Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2004
09/30/2004US20040192047 Method of pre-etching glass substrate for reducing releasing time
09/30/2004US20040192046 Highly selective silicon oxide etching compositions
09/30/2004US20040192045 Apparatus and methods for maskless pattern generation
09/30/2004US20040192044 Integrated micro fuel processor and flow delivery infrastructure
09/30/2004US20040192043 Surface treatment method for a compound semiconductor layer and method of fabrication of a semiconductor device
09/30/2004US20040192042 Doping of source-drain contacts
09/30/2004US20040192041 UV nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
09/30/2004US20040192038 Methods for forming wiring and electrode
09/30/2004US20040192037 Method and apparatus for selective deposition
09/30/2004US20040192036 Method for forming a metal oxide film
09/30/2004US20040192035 Method of manufacturing semiconductor device
09/30/2004US20040192034 Method of manufacturing semiconductor device
09/30/2004US20040192033 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
09/30/2004US20040192032 Semiconductor device and manufacturing method thereof
09/30/2004US20040192031 Method for introducing structures which have different dimensions into a substrate
09/30/2004US20040192030 Method and apparatus to form a planarized cu interconnect layer using electroless membrane deposition
09/30/2004US20040192029 Systems and methods for electrically isolating portions of wafers
09/30/2004US20040192028 Method of fabricating integrated circuitry
09/30/2004US20040192027 Semiconductor device with fully self-aligned local interconnects, and method for fabricating the device
09/30/2004US20040192026 Method of forming metal plug
09/30/2004US20040192024 Semiconductor device and method of manufacturing the same, semiconductor wafer, circuit board and electronic instrument
09/30/2004US20040192023 Methods of forming conductive patterns using barrier layers
09/30/2004US20040192022 Semiconductor configuration with UV protection
09/30/2004US20040192021 Method of producing adhesion-barrier layer for integrated circuits
09/30/2004US20040192019 Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method
09/30/2004US20040192018 Polysilicon opening polish
09/30/2004US20040192017 Device performance improvement by heavily doped pre-gate and post polysilicon gate clean
09/30/2004US20040192016 Method for fabricating a plurality of semiconductor bodies, and electronic semiconductor body
09/30/2004US20040192014 Crystalline semiconductor film, method of manufacturing the same, and semiconductor device
09/30/2004US20040192013 Method for fabricating single crystal silicon film
09/30/2004US20040192012 Method for manufacturing semiconductor chip
09/30/2004US20040192011 Chip attachment in an RFID tag
09/30/2004US20040192010 Method of reducing trench aspect ratio
09/30/2004US20040192009 Trench isolation employing a doped oxide trench fill
09/30/2004US20040192008 Semiconductor device including interconnection and capacitor, and method of manufacturing the same
09/30/2004US20040192007 Method for fabricating metallic bit-line contacts
09/30/2004US20040192006 Layered resistance variable memory device and method of fabrication
09/30/2004US20040192005 Method for fabricating bipolar transistor
09/30/2004US20040192004 Semiconductor device and manufacturing method thereof
09/30/2004US20040192003 Method for forming a metallization layer
09/30/2004US20040192002 Method for fabricating a heterojunction bipolar transistor
09/30/2004US20040192001 Bipolar device and method of manufacturing the same including pre-treatment using germane gas
09/30/2004US20040192000 Method of producing semiconductor device and semiconductor device
09/30/2004US20040191999 Semiconductor structure and method of fabrication
09/30/2004US20040191998 Preserving teos hard mask using cor for raised source-drain including removable/disposable spacer
09/30/2004US20040191997 Method for manufacturing semiconductor device
09/30/2004US20040191996 Method for manufacturing semiconductor device and semiconductor device
09/30/2004US20040191995 Method of manufacturing a semiconductor device
09/30/2004US20040191994 Trench transistor with chained implanted body
09/30/2004US20040191993 Nonvolatile semiconductor memory device and manufacturing method thereof
09/30/2004US20040191992 Flash memory cell and fabrication thereof
09/30/2004US20040191991 Semiconductor integrated circuit and method for manufacturing the same
