| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/03/2004 | US20040104404 Heterojunction field effect type semiconductor device having high gate turn-on voltage and low on-resistance and its manufacturing method |
| 06/03/2004 | US20040104403 Thin gallium-arsenide-antimonide base heterojunction bipolar transistor (HBT) having improved gain |
| 06/03/2004 | US20040104402 Configuration and method for making contact with the back surface of a semiconductor substrate |
| 06/03/2004 | US20040104401 Method of fabricating thin film transistor array |
| 06/03/2004 | US20040104392 Production method for light emitting element abstract: |
| 06/03/2004 | US20040104388 Pixel structure and thin film transistor array used in liquid crystal display |
| 06/03/2004 | US20040104386 Device using self-organizable polymer |
| 06/03/2004 | US20040104385 Electrode Patterning in OLED Devices |
| 06/03/2004 | US20040104384 Growth of high temperature, high power, high speed electronics |
| 06/03/2004 | US20040104361 Semiconductor wafer edge marking |
| 06/03/2004 | US20040104326 Device for fixing thin and flexible substrates |
| 06/03/2004 | US20040104272 Method for selectively transferring at least an element from an initial support onto a final support |
| 06/03/2004 | US20040104211 Heater and method of manufacturing same |
| 06/03/2004 | US20040104206 Methods for preparing ball grid array substrates via use of a laser |
| 06/03/2004 | US20040104200 Methods for finishing microelectronic device packages |
| 06/03/2004 | US20040104199 Combined wet etching method for stacked films and wet etching system used for same |
| 06/03/2004 | US20040104196 Method of forming fine patterns |
| 06/03/2004 | US20040104192 Telescopic boom for a vehicle crane |
| 06/03/2004 | US20040104139 Substrate transfer apparatus, method for removing the substrate, and method for accommodating the substrate |
| 06/03/2004 | US20040104128 Filling concave portions formed on wafer surface; determining electropolishing end point of metal film in accordance with change of current waveform |
| 06/03/2004 | US20040104121 Substrate with an electrode and method of producing the same |
| 06/03/2004 | US20040104120 Wafer chuck assembly for holding a wafer |
| 06/03/2004 | US20040104113 External electrode connector |
| 06/03/2004 | US20040104043 Compactness, low profile, and light-weight properties |
| 06/03/2004 | US20040103960 Method for the patterned, selective metallization of a surface of a substrate |
| 06/03/2004 | US20040103950 Liquid quantity determination unit, photolithography apparatus, and liquid quantity determination method |
| 06/03/2004 | US20040103931 Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism |
| 06/03/2004 | US20040103924 Gas-expanded liquids, methods of use thereof, and systems using gas-expanded liquids for cleaning integrated circuits |
| 06/03/2004 | US20040103922 Method of high pressure treatment |
| 06/03/2004 | US20040103919 Single wafer cleaning with ozone |
| 06/03/2004 | US20040103917 Method of cleaning by removing particles from surfaces, a cleaning apparatus and a lithographic projection apparatus |
| 06/03/2004 | US20040103915 Assisted rinsing in a single wafer cleaning process |
| 06/03/2004 | US20040103913 Apparatus for washing glass substrates and process for producing a liquid crystal device |
| 06/03/2004 | US20040103813 catalytic nickel powder is coated palladium; disperse tin coated nickel powder in palladium chloride solution; forming metallic film on substrate with catalytic paste as underlayer; conductor circuits; reduce the cost catalytic metal |
| 06/03/2004 | US20040103715 Leakage detecting method for use in oxidizing system of forming oxide layer |
| 06/03/2004 | US20040103530 Manufacturing method for magnetic sensor and lead frame therefor |
| 06/03/2004 | US20040103522 Open pattern inductor |
| 06/03/2004 | DE69818076T2 Vorrichtung zur förderung von chemischen wirkstoffen Apparatus for promotion of chemical active ingredients |
| 06/03/2004 | DE69817077T2 Behandlungsverfahren und Vorrichtung, die eine chemische Reaktion verwenden Treatment method and device which use a chemical reaction |
