| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/30/2004 | WO2004084297A1 Method of conveyance positioning for workpiece processing systems and, workpiece processing system |
| 09/30/2004 | WO2004084296A1 Probe positioning and bonding device and probe bonding method |
| 09/30/2004 | WO2004084294A1 Method of manufacturing a semiconductor device, semiconductor device obtained by means of said method, and device for carrying outsuch a method |
| 09/30/2004 | WO2004084293A1 Parts packaging device and parts packaging method |
| 09/30/2004 | WO2004084292A1 Finfet-type semiconductor device and method for fabricating the same |
| 09/30/2004 | WO2004084291A1 Semiconductor device and method for manufacturing semiconductor device |
| 09/30/2004 | WO2004084290A1 A nitrogen-free hard mask over low k dielectric |
| 09/30/2004 | WO2004084289A1 Substrate treating apparatus and method of substrate treatment |
| 09/30/2004 | WO2004084288A1 Process for production of etching or cleaning fluids |
| 09/30/2004 | WO2004084287A1 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry |
| 09/30/2004 | WO2004084286A1 Film forming mehtod and film forming apparatus for semiconductor device |
| 09/30/2004 | WO2004084285A1 Film forming method and film forming apparatus for semiconductor device |
| 09/30/2004 | WO2004084284A1 Film forming method and apparatus |
| 09/30/2004 | WO2004084283A1 Method of growing semiconductor crystal |
| 09/30/2004 | WO2004084282A1 Bifacial structure for tandem solar cell formed with amorphous semiconductor materials |
| 09/30/2004 | WO2004084280A2 Processing system and method for treating a substrate |
| 09/30/2004 | WO2004084278A1 Device and method for wet treating disc-shaped articles |
| 09/30/2004 | WO2004084275A2 Method for making group iii nitride devices and devices produced thereby |
| 09/30/2004 | WO2004084271A2 Method and apparatus for thermally insulating adjacent temperature controlled processing chambers |
| 09/30/2004 | WO2004084269A2 Low dielectric materials and methods of producing same |
| 09/30/2004 | WO2004084268A2 Epitaxial semiconductor deposition methods and structures |
| 09/30/2004 | WO2004084267A2 System, method and apparatus for improved local dual-damascene planarization |
| 09/30/2004 | WO2004084266A2 System, method and apparatus for improved global dual-damascene planarization |
| 09/30/2004 | WO2004084264A2 DUAL STRAIN-STATE SiGe LAYERS FOR MICROELECTRONICS |
| 09/30/2004 | WO2004084239A1 Allowance method for point to ground resistance on tray |
| 09/30/2004 | WO2004083961A1 Substrate for reticle and method of manufacturing the substrate, and mask blank and method of manufacturing the mask blank |
| 09/30/2004 | WO2004083901A2 Detection of macro-defects using micro-inspection inputs |
| 09/30/2004 | WO2004083759A2 Apparatus and method of forming channels in a heat-exchanging device |
| 09/30/2004 | WO2004083495A2 Ultra low k (ulk) sicoh film and method |
| 09/30/2004 | WO2004083490A2 Methods and apparatus for patterned deposition of nanostructure-containing materials by self-assembly and related articles |
| 09/30/2004 | WO2004083482A1 Copper alloy sputtering target process for producing the same and semiconductor element wiring |
| 09/30/2004 | WO2004083328A2 Slurry compositions for use in a chemical-mechanical planarization process having non-spherical abrasive particles |
| 09/30/2004 | WO2004082890A1 Wafer-retaining carrier, double side-grinding device using the same, and double side-grinding method for wafer |
| 09/30/2004 | WO2004082857A1 Systems and methods for cleaning semiconductor substrates using a reduced volume of liquid |
| 09/30/2004 | WO2004082821A2 Processing system and method for thermally treating a substrate |
| 09/30/2004 | WO2004082820A2 Processing system and method for chemically treating a substrate |
| 09/30/2004 | WO2004082730A2 Protective sheath for a cannula |
| 09/30/2004 | WO2004068572A3 Method for producing a semiconductor component |
| 09/30/2004 | WO2004068561A3 Method for polishing a shallow trench isolation using an amorphous carbon polish-stop layer |
| 09/30/2004 | WO2004066369A3 Carrier, holder, laser cutting device and method for separating semiconductor products using laser light |
| 09/30/2004 | WO2004066368A3 Shallow trench isolation process for strained silicon processes |
| 09/30/2004 | WO2004059751A3 Methods of forming semiconductor mesa structures including self-aligned contact layers and related devices |
| 09/30/2004 | WO2004059739A3 Memory architecture with series grouped memory cells |
| 09/30/2004 | WO2004059708A3 Structure and method for bonding to copper interconnect structures |
| 09/30/2004 | WO2004055922A3 Method for the production of organic field effect transistors with a top contact architecture made of conductive polymers |
| 09/30/2004 | WO2004054003B1 High efficiency, monolithic multijunction solar cells containing lattice-mismatched materials and methods of forming same |
| 09/30/2004 | WO2004050728A3 Method of producing (meth) acrylic acid derivative polymer for resist |
| 09/30/2004 | WO2004042781A3 Thin film transistor array panel |
