Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2004
10/14/2004WO2004088718A2 In-situ gas blending and dilution system for delivery of dilute gas at a predetermined concentration
10/14/2004WO2004088717A2 Superjunction device and method of manufacture therefore
10/14/2004WO2004088715A2 Tapered structure for providing coupling between external optical device and planar optical waveguide and method of forming the same
10/14/2004WO2004088581A1 Unauthorized access prevention method
10/14/2004WO2004088571A2 Attachment of rfid modules to antennas
10/14/2004WO2004088570A2 Chip attachment in an rfid tag
10/14/2004WO2004088429A1 Resist composition for liquid immersion exposure process and method of forming resist pattern therewith
10/14/2004WO2004088427A1 Negative resist composition and process for formation of resist patterns
10/14/2004WO2004088425A2 Contact masks and lithographic patterning methods using said masks
10/14/2004WO2004088421A1 Mask blank, mask blank manufacturing method, transfer mask manufacturing method, and semiconductor device manufacturing method
10/14/2004WO2004088420A1 Method for producing mask blank and method for producing transfer mask
10/14/2004WO2004088419A1 Mask blanks production method and mask production method
10/14/2004WO2004088418A1 Method of manufacturing mask blank
10/14/2004WO2004088417A1 Photomask pattern inspecting method, photomask pattern inspecting device, and photomask pattern inspecting program
10/14/2004WO2004088415A2 Photometrically modulated delivery of reagents
10/14/2004WO2004087990A1 Plasma cvd method using ultrashort wave and plasma cvd apparatus
10/14/2004WO2004087828A1 Adhesive tape for electronic member
10/14/2004WO2004087773A1 Auxiliary for forming fine pattern and process for producing the same
10/14/2004WO2004087569A2 Thermal process for reducing the concentration of dinitrogen difluoride and dinitrogen tetrafluoride in nitrogen trifluoride
10/14/2004WO2004087563A2 Barrier layers for microelectromechanical systems
10/14/2004WO2004087561A2 Novel sacrificial layers for use in fabrications of microelectromechanical devices
10/14/2004WO2004087535A1 Container for semiconductor wafer
10/14/2004WO2004087390A1 Laser cutting method of fragile material
10/14/2004WO2004086845A2 Flip-chip assembley with thin underfill and thick solder mask
10/14/2004WO2004073058A3 Flash memory devices
10/14/2004WO2004066389A3 Floating gate isolation and method of making
10/14/2004WO2004061921A3 Strained silicon-on-insulator (ssoi) and method to form the same
10/14/2004WO2004061902A3 Method and apparatus for monitoring a material processing system
10/14/2004WO2004057654A3 Method of manufacturing a semiconductor device
10/14/2004WO2004055866A3 Programmable interconnect cell for configuring a field programmable gate array
10/14/2004WO2004053982A3 Semiconductor memory and fabrication method
10/14/2004WO2004049407A3 Plate through mask for generating alignment marks of mim capacitors
10/14/2004WO2004044956A3 Rear interconnect blade for rack mounted systems
10/14/2004WO2004036630A3 Rapid thermal processing system for integrated circuits
10/14/2004WO2004034449A3 Transparent oxide semiconductor thin film transistors
10/14/2004WO2004032831A3 Metalization of microtubules
10/14/2004WO2004025697B1 Thermal process station with heated lid
10/14/2004WO2004023211A3 Exposure method, exposure mask, and exposure apparatus
10/14/2004WO2004020686A3 A hybrid beam deposition system and methods for fabricating zno films, p-type zno films, and zno-based ii-vi compound semiconductor devices
10/14/2004WO2004015736A3 Low loss rf bias electrode for a plasma reactor with enhanced wafer edge rf coupling and highly efficient wafer cooling
10/14/2004WO2004010222A3 Method for the production of photoresist structures
10/14/2004WO2004008505A3 Semiconductor substrate damage protection system
10/14/2004WO2003105227A3 Data carrier comprising an integrated circuit with an esd protection circuit
10/14/2004WO2003096276A3 Graphics engine converting individual commands to spatial image information, and electrical device and memory incorporating the graphics engine
10/14/2004WO2003096275A3 Graphics engine with edge draw unit, and electrical device and memory incorporating the graphics engine
10/14/2004WO2003038882A8 Method and pad for polishing wafer
10/14/2004US20040205425 Method and system for efficient and accurate processing of a discrete time input signal
10/14/2004US20040204901 Position detecting method and apparatus
10/14/2004US20040204897 Photometrically modulated delivery of reagents
10/14/2004US20040204334 Cleaning sheet, carrying member with a cleaning function and method of cleaning substrate processing equipment
10/14/2004US20040204329 Cleaning liquid composition for semiconductor substrate