| 06/03/2004 | DE69333151T2 Datenleitungsstörungsfreier, in Speicherblöcke geteilter Flashspeicher und Mikrorechner mit Flashspeicher Data line interference-free shared memory blocks in flash memory and microcomputer with flash memory |
| 06/03/2004 | DE4136406B4 Verfahren zur Herstellung einer CMOS-Halbleitereinrichtung A method of manufacturing a CMOS semiconductor device |
| 06/03/2004 | DE202004005102U1 Heat conducting body e.g. for computer, has heat removal body with visible outer surface applied with thermo-chromic color |
| 06/03/2004 | DE19901922B4 Vorrichtung zum Be-/Entladen eines modularen IC's in eine bzw. aus einer Buchse einer Handhabe für modulare IC's Apparatus for loading / unloading a modular IC's in or out of a socket of a handle for modular IC's |
| 06/03/2004 | DE19750221B4 Verfahren zu Herstellung eines Halbleiterbauteils mit MOS-Gatesteuerung A method of manufacturing a semiconductor device with MOS gated |
| 06/03/2004 | DE19718370B4 Verfahren zum Herstellen einer Membran eines Drucksensors oder akustischen Wandlers und akustischer Wandler oder Drucksensor A method of manufacturing a diaphragm of a pressure sensor or transducer and acoustic transducer or pressure sensor |
| 06/03/2004 | DE19603794B4 Verfahren zum Ausbilden einer Doppelwanne für Halbleiteranordnungen A method of forming a double tray for semiconductor devices |
| 06/03/2004 | DE10354249A1 Semiconductor device for high-power lateral MOSFETs with a drive based on a complementary metal oxide semiconductor process has an etched channel with a semiconductor substrate |
| 06/03/2004 | DE10348902A1 Metal-insulator-metal capacitor for use in dynamic RAM, has damascene wiring layers coupled to bottom of lower electrode which is separated from upper electrode by dielectric layer |
| 06/03/2004 | DE10341359A1 MOS-Transistor und Verfahren zur Herstellung desselben MOS transistor and method of manufacturing the same |
| 06/03/2004 | DE10338731A1 Verfahren zur Herstellung einer (RO)(R'O)(R''O)M=O-Verbindung, dünnschichtbildendes Material, Dünnschicht und Halbleiterelement A process for producing a (RO) (R'O) (R''O) M = O compound thin film forming material, and thin-film semiconductor element |
| 06/03/2004 | DE10305602A1 Verfahren und Vorrichtung zum Erzeugen eines Gasplasmas, Gaszusammensetzung zum Erzeugen von Plasma und Verfahren zum Erzeugen einer Halbleitervorrichtung, das dieses verwendet Method and device for generating a gas plasma, the gas composition for generating plasma and methods for producing a semiconductor device that uses this |
| 06/03/2004 | DE10261852B3 Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling |
| 06/03/2004 | DE10255098A1 Verfahren zum Herstellen eines Kalibrationswafers A process for producing a calibration wafer |
| 06/03/2004 | DE10253855A1 Isolationsschichtmaterial für integrierte Schaltkreise in Damascene-Architektur Insulation layer material for integrated circuits in damascene architecture |
| 06/03/2004 | DE10253679A1 Optical arrangement used in the production of semiconductor components comprises a lens system arranged behind a mask, and a medium having a specified refractive index lying between the mask and the lens system |
| 06/03/2004 | DE10252878A1 In BiCMOS-Technologie monolithisch integrierte verbesserte vertikale pin-Fotodiode In BiCMOS technology monolithically integrated improved vertical pin photodiode |
| 06/03/2004 | DE10250911A1 Production process for an encapsulation of an optoelectronic component especially a luminescent or photo diode, using a template to govern filling of the encapsulant |
| 06/03/2004 | DE10250889A1 Verbesserte Barrierenschicht für eine Kupfermetallisierungsschicht mit einem Dielektrikum mit kleinem ε Improved barrier layer for receiving a copper with a dielectric with small ε |
| 06/03/2004 | DE10249216B3 Production of a contact hole in a semiconductor structure comprises forming an insulation made from silicon oxide for embedding first and second structural elements, forming a mask on the insulation, and further processing |
| 06/03/2004 | DE10245398B3 Vorrichtung und Verfahren zur Aufbringung von Halbleiterchips auf Trägern Apparatus and method for applying semiconductor chips on carriers |
