Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2004
06/08/2004US6746959 Liquid crystal display and method
06/08/2004US6746958 Method of controlling the duration of an endpoint polishing process in a multistage polishing process
06/08/2004US6746957 Manufacture of semiconductor device with copper wiring
06/08/2004US6746956 Hermetic seal for silicon die with metal feed through structure
06/08/2004US6746955 Method of manufacturing a semiconductor device including a heat treatment procedure
06/08/2004US6746954 Method of reworking tungsten particle contaminated semiconductor wafers
06/08/2004US6746953 Method of forming backside bus vias
06/08/2004US6746952 Borane doped titanium nitride
06/08/2004US6746951 Bond pad of semiconductor device and method of fabricating the same
06/08/2004US6746950 Low temperature aluminum planarization process
06/08/2004US6746949 A stronger mechanical connection between a semiconductor device and the device package by adding one or more bumps to the gate connection without adding more gate pad area; added bumps are not electrically connected to either the
06/08/2004US6746947 Post-fuse blow corrosion prevention structure for copper fuses
06/08/2004US6746945 Method of forming a via hole in a semiconductor device
06/08/2004US6746944 Low nisi/si interface contact resistance with preamorphizing and laser thermal annealing
06/08/2004US6746943 Semiconductor device and method of fabricating the same
06/08/2004US6746942 Semiconductor thin film and method of fabricating semiconductor thin film, apparatus for fabricating single crystal semiconductor thin film, and method of fabricating single crystal thin film, single crystal thin film substrate, and semiconductor device
06/08/2004US6746941 Semiconductor wafer and production method therefor
06/08/2004US6746940 Integrated structure comprising a patterned feature substantially of single grain polysilicon
06/08/2004US6746939 Production method for solid imaging device
06/08/2004US6746938 Manufacturing method for semiconductor device using photo sensitive polyimide etching mask to form viaholes
06/08/2004US6746936 Method for forming isolation film for semiconductor devices
06/08/2004US6746935 MOS transistor in an integrated circuit and active area forming method
06/08/2004US6746934 Atomic layer doping apparatus and method
06/08/2004US6746933 Pitcher-shaped active area for field effect transistor and method of forming same
06/08/2004US6746932 Method of reducing the thickness of a silicon substrate
06/08/2004US6746931 Capacitor for semiconductor memory device and method of manufacturing the same
06/08/2004US6746930 Oxygen barrier for cell container process
06/08/2004US6746929 Semiconductor device having capacitor and method of manufacturing the same
06/08/2004US6746928 Method for opening a semiconductor region for fabricating an HBT
06/08/2004US6746927 Semiconductor device having a polysilicon line structure with increased metal silicide portions and method for forming the polysilicon line structure of a semiconductor device
06/08/2004US6746926 MOS transistor with highly localized super halo implant
06/08/2004US6746925 High-k dielectric bird's beak optimizations using in-situ O2 plasma oxidation
06/08/2004US6746924 Method of forming asymmetric extension mosfet using a drain side spacer
06/08/2004US6746923 Method of fabricating a vertical quadruple conduction channel insulated gate transistor
06/08/2004US6746922 Method and composite for decreasing charge leakage
06/08/2004US6746921 Method of forming an array of FLASH field effect transistors and circuitry peripheral to such array
06/08/2004US6746920 Fabrication method of flash memory device with L-shaped floating gate
06/08/2004US6746918 Methods of fabbricating a stack-gate non-volatile memory device and its contactless memory arrays
06/08/2004US6746917 Semiconductor processing methods of forming a plurality of capacitors on a substrate, bit line contacts and method of forming bit line contacts
06/08/2004US6746916 Method for forming a multilayer electrode for a ferroelectric capacitor
06/08/2004US6746915 Stack-type DRAM memory structure and its manufacturing method
06/08/2004US6746914 Metal sandwich structure for MIM capacitor onto dual damascene
06/08/2004US6746913 Method of manufacturing semiconductor integrated circuit device comprising a memory cell and a capacitor
06/08/2004US6746912 MIM capacitor and manufacturing method therefor
06/08/2004US6746911 Miniaturization; multilayer stacks; heat treatment to connect elements
06/08/2004US6746909 Transistor, semiconductor device and manufacturing method of semiconductor device
06/08/2004US6746908 Temperature controlling method, thermal treating apparatus, and method of manufacturing semiconductor device
06/08/2004US6746906 Transistor with ultra-short gate feature and method of fabricating the same
06/08/2004US6746905 Thin film transistor and manufacturing process therefor
