Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2004
06/03/2004US20040106363 Substrate processing apparatus
06/03/2004US20040106355 High selectivity slurry delivery system
06/03/2004US20040106335 Semiconductor device and method of manufacturing the same
06/03/2004US20040106334 Microparticle arrangement film, electrical connection film, electrical connection structure, and microparticle arrangement method
06/03/2004US20040106303 Method for minimizing slip line faults on a semiconductor wafer surface
06/03/2004US20040106302 Method for forming PE-TEOS layer of semiconductor integrated circuit device
06/03/2004US20040106301 Film lamination apparatus and method and a manufacturing method of a semiconductor apparatus
06/03/2004US20040106300 Soft-landing etching method using doping level control
06/03/2004US20040106299 Sacrificial self-aligned interconnect structure and method of making
06/03/2004US20040106298 Development apparatus for manufacturing semiconductor device
06/03/2004US20040106297 Etching method, semiconductor and fabricating method for the same
06/03/2004US20040106296 Method of removing silicon oxide from a surface of a substrate
06/03/2004US20040106295 CMP assisted liftoff micropatterning
06/03/2004US20040106294 Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same
06/03/2004US20040106293 Method for etching organic insulating film and dual damasene process
06/03/2004US20040106292 Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit device
06/03/2004US20040106290 Process for forming a buried cavity in a semiconductor material wafer and a buried cavity
06/03/2004US20040106289 Method for manufacturing semiconductor integrated circuit device
06/03/2004US20040106288 Method for manufacturing circuit devices
06/03/2004US20040106287 Method for making a semiconductor device having a high-k gate dielectric
06/03/2004US20040106286 Method of etching uniform silicon layer
06/03/2004US20040106284 Signal layer for generating characteristic optical plasma emissions
06/03/2004US20040106283 Comparison of chemical-mechanical polishing processes
06/03/2004US20040106282 Method for forming silicide at source and drain
06/03/2004US20040106281 Re-oxidation process of semiconductor device
06/03/2004US20040106280 Bitline structure for DRAM and method of forming the same
06/03/2004US20040106279 Method and system for eliminating extrusions in semiconductor vias
06/03/2004US20040106278 Method of eliminating photoresist poisoning in damascene applications
06/03/2004US20040106277 Integrated process flow to improve copper filling in a damascene structure
06/03/2004US20040106276 Method and structure for reducing contact aspect ratios
06/03/2004US20040106275 Method of manufacturing an electronic device
06/03/2004US20040106274 Gate structure with independently tailored vertical doping profile
06/03/2004US20040106272 Method of manufacturing a semiconductor device
06/03/2004US20040106271 Processing method of forming MRAM circuitry
06/03/2004US20040106270 Method for constructing a metal oxide semiconductor field effect transistor
06/03/2004US20040106268 Thermally stable crystalline defect-free germanium boned to silicon and silicon dioxide
06/03/2004US20040106267 Oxynitride shallow trench isolation and method of formation
06/03/2004US20040106266 Novel method to fabricate high reliable metal capacitor within copper back-end process
06/03/2004US20040106264 Structure and method of making a high performance semiconductor device having a narrow doping profile
06/03/2004US20040106263 System and method to reduce noise in a substrate
06/03/2004US20040106262 Method of making transistors
06/03/2004US20040106261 Method of forming an electrode with adjusted work function
06/03/2004US20040106260 Process of utilizing CF4 plasma pretreatment to improve high-k dielectric materials
06/03/2004US20040106259 High coupling split-gate transistor
06/03/2004US20040106258 TTO nitride liner for improved collar protection and TTO reliability
06/03/2004US20040106257 Method for fabricating semiconductor device
06/03/2004US20040106256 Method of manufacturing a flash memory cell
06/03/2004US20040106255 Manufacturing method of flash memory device
06/03/2004US20040106254 Semiconductor device and its manufacturing method
06/03/2004US20040106253 Semiconductor processing methods of forming integrated circuitry
06/03/2004US20040106252 Method of manufacturing capacitor of semiconductor device by simplifying process of forming dielectric layer and apparatus therefor
06/03/2004US20040106251 Technique to control tunneling currents in DRAM capacitors, cells, and devices
06/03/2004US20040106250 Method of fabricating semiconductor integrated circuit device
