Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2004
10/14/2004US20040203210 Method of fabricating a semiconductor device having a shallow source/drain region
10/14/2004US20040203209 Methods of forming field effect transistors including floating gate field effect transistors
10/14/2004US20040203208 Vertical DRAM punchthrough stop self-aligned to storage trench
10/14/2004US20040203207 Semiconductor device and method of manufacturing the same
10/14/2004US20040203206 Flip chip with novel power and ground arrangement
10/14/2004US20040203205 Method of forming tiny silicon nitride spacer for flash EPROM by fully wet etching technology
10/14/2004US20040203204 Fabrication method for a flash memory device
10/14/2004US20040203203 Collar dielectric process for reducing a top width of a deep trench
10/14/2004US20040203202 Method of fabricating an X-ray detector array element
10/14/2004US20040203201 Method for fabricating capacitor of semiconductor device
10/14/2004US20040203200 Trench semiconductor device having gate oxide layer with mulitiple thicknesses and processes of fabricating the same
10/14/2004US20040203199 Method of manufacturing a semiconductor integrated circuit device
10/14/2004US20040203198 MOSFET device with nanoscale channel and method of manufacturing the same
10/14/2004US20040203197 Methods for fabricating metal-oxide-semiconductor field effect transistors using gate sidewall spacers
10/14/2004US20040203196 Semiconductor integrated circuit
10/14/2004US20040203195 Thin film transistor, liquid crystal display device and method of fabricating the thin film transistor
10/14/2004US20040203194 Method of resin-sealing a semiconductor device, resin-sealed semiconductor device, and forming die for resin-sealing the semiconductor device
10/14/2004US20040203193 Semiconductor device substrate, semiconductor device, and manufacturing method thereof
10/14/2004US20040203192 Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers
10/14/2004US20040203191 Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate
10/14/2004US20040203190 Stacked packages
10/14/2004US20040203189 LED power package
10/14/2004US20040203188 Method and apparatus for forming thin microelectronic dies
10/14/2004US20040203187 Method for manufacturing semiconductor wafer
10/14/2004US20040203186 Metal wiring method for an undercut
10/14/2004US20040203184 Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates
10/14/2004US20040203183 Phase change memory element capable of low power operation and method of fabricating the same
10/14/2004US20040203182 Charge coupled device and production thereof
10/14/2004US20040203181 Methods to form metal lines using selective electrochemical deposition
10/14/2004US20040203179 LSI inspection method and defect inspection data analysis apparatus
10/14/2004US20040203178 Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry
10/14/2004US20040203177 Method and system for monitoring an etch process
10/14/2004US20040203176 Hydrogen-less CVD TiN process for FeRAM VIA0 barrier application
10/14/2004US20040202969 Photoresist polymer remover formulation containing 1-5% by wt. sulfuric acid, 1-5% by wt. hydrogen peroxide or 0.0001 to 0.05% by wt. ozone, 0.1-5% by wt. of acetic acid, 0.0001 to 0.5% by wt. ammonium fluoride, remaining amount of water
10/14/2004US20040202967 Method of manufacturing semiconductor device
10/14/2004US20040202966 Negative-working photoresist composition
10/14/2004US20040202965 Phase conflict resolution for photolithographic masks
10/14/2004US20040202964 Method for enhancing adhesion between reworked photoresist and underlying oxynitride film
10/14/2004US20040202963 using three exposures, the sum of doses is equal to that required to expose the entire radiation sensitive layer; the allowable contact hole locations are the intersection points of first array of parallel regularly spaced lines with second array of parallel regularly spaced lines; integrated circuits
10/14/2004US20040202958 an organic sulfonic acid, thiourea, fluoroboric acid and hypophosphorous acid; pretreating an insulating film to remove residual metals exposed by etching
10/14/2004US20040202898 Lithographic apparatus device manufacturing method and device manufactured thereby
10/14/2004US20040202874 Using polysiloxane comprised of such as methyltrimethoxysilane and tetramethoxysilane; adhesion, uniformity, mechanical strength, reduced moisture absorption
10/14/2004US20040202847 Wiring structure having a slit dummy
10/14/2004US20040202821 Deposition mask for display device and method for fabricating the same
10/14/2004US20040202784 Evenly drying coating; producing uniform thickness without using rotary mechanism
10/14/2004US20040202568 Gold alloy bonding wire for semiconductor device
