esd protection |
| 03/10/2004 | EP1396030A2 Power semiconductor devices having laterally extending base shielding regions that inhibit base reach through and methods of forming same |
| 03/10/2004 | EP1396029A2 An intermediate manufacture for a dual gate logic device |