06/08/2004US6746904 Electronic devices comprising thin film transistors
06/08/2004US6746903 Method for forming crystalline semiconductor layers, a method for fabricating thin film transistors, and a method for fabricating solar cells and active matrix liquid crystal devices
06/08/2004US6746902 Method to form relaxed sige layer with high ge content
06/08/2004US6746901 Semiconductor device and method of fabricating thereof
06/08/2004US6746900 Method for forming a semiconductor device having high-K gate dielectric material
06/08/2004US6746898 Integrated chip package structure using silicon substrate and method of manufacturing the same
06/08/2004US6746897 Fabrication process of semiconductor package and semiconductor package
06/08/2004US6746896 Process and material for low-cost flip-chip solder interconnect structures
06/08/2004US6746895 Method for encapsulating a multi-chip substrate array
06/08/2004US6746894 Ball grid array interposer, packages and methods
06/08/2004US6746893 Transistor with variable electron affinity gate and methods of fabrication and use
06/08/2004US6746891 Trilayered beam MEMS device and related methods
06/08/2004US6746888 Display and fabricating method thereof
06/08/2004US6746887 Method of preventing a data pad of an array substrate from overetching
06/08/2004US6746881 Method and device for controlling the thickness of a layer of an integrated circuit in real time
06/08/2004US6746880 Method for making electrical contact with a rear side of a semiconductor substrate during its processing
06/08/2004US6746879 Guard filter methodology and automation system to avoid scrap due to reticle errors
06/08/2004US6746878 Semiconductor device and method of manufacturing the same
06/08/2004US6746877 Encapsulation of ferroelectric capacitors
06/08/2004US6746876 Capacitor manufacturing method having dielectric formed before electrode
06/08/2004US6746875 Magnetic memory and method of its manufacture
06/08/2004US6746826 Method for an improved developing process in wafer photolithography
06/08/2004US6746822 Use of surface coupling agent to improve adhesion
06/08/2004US6746821 Polymer with molecular groups convertible into alkali soluble groups at a given temperature by acid-catalyzed cleavage reactions; allowing base to diffuse into the photoresist layer and heating; greater steepness and less roughness
06/08/2004US6746819 Article comprising photostructurable polyimide or polyimide mixture for adhesive layer with thickness of <1 mu m between photostructurable epoxy resin and metal or silicon
06/08/2004US6746818 (Meth)acrylates having lactone structure, polymers, photoresist compositions and patterning process
06/08/2004US6746813 Negative resist composition
06/08/2004US6746806 Lithography mask blank and method of manufacturing the same
06/08/2004US6746777 Substrate including base supporting interfacial bonding layer and thin film adaptive crystalline layer which can expand or contract its lattice constant along direction parallel to substrate surface when bonding layer is in liquid-like form
06/08/2004US6746726 Method for forming film
06/08/2004US6746722 Fluorine-containing phenylmaleimide derivative, polymer, chemically amplified resist composition, and method for pattern formation using the composition
06/08/2004US6746714 Pyrolysis of polysilazane-aluminum polymer
06/08/2004US6746616 Method and apparatus for providing etch uniformity using zoned temperature control
06/08/2004US6746615 Methods of achieving selective etching
06/08/2004US6746591 ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature
06/08/2004US6746589 Plating method and plating apparatus
06/08/2004US6746565 Semiconductor processor with wafer face protection
06/08/2004US6746559 Method and apparatus for separating composite member using fluid
06/08/2004US6746544 Simultaneously rinsing and drying a semiconductor substrate by the marongoni drying effect
06/08/2004US6746543 Cleaning bath; drying enclosure; sliding door closure
06/08/2004US6746540 Wafer support plate assembly having recessed upper pad and vacuum processing apparatus comprising the same
06/08/2004US6746539 Scanning deposition head for depositing particles on a wafer
06/08/2004US6746319 Measuring apparatus
06/08/2004US6746318 Workpiece carrier with adjustable pressure zones and barriers
06/08/2004US6746317 Methods and apparatuses for making and using planarizing pads for mechanical and chemical mechanical planarization of microelectronic substrates
06/08/2004US6746316 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
06/08/2004US6746314 Nitride CMP slurry having selectivity to nitride
06/08/2004US6746312 Polishing method and polishing apparatus
06/08/2004US6746310 Uniform thin films produced by magnetorheological finishing
06/08/2004US6746309 Generating block from silicon particles collected during waste water treatment; melting for recycling
06/08/2004US6746308 Dynamic lot allocation based upon wafer state characteristics, and system for accomplishing same