09/30/2004US20040191990 Self aligned method of forming a semiconductor memory array of floating gate memory cells with buried bit-line and raised source line
09/30/2004US20040191989 UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL processing
09/30/2004US20040191988 Novel technique to quench electrical defects in aluminum oxide film
09/30/2004US20040191987 Method of forming nonvolatile memory device
09/30/2004US20040191986 Nonvolatile memory with pedestals
09/30/2004US20040191985 Method for fabricating memory cell structure employing contiguous gate and capacitor dielectric layer
09/30/2004US20040191984 Ram
09/30/2004US20040191983 Capacitor with high dielectric constant materials and method of making
09/30/2004US20040191981 Methods of fabricating an MRAM device using chemical mechanical polishing
09/30/2004US20040191980 Multi-corner FET for better immunity from short channel effects
09/30/2004US20040191979 Semiconductor integrated circuit device having single-element type non-volatile memory elements
09/30/2004US20040191978 Methods of making electromechanical three-trace junction devices
09/30/2004US20040191977 Composite etching stop in semiconductor process integration
09/30/2004US20040191975 Nitrogen controlled growth of dislocation loop in stress enhanced transistor
09/30/2004US20040191974 Method for fabricating dual-metal gate device
09/30/2004US20040191973 Manufacturing method of semiconductor device
09/30/2004US20040191972 Thin film transistor substrate and its manufacture
09/30/2004US20040191971 Method for fabrication of MOSFET with buried gate
09/30/2004US20040191969 Method for fabricating thin film transistor liquid crystal display
09/30/2004US20040191968 [method of fabricating a thin film transistor array panelsubstrate]
09/30/2004US20040191967 Method of manufacturing a semiconductor integrated circuit and semiconductor integrated circuit
09/30/2004US20040191966 Method for Manufacturing Buried Insulating Layer Type Single Crystal Silicon Carbide Substrate and Manufacturing Device for the Same
09/30/2004US20040191965 Fabricating method of thin film transistor
09/30/2004US20040191964 Packaged microelectronic component assemblies
09/30/2004US20040191963 Encapsulation of thin-film electronic devices
09/30/2004US20040191962 Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices
09/30/2004US20040191961 Method of forming non-volatile resistance variable devices and method of forming a programmable memory cell of memory circuitry
09/30/2004US20040191960 Vapor-phase growth method, semiconductor manufacturing method and semiconductor device manufacturing method
09/30/2004US20040191958 Method for connecting an integrated circuit to a substrate and corresponding arrangement
09/30/2004US20040191957 Wafer scale package and method of assembly
09/30/2004US20040191956 Print mask and method of manufacturing electronic components using the same
09/30/2004US20040191955 Wafer-level chip scale package and method for fabricating and using the same
09/30/2004US20040191954 Wire bonding for thin semiconductor package
09/30/2004US20040191952 Method of manufacturing high-mobility organic thin films using organic vapor phase deposition
09/30/2004US20040191951 Fabrication method for organic semiconductor transistor having organic polymeric gate insulating layer
09/30/2004US20040191949 Zinc oxide film treatment method and method of manufacturing photovoltaic device utilizing the same
09/30/2004US20040191948 Wafer-scale manufacturing method
09/30/2004US20040191946 Novel sacrificial layers for use in fabrications of microelectromechanical devices
09/30/2004US20040191942 Method of fabricating nitride semiconductor device
09/30/2004US20040191940 Diffusion bonding method for microchannel plates
09/30/2004US20040191939 Semiconductor light emitting device and its manufacture
09/30/2004US20040191937 Barrier layers for microelectromechanical systems
09/30/2004US20040191936 Real-time in-line testing of semiconductor wafers
09/30/2004US20040191935 Detection assembly and lithographic projection apparatus provided with such a detection assembly
09/30/2004US20040191933 Silicon-on-insulator devices and methods for fabricating the same
09/30/2004US20040191932 Plasma Processing method
09/30/2004US20040191931 Method of implanting a substrate and an ion implanter for performing the method
09/30/2004US20040191930 Methods of forming ferroelectric capacitors using separate polishing processes and ferroelectric capacitors so formed