| 06/03/2004 | DE10219123B4 Verfahren zur Strukturierung keramischer Schichten auf Halbleitersubstanzen mit unebener Topographie A method for patterning semiconductor layers on ceramic substances with uneven topography |
| 06/03/2004 | DE10215283B4 Vorrichtung zur Aufnahme von Substraten A device for accommodating substrates |
| 06/03/2004 | DE10107923B4 Integrierte Silizium-auf-Isolator(SOI)-Halbleiterschaltung und Verfahren zu ihrer Herstellung Integrated silicon-on-insulator (SOI) and methods for their preparation -Halbleiterschaltung |
| 06/03/2004 | DE10009762B4 Herstellungsverfahren für einen Speicherkondensator mit einem Dielektrikum auf der Basis von Strontium-Wismut-Tantalat Manufacturing method of a storage capacitor with a dielectric on the basis of strontium bismuth tantalate |
| 06/02/2004 | EP1424748A2 Microelectronic contacts and assemblies |
| 06/02/2004 | EP1424734A2 Heterojunction field effect type semiconductor device having high gate turn-on voltage and low on-resistance and its manufacturing method |
| 06/02/2004 | EP1424733A2 Method and device for arranging contacts of elements on an integrated circuit, computer readable memory device, and program element |
| 06/02/2004 | EP1424731A2 Electronic parts packaging structure and method of manufacturing the same |
| 06/02/2004 | EP1424729A2 Heatsink and fabrication method thereof |
| 06/02/2004 | EP1424727A1 Polishing composition and rinse composition |
| 06/02/2004 | EP1424726A1 N-electrode for iii group nitride based compound semiconductor element |
| 06/02/2004 | EP1424725A1 ELECTRODE FOR p-TYPE SiC |
| 06/02/2004 | EP1424724A1 Chemical vapor phase epitaxial device |
| 06/02/2004 | EP1424723A2 Ion beam for target recovery |
| 06/02/2004 | EP1424722A1 Process of removing semiconductor chips from a film and apparatus therefor |
| 06/02/2004 | EP1424619A2 Master slice semiconductor integrated circuit |
| 06/02/2004 | EP1424614A2 Flow control of process gas in semiconductor manufacturing |
| 06/02/2004 | EP1424597A2 Lithographic apparatus and device manufacturing method |
| 06/02/2004 | EP1424596A2 First approximation for OPC significant speed-up |
| 06/02/2004 | EP1424595A2 Automatic calibration of a masking process simulator |
| 06/02/2004 | EP1424537A1 DISPLACEMENT DETECTING METHOD, DISPLACEMENT DETECTING DEVICE AND CALIBRATING METHOD THEREOF, AND RECORDING DEVICE OF INFORMATION RECORDING MEDIUM ORIGINAL DISK |
| 06/02/2004 | EP1424409A1 Semiconductor wafer and its manufacturing method |
| 06/02/2004 | EP1424405A2 Method and apparatus for fabricating coated substrates |
| 06/02/2004 | EP1424377A1 Dicing adhesive sheet and dicing method |
| 06/02/2004 | EP1424309A2 Hardened nano-imprinting stamp |
| 06/02/2004 | EP1423880A1 Semiconductor memory element, production method and operational method |
| 06/02/2004 | EP1423879A2 Non-volatile semiconductor memory |
| 06/02/2004 | EP1423878A2 Integrated circuit device with bump bridges and method for making the same |
| 06/02/2004 | EP1423875A1 Integrated circuit with dram memory cell and the production method thereof |
| 06/02/2004 | EP1423874A2 Semiconductor memory with memory cells comprising a vertical selection transistor and method for production thereof |
| 06/02/2004 | EP1423873A1 Method for obtaining a self-supported semiconductor thin film for electronic circuits |
| 06/02/2004 | EP1423872A2 Providing photonic control over wafer borne semiconductor devices |
| 06/02/2004 | EP1423871A2 Process for producing silicon on insulator structure having intrinsic gettering by ion implantation |
| 06/02/2004 | EP1423870A2 Process for charged particle beam micro-machining of copper |
| 06/02/2004 | EP1423869A2 Method for thermally treating a substrate that comprises several layers |
| 06/02/2004 | EP1423868A2 Forming a semiconductor structure using a combination of planarizing methods and electropolishing |
| 06/02/2004 | EP1423867A2 Substrate processing apparatus |
| 06/02/2004 | EP1423861A1 Magnetoresistive device and electronic device |
| 06/02/2004 | EP1423856A1 Non-volatile memory device |
| 06/02/2004 | EP1423855A1 Mram with midpoint generator reference |