Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2004
10/07/2004US20040197960 Micro-scale interconnect device with internal heat spreader and method for fabricating same
10/07/2004US20040197959 Semiconductor device and method of manufacturing the same
10/07/2004US20040197958 Vapor deposition of benzotriazole (BTA) for protecting copper interconnects
10/07/2004US20040197957 Integrated sensor packages and methods of making the same
10/07/2004US20040197956 Memory expansion and chip scale stacking system and method
10/07/2004US20040197955 Methods for assembly and packaging of flip chip configured dice with interposer
10/07/2004US20040197954 Chip scale image sensor semiconductor package and method of fabrication
10/07/2004US20040197952 Methods for assembly and packaging of flip chip configured dice with interposer
10/07/2004US20040197951 Membrane IC fabrication
10/07/2004US20040197950 Methods and apparatus for microelectronic component manufacture
10/07/2004US20040197949 Anodic bonding method and electronic device having anodic bonding structure
10/07/2004US20040197946 Systems and methods for forming strontium-and/or barium-containing layers
10/07/2004US20040197945 Germanium compounds
10/07/2004US20040197944 Method of forming encapsulation structure for organic light-emitting device
10/07/2004US20040197943 Nanosilicon light-emitting element and manufacturing method thereof
10/07/2004US20040197942 Field emission backplate
10/07/2004US20040197940 Divot reduction in SIMOX layers
10/07/2004US20040197939 Method and apparatus for sub-micron device fabrication
10/07/2004US20040197938 Monitoring method of processing state and processing unit
10/07/2004US20040197937 Method of manufacturing ferroelectric substance thin film and ferroelectric memory using the ferroelectric substance thin film
10/07/2004US20040197884 in which a cavity of a protein is utilized, having a uniform particle diameter
10/07/2004US20040197713 Radiation sensitivity; heat treatment ; adjustable spacer
10/07/2004US20040197710 Forming a material layer on a substrate; forming a patterned photoresist layer onmaterial layer; forming silylated photoresist film around sidewall of the patterned photoresist layer; removing the patterned photoresist layer; removing material layer exposed by first silylated photoresist film, removing
10/07/2004US20040197708 Positive resist composition and method of forming resist pattern using the same
10/07/2004US20040197707 Positive resist composition and method of pattern formation using the same
10/07/2004US20040197702 Positive resist composition
10/07/2004US20040197676 Method for forming an opening in a light-absorbing layer on a mask
10/07/2004US20040197675 Stencil mask with charge-up prevention and method of manufacturing the same
10/07/2004US20040197673 Photo reticles using channel assist features
10/07/2004US20040197579 Magnetic element with insulating veils and fabricating method thereof
10/07/2004US20040197576 Adhesion layer for Pt on SiO2
10/07/2004US20040197541 Selective electroless deposition and interconnects made therefrom
10/07/2004US20040197492 CVD TiSiN barrier for copper integration
10/07/2004US20040197488 Plasma deposited selective wetting material
10/07/2004US20040197487 electrophotographing circuit boards without using exposure masks; diversified small-quantity production and shorter production cycle
10/07/2004US20040197485 plating bath of a double bath structure including an inner bath holding a plating solution, and an outer bath surrounding the inner bath and is in communication with it; and a heater in the outer bath; uniform temperature control; especially for electroless deposition of copper or silver
10/07/2004US20040197474 Method for enhancing deposition rate of chemical vapor deposition films
10/07/2004US20040197473 Method of applying adhesive
10/07/2004US20040197470 Organometallic compounds and their use as precursors for forming films and powders of metal or metal derivatives
10/07/2004US20040197433 Film removing apparatus, film removing method and substrate processing system
10/07/2004US20040197261 Potassium hydrogen peroxymonosulfate solutions
10/07/2004US20040197184 Workpiece transport apparatus
10/07/2004US20040197183 Exchanger for tray feeder
10/07/2004US20040197179 Method and apparatus for vertical transfer of semiconductor substrates between cleaning modules
10/07/2004US20040197174 Method and apparatus for loading a batch of wafers into a wafer boat
10/07/2004US20040197169 Vacuum processing apparatus and semiconductor manufacturing line using the same
10/07/2004US20040196985 Electronic apparatus having a detachable speaker unit
10/07/2004US20040196877 Multi-wavelength laser device