10/14/2004US20040202362 Wafer carrying robot teaching method and teaching plate
10/14/2004US20040202032 Vertical NROM having a storage density of 1 bit per 1F2
10/14/2004US20040202031 Magnetic memory device, data copying apparatus, data copying system, recording medium and data copying method
10/14/2004US20040202022 Shared volatile and non-volatile memory
10/14/2004US20040201970 Chip interconnection method and apparatus
10/14/2004US20040201919 Magnetoresistive memory and method of manufacturing the same
10/14/2004US20040201909 Objective, particularly a projection objective for use in semiconductor lithography
10/14/2004US20040201899 Optical projection lens system
10/14/2004US20040201894 Off-axis diffractive beam shapers and splitters for reducing sensitivity to manufacturing tolerances
10/14/2004US20040201874 Laser treatment apparatus and method of manufacturing semiconductor device
10/14/2004US20040201843 Apparatus and method for holding and transporting thin opaque plates
10/14/2004US20040201842 Method and apparatus for article inspection including speckle reduction
10/14/2004US20040201841 Apparatus and method for detecting particles on an object
10/14/2004US20040201834 Stage apparatus and its driving method, exposure apparatus and device manufacturing method
10/14/2004US20040201833 Lithographic apparatus
10/14/2004US20040201832 Pattern writing apparatus and pattern writing method
10/14/2004US20040201830 Catadioptric lithography system and method with reticle stage orthogonal to wafer stage
10/14/2004US20040201815 Liquid crystal display apparatus and method of manufacturing the same
10/14/2004US20040201799 Color display device
10/14/2004US20040201789 Active matrix substrate and method of manufacturing the same
10/14/2004US20040201509 D/A converter circuit, semiconductor device incorporating the D/A converter circuit, and manufacturing method of them
10/14/2004US20040201457 Radio frequency data communications device
10/14/2004US20040201398 Conductive material for integrated circuit fabrication
10/14/2004US20040201389 Needle assembly of probe card
10/14/2004US20040201378 Electrical property evaluation apparatus
10/14/2004US20040201367 Capacitor sheet, method for producing the same, board with built-in capacitors, and semiconductor device
10/14/2004US20040201348 Metal seal packaging for organic light emitting diode device
10/14/2004US20040201231 Wafer blade contact monitor
10/14/2004US20040201136 Material separation to form segmented product
10/14/2004US20040201112 Durable electronic assembly with conductive adhesive
10/14/2004US20040201108 Semiconductor device and method for manufacturing the same
10/14/2004US20040201107 Transistor assembly and method for the production thereof
10/14/2004US20040201104 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation
10/14/2004US20040201103 Low dielectric constant film produced from silicon compounds comprising silicon-carbon bonds
10/14/2004US20040201102 Semiconductor device
10/14/2004US20040201101 Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures
10/14/2004US20040201097 Semiconductor device and method for manufacturing the same
10/14/2004US20040201096 Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
10/14/2004US20040201095 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
10/14/2004US20040201093 Evaluating pattern for measuring and erosion of a semiconductor wafer polished by a chemical mechanical polishing
10/14/2004US20040201092 Semiconductor device
10/14/2004US20040201091 Stacked module systems and methods
10/14/2004US20040201088 Semiconductor multi-chip package and fabrication method
10/14/2004US20040201086 Flip chip in leaded molded package with two dies
10/14/2004US20040201085 Multi-chip circuit module and method for producing the same
10/14/2004US20040201083 Hard-macro and semiconductor integrated circuit including the same
10/14/2004US20040201081 Lead frame structure with aperture or groove for flip chip in a leaded molded package
10/14/2004US20040201077 Semiconductor integrated circuit device and method of testing the same
10/14/2004US20040201076 Method of radiation generation and manipulation
10/14/2004US20040201070 Self-aligned, low-resistance, efficient MRAM read/write conductors
10/14/2004US20040201069 Semiconductor device and method for manufacturing semiconductor device
10/14/2004US20040201068 Process for producing thin film transistor
10/14/2004US20040201067 LLD structure of thin film transistor
10/14/2004US20040201066 reduced contact resistance; silicide is formed at the same time of depositing a cobalt film which omits a protection film formation process; cleaning, siliciding, annealing
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