Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2004
10/05/2004US6801071 Semiconductor integrated circuit device with differential output driver circuit, and system for semiconductor integrated circuit device
10/05/2004US6801060 Semiconductor integrated circuit
10/05/2004US6801056 Monotonic dynamic-static pseudo-NMOS logic circuit
10/05/2004US6801048 Device and method for testing integrated circuit dice in an integrated circuit module
10/05/2004US6801047 Wafer probe station having environment control enclosure
10/05/2004US6801033 Voltage converter having switching element with variable substrate potential
10/05/2004US6800950 Microstructure array, mold for forming a microstructure array, and method of fabricating the same
10/05/2004US6800949 Embedded chip enclosure with solder-free interconnect
10/05/2004US6800946 Selective underfill for flip chips and flip-chip assemblies
10/05/2004US6800945 Multi-chip semiconductor device with specific chip arrangement
10/05/2004US6800943 Solid image pickup device
10/05/2004US6800940 Low k dielectric composite layer for integrated circuit structure which provides void-free low k dielectric material between metal lines while mitigating via poisoning
10/05/2004US6800938 Semiconductor device having amorphous barrier layer for copper metallurgy
10/05/2004US6800937 RuSixOy-containing adhesion layers and process for fabricating the same
10/05/2004US6800930 Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies
10/05/2004US6800929 Semiconductor device
10/05/2004US6800928 Porous integrated circuit dielectric with decreased surface porosity
10/05/2004US6800927 Multiple oxide thicknesses for merged memory and logic applications
10/05/2004US6800926 Tracking circuit
10/05/2004US6800925 Integrated circuit configuration having a structure for reducing a minority charge carrier current
10/05/2004US6800923 Multilayer analog interconnecting line layout for a mixed-signal integrated circuit
10/05/2004US6800922 Semiconductor device with layer peeling resistance
10/05/2004US6800921 Method of fabricating a polysilicon capacitor utilizing fet and bipolar base polysilicon layers
10/05/2004US6800919 Semiconductor device having a redundancy function
10/05/2004US6800918 EMI and noise shielding for multi-metal layer high frequency integrated circuit processes
10/05/2004US6800917 Bladed silicon-on-insulator semiconductor devices and method of making
10/05/2004US6800916 Implantable cardiac defibrillation with control circuit for controlling a high voltage circuit using a low voltage circuit
10/05/2004US6800911 Semiconductor substrate with conductive layer which includes silicon film including non-doped layer, which does not contain impurities, and doped layer containing impurities, silicide film, and high melting point metal film
10/05/2004US6800910 FinFET device incorporating strained silicon in the channel region
10/05/2004US6800909 Semiconductor device and method of manufacturing the same
10/05/2004US6800907 Method for fabricating semiconductor device
10/05/2004US6800905 Implanted asymmetric doped polysilicon gate FinFET
10/05/2004US6800904 Semiconductor integrated circuit device and method of manufacturing the same
10/05/2004US6800903 High-voltage transistor with multi-layer conduction region
10/05/2004US6800902 Semiconductor device, method of manufacturing the same and liquid jet apparatus
10/05/2004US6800901 Process for the selective formation of salicide on active areas of MOS devices
10/05/2004US6800900 Trench-gate semiconductor devices and their manufacture
10/05/2004US6800899 Vertical transistors, electrical devices containing a vertical transistor, and computer systems containing a vertical transistor
10/05/2004US6800898 Integrated circuit configuration and method of fabricating a dram structure with buried bit lines or trench capacitors
10/05/2004US6800897 Integrated circuit power devices having junction barrier controlled schottky diodes therein
10/05/2004US6800895 Vertical split gate flash memory cell and method for fabricating the same
10/05/2004US6800894 Semiconductor devices, circuit substrates and electronic devices
10/05/2004US6800893 Semiconductor circuit configuration and associated fabrication method
10/05/2004US6800892 Memory devices, and electronic systems comprising memory devices
10/05/2004US6800891 Self-aligned source pocket for flash memory cells
10/05/2004US6800890 Memory architecture with series grouped by cells
10/05/2004US6800889 Semiconductor device and fabrication method thereof
10/05/2004US6800888 Semiconductor integrated circuitry and method for manufacturing the circuitry
10/05/2004US6800887 Nitrogen controlled growth of dislocation loop in stress enhanced transistor
10/05/2004US6800886 Semiconductor device and method for fabricating the same