10/07/2004US20040196744 Control device for reversing the direction of magnetisation without an external magnetic field
10/07/2004US20040196731 Semiconductor integrated ciruit device
10/07/2004US20040196720 [flash memory with self-aligned split gate and methods for fabricating and for operating the same]
10/07/2004US20040196711 Integrated semiconductor circuit having a cell array having a multiplicity of memory cells
10/07/2004US20040196705 Semiconductor memory device
10/07/2004US20040196698 Semiconductor memory device having improved data retention
10/07/2004US20040196697 Method of improving surface mobility before electroplating
10/07/2004US20040196695 Nonvolatile memory device and semiconductor device
10/07/2004US20040196694 Bi-directional read/program non-volatile floating gate memory cell with independent controllable control gates, and array thereof, and method of formation
10/07/2004US20040196685 Transistor and semiconductor memory using the same
10/07/2004US20040196684 Semiconductor integrated circuit device, storage medium on which cell library is stored and designing method for semiconductor intergrated circuit
10/07/2004US20040196683 Computer systems, processes for turning a SRAM cell off, and processes for writing a SRAM cell and processes for reading data from a SRAM cell
10/07/2004US20040196674 Integrated circuit
10/07/2004US20040196638 Method for reducing shrinkage during sintering low-temperature confired ceramics
10/07/2004US20040196634 Metal ball attachment of heat dissipation devices
10/07/2004US20040196618 Semiconductor device and method of manufacturing the same
10/07/2004US20040196616 Wafer platen equipped with electrostatic clamp, wafer backside gas cooling, and high voltage operation capability for plasma doping
10/07/2004US20040196614 Electrostatic chuck and production method therefor
10/07/2004US20040196613 Guard for electrostatic chuck
10/07/2004US20040196601 Electrostatic discharge protecting circuit using flash cell
10/07/2004US20040196561 Laser optical apparatus
10/07/2004US20040196464 Apparatus and method for evaluating semiconductor material
10/07/2004US20040196447 Photomask, flare measuring mechanism, flare measuring method, and exposing method
10/07/2004US20040196446 Exposure method and apparatus
10/07/2004US20040196444 Method for adjusting projection optical apparatus
10/07/2004US20040196329 Method for the printing of homogeneous electronic material with a multi-ejector print head
10/07/2004US20040196220 Light-emitting apparatus and method of manufacturing light-emitting apparatus
10/07/2004US20040196217 Drive circuit for plasma display panel
10/07/2004US20040196138 Layout and method to improve mixed-mode resistor performance
10/07/2004US20040196095 Charge pump-type booster circuit
10/07/2004US20040196073 Voltage detection circuit
10/07/2004US20040196063 Minimizing end boundary resistance in a programmable resistor of an integrated circuit
10/07/2004US20040196058 Method for fabricating a probe pin for testing electrical characteristics of an apparatus
10/07/2004US20040196031 Interconnection pattern inspection method, manufacturing method of semiconductor device and inspection apparatus
10/07/2004US20040195785 Chuck rollers and pins for substrate cleaning and drying system
10/07/2004US20040195737 Method and device for heat treating substrates
10/07/2004US20040195704 Alignment marks and manufacturing method for the same
10/07/2004US20040195701 Electronic package and method
10/07/2004US20040195699 Semiconductor package with recess for die
10/07/2004US20040195698 Semiconductor device having a contact window and fabrication method thereof
10/07/2004US20040195696 Integrated circuit die having a copper contact and method therefor
10/07/2004US20040195695 Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy
10/07/2004US20040195694 BEOL decoupling capacitor
10/07/2004US20040195693 Forming a porous dielectric layer
10/07/2004US20040195692 Integrated circuit
10/07/2004US20040195691 Circuit module and method for manufacturing the same
10/07/2004US20040195689 Butting contact structure and method incorporating with a silicide inserted between a contact region and a conductor for a small contact window
10/07/2004US20040195688 Custom electrodes for molecular memory and logic devices
10/07/2004US20040195687 Semiconductor device and method for producing the same
10/07/2004US20040195686 Semiconductor device and method of manufacturing the same
10/07/2004US20040195684 At least one opening may be formed through the RF component at least to the semiconductor substrate
10/07/2004US20040195660 Composition for forming porous film, porous film and method for forming the same, interlayer insulator film, and semiconductor device