Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2004
06/03/2004US20040105577 Method and system for phase/amplitude error detection of alternating phase shifting masks in photolithography
06/03/2004US20040105486 Method and apparatus for detecting contaminants in ion-implanted wafer
06/03/2004US20040105471 Structure for nitride based laser diode with growth substrate removed
06/03/2004US20040105330 Method of forming minimally spaced word lines
06/03/2004US20040105326 Magnetic semiconductor memory device
06/03/2004US20040105321 Non-volatile memory and fabrication thereof
06/03/2004US20040105320 Semiconductor memory device including magneto resistive element and method of fabricating the same
06/03/2004US20040105319 Method of manufacturing a scalable flash eeprom memory cell with floating gate spacer wrapped by control gate
06/03/2004US20040105309 Semiconductor memory device having row decoder in which high-voltage-applied portion is located adjacent to low-voltage-applied portion
06/03/2004US20040105305 High output nonvolatile magnetic memory
06/03/2004US20040105304 Thin film magnetic memory device with memory cells including a tunnel magnetic resistive element
06/03/2004US20040105303 Magnetic random access memory
06/03/2004US20040105300 Reduced integrated circuit chip leakage and method of reducing leakage
06/03/2004US20040105296 Ferroelectric memory
06/03/2004US20040105295 Semiconductor memory and writing method and reading method for the same
06/03/2004US20040105244 Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions
06/03/2004US20040105223 Method of manufacturing electronic part and electronic part obtained by the method
06/03/2004US20040105213 Ferroelectric capacitor and process for its manufacture
06/03/2004US20040105203 Electrostatic discharge protection circuit of non-gated diode and fabrication method thereof
06/03/2004US20040105177 Method of supporting and adjusting optical element in exposure apparatus
06/03/2004US20040105170 Objective with fluoride crystal lenses
06/03/2004US20040105160 Particle-optical apparatus, electron microscopy system and electron lithography system
06/03/2004US20040105101 Method of and apparatus for measuring thickness of thin film or thin layer
06/03/2004US20040105093 Inspection method and inspection apparatus
06/03/2004US20040105084 Projection system configured to project patterned beam onto target portion of substrate, wherein a space in comprises perhaloalkane and nitrogen compound; damage prevention to optical surfaces
06/03/2004US20040105083 Lithographic apparatus and device manufacturing method
06/03/2004US20040105082 Radiation source, lithographic apparatus and device manufacturing method
06/03/2004US20040105081 Lithographic apparatus, device manufacturing method, and device manufactured thereby
06/03/2004US20040105080 Lithographic apparatus and device manufacturing method
06/03/2004US20040105041 Thin film transistor, liquid crystal display panel, and method of manufacturing thin film transistor
06/03/2004US20040105033 Amplifier assembly including variable gain amplifier, parallel programmable amplifiers, and AGC
06/03/2004US20040104879 Pixel structure
06/03/2004US20040104771 Gain control methods and systems in an amplifier assembly
06/03/2004US20040104762 Bias potential generating apparatus
06/03/2004US20040104754 Radiation protection in integrated circuits
06/03/2004US20040104753 Semiconductor device capable of accurately producing internal multi-phase clock signal
06/03/2004US20040104752 System and method for expanding a pulse width
06/03/2004US20040104740 Process monitor for monitoring an integrated circuit chip
06/03/2004US20040104738 Probe card
06/03/2004US20040104732 Semiconductor integrated circuit device
06/03/2004US20040104682 Ion implantation system and control method
06/03/2004US20040104641 Method of separating a template from a substrate during imprint lithography
06/03/2004US20040104491 Wafer back side coating to balance stress from passivation layer on front of wafer and be used as a die attach adhesive
06/03/2004US20040104490 Semiconductor device and a method of manufacturing the same
06/03/2004US20040104488 Optical component package and packaging method thereof
06/03/2004US20040104485 Semiconductor device having interconnection layer with multiply layered sidewall insulation film
06/03/2004US20040104484 between bonding pad of a chip and solder bump (flip chip) for reducing the growth rate of nickel/tin/vanadium intermetallic
06/03/2004US20040104483 Plating a conductive material on a dielectric material
06/03/2004US20040104482 Semiconductor integrated circuit device having multilevel interconnection
06/03/2004US20040104481 Method for recrystallizing metal in features of a semiconductor chip
06/03/2004US20040104480 Method of producing an ultra thin electrically conducting film with very low electrical resistance
