Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2004
10/19/2004US6806124 Method for reducing the contact resistance in organic field-effect transistors by applying a reactive intermediate layer which dopes the organic semiconductor layer region-selectively in the contact region
10/19/2004US6806123 Methods of forming isolation regions associated with semiconductor constructions
10/19/2004US6806121 Interconnect structure for an integrated circuit and corresponding fabrication method
10/19/2004US6806119 Method of balanced coefficient of thermal expansion for flip chip ball grid array
10/19/2004US6806118 Electrode connection method, electrode surface activation apparatus, electrode connection apparatus, connection method of electronic components and connected structure
10/19/2004US6806117 Methods of testing/stressing a charge trapping device
10/19/2004US6806114 Broadly tunable distributed bragg reflector structure processing
10/19/2004US6806111 Semiconductor component and method of manufacture
10/19/2004US6806109 Method of fabricating nitride based semiconductor substrate and method of fabricating nitride based semiconductor device
10/19/2004US6806105 Method of measuring meso-scale structures on wafers
10/19/2004US6806104 Method for detecting defect of semiconductor device
10/19/2004US6806103 Method for fabricating semiconductor devices that uses efficient plasmas
10/19/2004US6806102 Method of fabricating semiconductor integrated circuit device
10/19/2004US6806101 Ferroelectric capacitor plasma charging monitor
10/19/2004US6806099 Process for producing polycrystalline silicon film by crystallizing on amorphous silicon film by light irradiation
10/19/2004US6806098 Method and device for assessing surface uniformity of semiconductor device treated by CMP
10/19/2004US6806097 Method for fabricating ferroelectric memory cells
10/19/2004US6806095 Method of plasma etching of high-K dielectric materials with high selectivity to underlying layers
10/19/2004US6806038 Forming a conductive trace on a substrate. the conductive trace is patterned with a photoresist mask and etched, thereby forming a polymer layer on a top surface and sidewalls of the photoresist mask and on sidewalls of the conductive trace and
10/19/2004US6806037 Method for producing and/or renewing an etching mask
10/19/2004US6806036 Forming a polysilicon layer with a gate insulating layer on it, patterning a pattern on the gate, implanting impurities. forming a cover layer, and thermally annealing
10/19/2004US6806035 Wafer serialization manufacturing process for read/write heads using photolithography and selective reactive ion etching
10/19/2004US6806029 Pattern formation material and pattern formation method
10/19/2004US6806026 Polymer of a fluorinated hydroxyalkyl acrylate
10/19/2004US6806025 Photoresist monomers, polymers thereof and photoresist compositons containing the same
10/19/2004US6806023 Positive radiation-sensitive composition
10/19/2004US6806008 Method for adjusting a temperature in a resist process
10/19/2004US6805998 Method and apparatus for integrated-battery devices
10/19/2004US6805982 Epitaxial substrates and semiconductor devices
10/19/2004US6805974 Coupling electroconductive pads
10/19/2004US6805962 Method of creating high-quality relaxed SiGe-on-insulator for strained Si CMOS applications
10/19/2004US6805952 Low contamination plasma chamber components and methods for making the same
10/19/2004US6805829 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows
10/19/2004US6805812 Phosphono compound-containing polishing composition and method of using same
10/19/2004US6805808 Method for separating chips from diamond wafer
10/19/2004US6805807 Adaptive GCIB for smoothing surfaces
10/19/2004US6805791 Ozonated water flow and concentration control apparatus
10/19/2004US6805786 Precious alloyed metal solder plating process
10/19/2004US6805778 Contact assembly for supplying power to workpieces during electrochemical processing
10/19/2004US6805754 Device and method for processing substrates
10/19/2004US6805752 Controlled heating; heat exchanging; vaporization of acidicresidues
10/19/2004US6805749 Reator block with gas streams emanating from plurality of passageways positioned close to upper and lower surfaces
10/19/2004US6805748 Substrate processing system with load-lock chamber
10/19/2004US6805744 Method of producing device quality (Al)InGaP alloys on lattice-mismatched substrates
10/19/2004US6805743 Method for manufacturing single-crystal-silicon wafers
10/19/2004US6805742 Silicon semiconductor substrate and process for producing the same
10/19/2004US6805616 Wafer planarization apparatus and planarization method thereof