10/05/2004US6800885 Asymmetrical double gate or all-around gate MOSFET devices and methods for making same
10/05/2004US6800881 Silicon-germanium hetero bipolar transistor with T-shaped implantation layer between emitter and emitter contact area
10/05/2004US6800880 Heterojunction bipolar transistors with extremely low offset voltage and high current gain
10/05/2004US6800879 Method of preparing indium phosphide heterojunction bipolar transistors
10/05/2004US6800878 Field-effect type compound semiconductor device and method for fabricating the same
10/05/2004US6800875 Active matrix electro-luminescent display device with an organic leveling layer
10/05/2004US6800874 CMOS process for double vertical channel thin film transistor
10/05/2004US6800873 Semiconductor device and electronic device
10/05/2004US6800872 Active matrix thin film transistor
10/05/2004US6800871 Display device and process of producing the same
10/05/2004US6800869 Monitoring apparatus and method for tape automated bonding process
10/05/2004US6800862 Ion implanting apparatus and ion implanting method
10/05/2004US6800861 Mirror projection system for a scanning lithographic projection apparatus, and lithographic apparatus comprising such a system
10/05/2004US6800833 Electromagnetically levitated substrate support
10/05/2004US6800830 Chemistry for boron diffusion barrier layer and method of application in semiconductor device fabrication
10/05/2004US6800803 Semiconductor manufacturing method and apparatus
10/05/2004US6800576 Aluminum nitride sintered bodies and members for semiconductor-producing apparatuses
10/05/2004US6800571 CVD plasma assisted low dielectric constant films
10/05/2004US6800570 Method of forming a metal oxide film
10/05/2004US6800569 Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus
10/05/2004US6800568 Methods for the deposition of high-K films and high-K films produced thereby
10/05/2004US6800567 Method for forming polyatomic layers
10/05/2004US6800566 Adjustment of N and K values in a DARC film
10/05/2004US6800564 Etching solution for signal wire and method of fabricating thin film transistor array panel with the same
10/05/2004US6800562 Method of controlling wafer charging effects due to manufacturing processes
10/05/2004US6800561 Etching methods, methods of removing portions of material, and methods of forming silicon nitride spacers
10/05/2004US6800560 Gas assisted method for applying resist stripper and gas-resist stripper combinations
10/05/2004US6800559 Method and apparatus for generating H20 to be used in a wet oxidation process to form SiO2 on a silicon surface
10/05/2004US6800558 Photoresist scum for copper dual damascene process
10/05/2004US6800557 Process for manufacturing semiconductor integrated circuit device
10/05/2004US6800556 Polishing method using ceria slurry, and method of manufacturing semiconductor device
10/05/2004US6800555 Wire bonding process for copper-metallized integrated circuits
10/05/2004US6800554 Copper alloys for interconnections having improved electromigration characteristics and methods of making same
10/05/2004US6800553 Method for manufacturing a silicide layer of semiconductor device
10/05/2004US6800552 Deposition of transition metal carbides
10/05/2004US6800551 Chemical amplification type photoresist composition, method for producing a semiconductor device using the composition, and semiconductor substrate
10/05/2004US6800550 Method for forming t-shaped conductive wires of semiconductor device utilizing notching phenomenon
10/05/2004US6800549 Method of fabricating semiconductor device including forming contact hole with anisotropic and isotropic etching and forming discontinuous barrier layer
10/05/2004US6800548 Method to avoid via poisoning in dual damascene process
10/05/2004US6800547 Integrated circuit dielectric and method
10/05/2004US6800546 Film forming method by radiating a plasma on a surface of a low dielectric constant film
10/05/2004US6800544 Semiconductor device having a metal-semiconductor junction with a reduced contact resistance
10/05/2004US6800543 Semiconductor device having a low-resistance gate electrode
10/05/2004US6800542 Method for fabricating ruthenium thin layer
10/05/2004US6800541 Pulse laser irradiation method for forming a semiconductor thin film
10/05/2004US6800540 Method for crystallizing silicon
10/05/2004US6800539 Thin film formation method
10/05/2004US6800538 Semiconductor device fabrication method and semiconductor fabrication control method
10/05/2004US6800537 Methods of making anisotropic conductive elements for use in microelectronic packaging
10/05/2004US6800536 Semiconductor device having an insulated gate and a fabrication process thereof
1 ... 4138 4139 4140 4141 4142 4143 4144 4145 4146 4147 4148 4149 4150 4151 4152 4153 4154 4155 4156 4157 4158 ... 6590