10/14/2004US20040204328 exposing the substrate comprising photoresist coatings to radiation source, to form patterns, then applying developer solutions, rinsing with water and contacting with a mixture of aqueous, nonaqueous solvents and surfactants, to stabilize the patterns and reduce surface roughness ; surface tension
10/14/2004US20040203328 Measuring apparatus
10/14/2004US20040203323 Chemical mechanical polishing apparatus
10/14/2004US20040203321 Manufacturing method of semiconductor device, automatic operation method and automatic operation system of semiconductor manufacturing apparatus, and automatic operation method of CMP apparatus
10/14/2004US20040203262 Helical microelectronic contact and method for fabricating same
10/14/2004US20040203257 Processing method of semiconductor substrate
10/14/2004US20040203255 Method of forming Si-containing thin film
10/14/2004US20040203254 Modulated temperature method of atomic layer deposition (ALD) of high dielectric constant films
10/14/2004US20040203253 Method of forming a dielectric layer
10/14/2004US20040203252 CMP slurry for nitride and CMP method using the same
10/14/2004US20040203251 Method and apparatus for removing a halogen-containing residue
10/14/2004US20040203250 Method for manufacturing non-volatile memory cells on a semiconductor substrate
10/14/2004US20040203249 Dummy copper deprocessing
10/14/2004US20040203248 Laser apparatus, laser irradiation method, and manufacturing method of semiconductor device
10/14/2004US20040203247 Method of reducing the aspect ratio of a trench
10/14/2004US20040203246 High k gate insulator removal
10/14/2004US20040203245 Ceric-ion slurry for use in chemical-mechanical polishing
10/14/2004US20040203244 Electronic component and fabricating method
10/14/2004US20040203243 Polysilicon etch useful during the manufacture of a semiconductor device
10/14/2004US20040203242 System and method for performing a metal layer RIE process
10/14/2004US20040203241 Chemical-mechanical planarization slurries and powders and methods for using same
10/14/2004US20040203240 Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device
10/14/2004US20040203238 Process for producing an etching mask on a microstructure, in particular a semiconductor structure with trench capacitors, and corresponding use of the etching mask
10/14/2004US20040203236 Submicron semiconductor device and a fabricating method thereof
10/14/2004US20040203235 Formation method for metal element, production method for semiconductor device, production method for electronic device, semiconductor device, electronic device, and electronic equipment
10/14/2004US20040203234 MOCVD of tungsten nitride thin films using W(CO)6 and NH3 for Copper barrier applications
10/14/2004US20040203233 Compositions for depositing a metal layer and methods of forming a metal layer using the same
10/14/2004US20040203232 Methods for treating pluralities of discrete semiconductor substrates
10/14/2004US20040203231 Method for forming a semiconductor device with a contact plug
10/14/2004US20040203230 Semiconductor device having multilayered conductive layers
10/14/2004US20040203229 Salicide formation method
10/14/2004US20040203228 Method of forming a tungsten plug
10/14/2004US20040203227 Ceric-ion slurry for use in chemical-mechanical polishing
10/14/2004US20040203226 Semiconductor device with reduced interconnection capacity
10/14/2004US20040203225 Method for fabricating isolation layer in semiconductor device
10/14/2004US20040203224 Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby
10/14/2004US20040203223 Method to form Cu/OSG dual damascene structure for high performance and reliable interconnects
10/14/2004US20040203222 Method for forming gate electrode of semiconductor device
10/14/2004US20040203221 Electronic device manufacturing method
10/14/2004US20040203220 Method of making iron silicide and method of making photoelectric transducer
10/14/2004US20040203219 Laser apparatus and laser annealing method
10/14/2004US20040203218 Methods for forming polycrystalline silicon layer and fabricating polycrystalline silicon thin film transistor
10/14/2004US20040203217 Bottom oxide formation process for preventing formation of voids in trench
10/14/2004US20040203216 [fabrication method for shallow trench isolation region]
10/14/2004US20040203215 Method for forming bottle-shaped trenches
10/14/2004US20040203214 Method of manufacturing semiconductor device
10/14/2004US20040203213 Method for manufacturing an MOS varactor
10/14/2004US20040203212 Implementation of Si-Ge HBT module with CMOS process
10/14/2004US20040203211 Self-aligned contact for silicon-on-insulator devices
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