06/03/2004US20040104477 Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
06/03/2004US20040104476 Method of manufacturing semiconductor chip having supporting member and semiconductor package having the semiconductor chip
06/03/2004US20040104474 Semiconductor package and package stack made thereof
06/03/2004US20040104471 Side-wall barrier structure and method of fabrication
06/03/2004US20040104468 Semiconductor integrated circuit device and semiconductor integrated circuit chip thereof
06/03/2004US20040104462 Semiconductor package
06/03/2004US20040104461 Liquid crystal display apparatus
06/03/2004US20040104460 Wafer-level hermetic micro-device packages
06/03/2004US20040104459 Electronic device with external contact elements and method for producing a plurality of the devices
06/03/2004US20040104458 Sealing resin having recess, so that part of surface of semiconductor element is exposed; releasable protective device with shape corresponding to recess
06/03/2004US20040104456 Semiconductor package includes inter-digitated input and output bond wires configured to increase negative mutual inductive coupling; microelectronics
06/03/2004US20040104455 Semiconductor device
06/03/2004US20040104452 Semiconductor device with improved radiation property
06/03/2004US20040104451 Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device
06/03/2004US20040104449 Filling spaces with metallic layer; removing three-dimensional sacrificial mold; radio and optical telecommunications
06/03/2004US20040104448 Filling with titanium nitride; doping
06/03/2004US20040104447 Integrated circuit structures including epitaxial silicon layers in active regions and methods of forming same
06/03/2004US20040104443 Semiconductor device having T-shaped gate electrode and method of manufacturing the same
06/03/2004US20040104442 Drain/source extension structure of a field effect transistor including doped high-k sidewall spacers
06/03/2004US20040104441 Gate and cmos structure and mos structure
06/03/2004US20040104440 [method of forming dual-implanted gate and structure formed by the same]
06/03/2004US20040104439 Method of depositing barrier layer from metal gates
06/03/2004US20040104438 Semiconductor structure having in-situ formed unit resistors and method for fabrication
06/03/2004US20040104436 Diode coupled for providing bias signal; cathode coupled to pad and anode to substrate; transistor with drain terminal; electrostatic discharges; metal oxide field semiconductor field effect transistors
06/03/2004US20040104435 Semiconductor device and method of fabricating the same
06/03/2004US20040104434 Thin film transistor liquid crystal display and method for manufacturing the same
06/03/2004US20040104433 Method and structure of a disposable reversed spacer process for high performance recessed channel CMOS
06/03/2004US20040104432 Semiconductor device having fully and partially depleted SOI elements on a substrate
06/03/2004US20040104431 [polysilicon thin film transistor and method of forming the same]
06/03/2004US20040104429 SiC-MISFET and method for fabricating the same
06/03/2004US20040104428 Trench transistors and methods for fabricating trench transistors
06/03/2004US20040104427 Dense trench MOSFET with decreased etch sensitivity to deposition and etch processing
06/03/2004US20040104426 Graded composition gate insulators to reduce tunneling barriers in flash memory devices
06/03/2004US20040104425 Nonvolatile semiconductor memory device and method of manufacturing thereof
06/03/2004US20040104424 Nonvolatile memory and electronic apparatus
06/03/2004US20040104423 Semiconductor device including transistor with composite gate structure and transistor with single gate structure, and method for manufacturing the same
06/03/2004US20040104422 Nonvolatile semiconductor memory device and manufacturing method of the same
06/03/2004US20040104421 Semiconductor device and method of manufacturing the same
06/03/2004US20040104420 PREVENTION OF Ta2O5 MIM CAP SHORTING IN THE BEOL ANNEAL CYCLES
06/03/2004US20040104419 Self-aligned contacts to gates
06/03/2004US20040104418 Transistor array and semiconductor memory configuration fabricated with the transistor array
06/03/2004US20040104417 Ferroelectric memory device using via etch-stop layer and method for manufacturing the same
06/03/2004US20040104416 Semiconductor integrated circuit device and production method thereof
06/03/2004US20040104414 Ferroelectric capacitor device
06/03/2004US20040104411 Method for producing a gate for a cmos transistor structure having a channel of reduced length
06/03/2004US20040104409 Self-aligned borderless contacts
06/03/2004US20040104407 Vertical one-transistor floating-body DRAM cell in bulk CMOS process with electrically isolated charge storage region
06/03/2004US20040104406 Method for treating the surface of a semiconductor material
06/03/2004US20040104405 Novel CMOS device