| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/08/2004 | US6746240 Process tube support sleeve with circumferential channels |
| 06/08/2004 | US6746239 Substrate feed chamber and substrate processing apparatus |
| 06/08/2004 | US6746238 Cooling system for reducing particles pollution |
| 06/08/2004 | US6746237 Method and device for heat treating substrates |
| 06/08/2004 | US6746198 Substrate transfer shuttle |
| 06/08/2004 | US6746197 Substrate processing apparatus and substrate processing method |
| 06/08/2004 | US6746196 Vacuum treatment device |
| 06/08/2004 | US6746195 Semiconductor transfer and manufacturing apparatus |
| 06/08/2004 | US6746128 Ultra-high resolution imaging devices |
| 06/08/2004 | US6746022 Chuck for holding a workpiece |
| 06/08/2004 | US6745930 Method of attaching a body made of metal matrix composite (MMC) material or copper to a ceramic member |
| 06/08/2004 | US6745908 Shelf module adapted to store substrate carriers |
| 06/08/2004 | US6745901 Wafer cassette equipped with piezoelectric sensors |
| 06/08/2004 | US6745784 Method of and apparatus for cleaning substrate |
| 06/08/2004 | US6745783 Cleaning processing method and cleaning processing apparatus |
| 06/08/2004 | US6745717 Method and apparatus for preparing nitride semiconductor surfaces |
| 06/08/2004 | US6745637 Self-supporting adaptable metrology device |
| 06/08/2004 | US6745629 Method and apparatus for the production and quality testing of a bonded wire connection |
| 06/08/2004 | US6745575 Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules |
| 06/08/2004 | US6745494 Method and apparatus for processing wafers under pressure |
| 06/08/2004 | US6745484 Reticle, and pattern positional accuracy measurement device and method |
| 06/08/2004 | US6745462 Method and apparatus for reducing deformation of encapsulant in semiconductor device encapsulation by stencil printing |
| 06/08/2004 | US6745450 Method for loading solder balls into a mold |
| 06/08/2004 | CA2311902C Fine protuberance structure and method of production thereof |
| 06/05/2004 | WO2004038781A1 Plasma resistant seal |
| 06/03/2004 | WO2004047182A2 Field effect transistor structure, associated semiconductor storage cell, and corresponding production method |
| 06/03/2004 | WO2004047177A1 Semiconductor integrated device and method for manufacturing same |
| 06/03/2004 | WO2004047176A1 Ferroelectric memory array |
| 06/03/2004 | WO2004047175A1 Semiconductor device and semiconductor device manufacturing method |
| 06/03/2004 | WO2004047165A1 Method of manufacturing semiconductor device, plasma processing apparatus and plasma processing method |
| 06/03/2004 | WO2004047164A1 Semiconductor device having elevated device isolation structure and production method therefor |
| 06/03/2004 | WO2004047163A1 Semiconductor device |
| 06/03/2004 | WO2004047162A1 Method for low temperature growth of inorganic materials from solution using catalyzed growth and re-growth |
| 06/03/2004 | WO2004047161A1 Insulation film formation device |
| 06/03/2004 | WO2004047160A1 Method of fabricating semiconductor device |
| 06/03/2004 | WO2004047159A1 Tft substrate for liquid crystal display apparatus and method of manufacturing the same |
| 06/03/2004 | WO2004047158A1 Plasma processing apparatus and plasma processing method |
| 06/03/2004 | WO2004047157A1 Plasma processing apparatus and plasma processing method |
| 06/03/2004 | WO2004047154A2 Lifting glass substrate without center lift pins |
| 06/03/2004 | WO2004047150A2 RELAXED SiGe LAYERS ON Si OR SILICON-ON-INSULATOR SUBSTRATES BY ION IMPLANTATION AND THERMAL ANNEALING |
| 06/03/2004 | WO2004047149A2 Spatially-arranged chemical processing station |
| 06/03/2004 | WO2004047148A2 Method for producing and testing a corrosion-resistant channel in a silicon device |
| 06/03/2004 | WO2004046426A1 Integrated plating and planarization process and apparatus therefor |
| 06/03/2004 | WO2004046418A1 Substrate processing apparatus and method for processing substrate |
| 06/03/2004 | WO2004046416A1 Apparatus for vacuum treating two dimensionally extended substrates and method for manufacturing such substrates |
| 06/03/2004 | WO2004046415A1 Copper alloy sputtering target and semiconductor element wiring |
| 06/03/2004 | WO2004046410A2 Method of electroless deposition of thin metal and dielectric films with temperature controlled on stages of film growth |
| 06/03/2004 | WO2004046216A1 Method of fabricating polyurethane foam with micro pores and polishing pad tehrefrom |
| 06/03/2004 | WO2004046099A2 Method of making a molecule-surface interface |
| 06/03/2004 | WO2004046023A2 Fabrication of light emitting film coated fullerenes and their application for in-vivo light emission |
| 06/03/2004 | WO2004046021A1 Dispersion of nanowires of semiconductor material |