| 09/30/2004 | WO2004035105A3 Polymer microneedles |
| 09/30/2004 | WO2004034445B1 A method for plasma etching performance enhancement |
| 09/30/2004 | WO2004032593A3 Extremely thin substrate support |
| 09/30/2004 | WO2004030045A3 Semiconductor device processing |
| 09/30/2004 | WO2004025713A9 Substrate end effector |
| 09/30/2004 | WO2004021227A3 Extracting wiring parasitics for filtered interconnections in an integrated circuit |
| 09/30/2004 | WO2004010465A3 Thin dielectric formation by steam oxidation |
| 09/30/2004 | WO2003014979A3 Method for selection of parameters for implant anneal of patterned semiconductor substrates and specification of a laser system |
| 09/30/2004 | WO2002087825A8 Integrated endpoint detection system with optical and eddy current monitoring |
| 09/30/2004 | US20040194049 Method and system for designing IC |
| 09/30/2004 | US20040194047 Layout design apparatus |
| 09/30/2004 | US20040194044 Device for creating timing constraints |
| 09/30/2004 | US20040194042 Method and apparatus of evaluating layer matching deviation based on CAD information |
| 09/30/2004 | US20040193991 Semiconductor integrated circuit including operation test circuit and operation test method thereof |
| 09/30/2004 | US20040193984 Signature Cell |
| 09/30/2004 | US20040193437 Parts management system and method and parts management program and storage medium |
| 09/30/2004 | US20040193383 Computer chip heat responsive method and apparatus |
| 09/30/2004 | US20040193381 Method for analyzing wafer test parameters |
| 09/30/2004 | US20040193301 Inventory control via a utility bill of materials (BOM) to minimize resource consumption |
| 09/30/2004 | US20040193300 Systems and methods for transferring small lot size substrate carriers between processing tools |
| 09/30/2004 | US20040192804 Photosensitive resin composition |
| 09/30/2004 | US20040192572 comprises carbon dioxide, additive (tetramethylammoniumfluoride) for removing residues, inhibitor (ethylene glycol) of residues, and co-solvent for dissolving additive and inhibitor in carbon dioxide at pressurized fluid conditions; for removal of photoresists during semiconductor processing |
| 09/30/2004 | US20040192176 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads |
| 09/30/2004 | US20040192174 Method for controlling PH during planarization and cleaning of microelectronic substrates |
| 09/30/2004 | US20040192172 Slurry of nonoxidized particles and oxidized particles and separation of particles for semiconductors |
| 09/30/2004 | US20040192171 Method of producing a glass substrate for a mask blank and method of producing a mask blank |
| 09/30/2004 | US20040192168 Arrangement and method for conditioning a polishing pad |
| 09/30/2004 | US20040192154 Apparatus and method for manufacturing organic EL display device |
| 09/30/2004 | US20040192102 Insertion apparatus and method |
| 09/30/2004 | US20040192072 Interconnected networks of single-walled carbon nanotubes |
| 09/30/2004 | US20040192071 Production method for anneal wafer and anneal wafer |
| 09/30/2004 | US20040192069 Method of creating high-quality relaxed SiGe-on-insulator for strained Si CMOS applications |
| 09/30/2004 | US20040192068 Method of using SACVD deposition and corresponding deposition reactor |
| 09/30/2004 | US20040192067 Method for forming a relaxed or pseudo-relaxed useful layer on a substrate |
| 09/30/2004 | US20040192066 Method for immersing a substrate |
| 09/30/2004 | US20040192065 Bilayer ultra-thin gate dielectric and process for semiconductor metal contamination reduction |
| 09/30/2004 | US20040192064 Method and apparatus for homogeneous mixing |
| 09/30/2004 | US20040192063 Method of producing a glass substrate for a mask blank and method of producing a mask blank |
| 09/30/2004 | US20040192062 Process to pattern thick TiW metal layers using uniform and selective etching |
| 09/30/2004 | US20040192061 Method of manufacturing electronic device |
| 09/30/2004 | US20040192060 Method for fabricating a semiconductor structure |
| 09/30/2004 | US20040192059 Method for etching a titanium-containing layer prior to etching an aluminum layer in a metal stack |
| 09/30/2004 | US20040192058 Pre-etching plasma treatment to form dual damascene with improved profile |
| 09/30/2004 | US20040192057 Technique for forming an oxide/nitride layer stack by compensating nitrogen non-uniformities |
| 09/30/2004 | US20040192056 Dry-etcching method |
| 09/30/2004 | US20040192055 High concentration indium fluorine retrograde wells |
| 09/30/2004 | US20040192054 Etch of silicon nitride selective to silicon and silicon dioxide useful during the formation of a semiconductor device |
| 09/30/2004 | US20040192053 Etching method and apparatus |
| 09/30/2004 | US20040192052 Viscous protective overlayers for planarization of integrated circuits |
| 09/30/2004 | US20040192051 Method of forming a damascene structure |
| 09/30/2004 | US20040192050 Method for etching semiconductor substrate |
| 09/30/2004 | US20040192049 Polishing composition and method for forming wiring structure using the same |