06/03/2004US20040106249 Method to fabricate dual metal CMOS devices
06/03/2004US20040106248 Method of fabricating a semiconductor device
06/03/2004US20040106247 Method for forming semiconductor device
06/03/2004US20040106246 Laser anneal method of a semiconductor layer
06/03/2004US20040106245 Method and structure for contacting an overlying electrode for a magnetoelectronics element
06/03/2004US20040106244 Method of crystallizing amorphous silicon and device fabricated using the same
06/03/2004US20040106243 Method for controlling electrical conductivity
06/03/2004US20040106242 Method for fabricating semiconductor film and semiconductor device and laser processing apparatus
06/03/2004US20040106241 Mask for polycrystallization and method of manufacturing thin film transistor using polycrystallization mask
06/03/2004US20040106240 Process for forming polysilicon layer and fabrication of thin film transistor by the process
06/03/2004US20040106239 Method of fabricating semiconductor device
06/03/2004US20040106238 [pixel structure and fabricating method thereof]
06/03/2004US20040106237 Method for fabricating semiconductor device
06/03/2004US20040106236 Method to manufacture LDMOS transistors with improved threshold voltage control
06/03/2004US20040106235 Method for manufacturing circuit devices
06/03/2004US20040106234 Electrical leadframes, surface mountable semiconductor components, leadframe strips, and their method of manufacture
06/03/2004US20040106233 Integrated circuit packaging for improving effective chip-bonding area
06/03/2004US20040106232 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby
06/03/2004US20040106228 Substrate based ESD network protection method for flip chip design
06/03/2004US20040106227 Method of doping silicon, metal doped silicon, method of making solar cells, and solar cells
06/03/2004US20040106226 [method of fabricating organic light emitting diode device]
06/03/2004US20040106221 Integrated driver process flow
06/03/2004US20040106217 Method to detect surface metal contamination
06/03/2004US20040106130 Bioarray chip reaction apparatus and its manufacture
06/03/2004US20040106073 Forming method of resist pattern for improving accuracy of dimension of pattern, manufacturing method of semiconductor apparatus using the same and heat treatment apparatus for the same
06/03/2004US20040106072 Pretreatment; determination, calibration of photoresist dissolving concentration of developer, speed; for semiconductors
06/03/2004US20040106071 Uniformity of pattern
06/03/2004US20040106069 Process for producing a tool insert for injection molding a part with two-stage microstructures
06/03/2004US20040106068 Lithographic apparatus and device manufacturing method
06/03/2004US20040106067 Miniaturization of electrical and electronic apparatus by forming patterns on photoresists containing acid generators, then exposing, developing and heating, to diffuse acids formed and to equalize glass transition temperature
06/03/2004US20040106066 Pattern-forming process using photosensitive resin composition
06/03/2004US20040106048 Modular containment cell arrangements
06/03/2004US20040105990 Backing, adhesive layer, and protective member, where the adhesive layer comprises a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent; improved adhesion, heat resistance, low modulus of elasticity
06/03/2004US20040105986 excels in dielectric properties, adhesion, film consistency, mechanical strength, easily thinned; made from an amorphous polymer made by hydrolyzing and condensing an silane compoundl, and and a zeolite sol made with a quaternary ammonium hydroxide
06/03/2004US20040105936 robot transfers wet substrate which has been developed and rinsed to supercritical drying unit; prevents air drying
06/03/2004US20040105935 repeated purging; for integrated ciruits/semiconductor wafers
06/03/2004US20040105934 Ruthenium layer formation for copper film deposition
06/03/2004US20040105918 a power control circuit that can manage and control both the active and standby modes of each circuit block of a chip
06/03/2004US20040105909 Resin molding machine
06/03/2004US20040105750 Method for picking semiconductor chips from a foil
06/03/2004US20040105749 Work arrangement apparatus
06/03/2004US20040105742 Semiconductor manufacturing system
06/03/2004US20040105738 Substrate processing apparatus and method of processing substrate while controlling for contamination in substrate transfer module
06/03/2004US20040105737 Vacuum process system
06/03/2004US20040105671 Method for semiconductor wafer etching
06/03/2004US20040105670 Photoirradiation thermal processing apparatus and thermal processing susceptor employed therefor
06/03/2004US20040105578 Pattern inspection apparatus