| 06/03/2004 | WO2004045869A1 Method for improving the accuracy of an etched silicon pattern using mask compensation |
| 06/03/2004 | WO2004045739A2 Substrate processing apparatus for processing substrates using dense phase gas and sonic waves |
| 06/03/2004 | WO2004045267A2 Improved microscale vacuum tube device and method for making same |
| 06/03/2004 | WO2004036315B1 Photoresist base material, method for purification thereof, and photoresist compositions |
| 06/03/2004 | WO2004034460A3 Method for eliminating voiding in plated solder |
| 06/03/2004 | WO2004030030A3 Taped lead frames and methods of making and using the same in semiconductor packaging |
| 06/03/2004 | WO2004030028A3 Method for the production of an integrated semiconductor circuit |
| 06/03/2004 | WO2004027824A3 Nitride and polysilicon interface with titanium layer |
| 06/03/2004 | WO2004025719A3 Nitrogen passivation of interface states in sio2/sic structures |
| 06/03/2004 | WO2004023553A3 Bitline structure and method for production thereof |
| 06/03/2004 | WO2004019372A3 Contactless mask programmable rom |
| 06/03/2004 | WO2004015759A3 A method of preparing a thin layer, the method including a step of correcting thickness by sacrificial oxidation, and an associated machine |
| 06/03/2004 | WO2004015596A3 Method and system for debugging using replicated logic |
| 06/03/2004 | WO2004013242A3 Polishing slurry system and metal poslishing and removal process |
| 06/03/2004 | WO2004010476A3 Substrate processing apparatus |
| 06/03/2004 | WO2004010467A3 Low temperature dielectric deposition using aminosilane and ozone |
| 06/03/2004 | WO2004010164A3 Catadioptric projection objective |
| 06/03/2004 | WO2004008827A3 Atomic layer deposition of high k dielectric films |
| 06/03/2004 | WO2004008523A3 Sealing ring assembly and mounting method |
| 06/03/2004 | WO2004008491A3 Thermal processing system and configurable vertical chamber |
| 06/03/2004 | WO2004008487A3 Test system and methodology |
| 06/03/2004 | WO2004005946A3 Electronic circuit with test unit for testing interconnects |
| 06/03/2004 | WO2004003997A3 Silicon-on-insulator wafer for integrated circuit |
| 06/03/2004 | WO2004003977A3 Method of defining the dimensions of circuit elements by using spacer deposition techniques |
| 06/03/2004 | WO2004003970A3 A semiconductor device and method of fabricating a semiconductor device |
| 06/03/2004 | WO2003105213A3 Method of manufacturing an electronic device |
| 06/03/2004 | WO2003105187A3 Optimization methods for on-chip interconnect geometries suitable for ultra deep sub-micron processes |
| 06/03/2004 | WO2003103020A3 Layered components, materials, methods of production and uses thereof |
| 06/03/2004 | WO2003096416A3 Reactive solder material |
| 06/03/2004 | WO2003090275A9 Methods used in fabricating gates in integrated circuit device structures |
| 06/03/2004 | WO2003073481A3 Feedforward and feedback control of semiconductor fabrication process using secondary electron microscopy and a focused ion beam system |
| 06/03/2004 | WO2003069264A3 Characterization and compensation of non-cyclic errors in interferometry systems |
| 06/03/2004 | WO2003063205A3 Poly(organosiloxane) materials and methods for hybrid organic-inorganic dielectrics for integrated circuit applications |
| 06/03/2004 | WO2003059590A8 Device for cutting a substrate layer, and corresponding method |
| 06/03/2004 | WO2003052514A9 Patterning of solid state features by direct write nanolithographic printing |
| 06/03/2004 | WO2003044849B1 Integrated void-free process for assembling a solder bumped chip |
| 06/03/2004 | WO2003034130A3 Methods of fabricating patterned layers on a substrate |
| 06/03/2004 | WO2002077484A9 Method and device for vibration control |
| 06/03/2004 | WO2002067302A8 Rhodium-rich oxygen barriers |
| 06/03/2004 | US20040107412 Method and system for context-specific mask writing |
| 06/03/2004 | US20040107051 Systems and methods for forming data storage devices |
| 06/03/2004 | US20040107021 Method for providing distributed material management and flow control in an integrated circuit factory |
| 06/03/2004 | US20040107020 Fabrication system and fabrication method |
| 06/03/2004 | US20040107014 Apparatus for processing wafers |
| 06/03/2004 | US20040106770 Anhydride polymers for use as curing agents in epoxy resin-based underfill material |
| 06/03/2004 | US20040106737 Heat shrinkage photoresist pattern; using mixture of polyvinyl alcohol and another water soluble polymer |
| 06/03/2004 | US20040106532 Cleaning liquid used in photolithography and a method for treating substrate therewith |
| 06/03/2004 | US20040106531 Using mixture of hydrogen fluoride salt ,base and acid |
| 06/03/2004 | US20040106530 Using mixture containing hydroxylamine compound |