10/19/2004US6805615 Particle size distribution comprising ceria, alumina, titania, and/or tantalum oxide; abrasive slurry
10/19/2004US6805614 Multilayered CMP stop for flat planarization
10/19/2004US6805613 Multiprobe detection system for chemical-mechanical planarization tool
10/19/2004US6805602 Method of manufacturing flat panel display device
10/19/2004US6805541 Seals body onto semiconductor chip mounted on carrier; mask set with apertures; drive, squeegee causes movement of fluidizing resin to be extruded
10/19/2004US6805487 Holder driving unit
10/19/2004US6805466 Lamphead for a rapid thermal processing chamber
10/19/2004US6805338 Semiconductor wafer chuck assembly for a semiconductor processing device
10/19/2004US6805283 Lithography rework analysis method and system
10/19/2004US6805279 Fluxless bumping process using ions
10/19/2004US6805139 Hydrogen gas flow; supplying activation energy to remove cross-linked photoresist crust using ion bombardment; low pressure, low temperature; prevents popping
10/19/2004US6805138 Semiconductor device production method and semiconductor device production apparatus
10/19/2004US6805137 Method for removing contamination particles from substrates
10/19/2004US6805135 Cleaning fluid and cleaning method for component of semiconductor-treating apparatus
10/19/2004US6804900 Method for drying microstructure member
10/19/2004US6804851 Holder for semiconductor wafers in a brush-cleaning installation
10/19/2004CA2302907C Plaster solder array using injection molded solder
10/14/2004WO2004089048A1 Method for manufacturing an electronic module and an electronic module
10/14/2004WO2004089047A1 Electric connecting part
10/14/2004WO2004089039A1 Heater for semiconductor manufacturing and inspecting equipment
10/14/2004WO2004088795A1 Anisotropic electrically conductive film and method of producing the same
10/14/2004WO2004088760A2 Led power package
10/14/2004WO2004088757A1 Semiconductor device and method for fabricating the same
10/14/2004WO2004088755A1 Nanowhiskers with pn junctions and methods of fabricating thereof
10/14/2004WO2004088754A1 Memory cell, memory using the memory cell, memory cell manufacturing method, and memory recording/reading method
10/14/2004WO2004088753A1 Tunnel transistor having spin-dependent transfer characteristic and nonvolatile memory using same
10/14/2004WO2004088752A1 Magnetic memory device and magnetic memory device write method
10/14/2004WO2004088751A1 Magnetic memory cell, magnetic memory device, and magnetic memory device manufacturing method
10/14/2004WO2004088749A1 Semiconductor integrated circuit device and method for controlling semiconductor integrated circuit device
10/14/2004WO2004088747A1 Semiconductor device
10/14/2004WO2004088746A2 Method and apparatus to form a planarized cu interconnect layer using electroless membrane deposition
10/14/2004WO2004088745A1 Semiconductor device
10/14/2004WO2004088744A1 Silicon wafer heat treatment jig, and silicon wafer heat treatment method
10/14/2004WO2004088743A1 Substrate transportation system
10/14/2004WO2004088742A1 Wafer transportation system
10/14/2004WO2004088741A1 Wafer transportation system
10/14/2004WO2004088740A1 Wafer transportation system
10/14/2004WO2004088739A2 Real-time in-line testing of semiconductor wafers
10/14/2004WO2004088738A1 Laminate
10/14/2004WO2004088737A1 Electronic device producing method
10/14/2004WO2004088735A1 Cleaning method, method for removing foreign particle, cleaning apparatus and cleaning liquid
10/14/2004WO2004088734A1 Method of heat treatment and heat treatment apparatus
10/14/2004WO2004088733A1 Dummy wafer
10/14/2004WO2004088732A1 Gas-cooled clamp for rapid thermal processing
10/14/2004WO2004088731A2 Methods for fabricating three-dimensional all organic interconnect structures
10/14/2004WO2004088730A1 Method and system for monitoring rf impedance to determine the parameters of a wafer on an electrostatic chuck
10/14/2004WO2004088729A1 Chemical processing system and method
10/14/2004WO2004088728A2 Method of manufacturing a flexible electronic device and flexible device
10/14/2004WO2004088726A2 Isotropic etch process for top plate pull-back in a metal- insulator- metal capacitor
10/14/2004WO2004088725A2 Method for the multi-stage production of diffusion soldered connections for power components comprising semiconductor chips
10/14/2004WO2004088723A2 Polycrystalline germanium-based waveguide detector integrated on a thin silicon-on-insulator (soi) platform
10/14/2004WO2004088721A2 Optimized model and parameter selection for optical metrology
10/14/2004WO2004088719A2 Nanotube-on-gate fet structures and applications
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