Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2004
10/21/2004US20040206455 Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties
10/21/2004US20040206454 Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning
10/21/2004US20040206453 CMP machine dresser and method for detecting the dislodgement of diamonds from the same
10/21/2004US20040206452 Substrate processing apparatus
10/21/2004US20040206444 Methods for forming an assembly for transfer of a useful layer
10/21/2004US20040206425 Fabrication of a high-strength steel article with inclusion control during melting
10/21/2004US20040206410 Fluid handling component with ultraphobic surfaces
10/21/2004US20040206390 Semiconductor layer includes a copper-indium-gallium-diselenide film (CIGS); vapor deposition
10/21/2004US20040206379 Substrate processing apparatus
10/21/2004US20040206378 Substrate processing apparatus
10/21/2004US20040206375 Integrated bevel clean chamber
10/21/2004US20040206374 Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning
10/21/2004US20040206373 Spin rinse dry cell
10/21/2004US20040206371 Wafer cleaning
10/21/2004US20040206309 Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor
10/21/2004US20040206308 Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals
10/21/2004US20040206307 Method and system having at least one thermal transfer station for making OLED displays
10/21/2004US20040206304 Pressurized chuck for controlling backside wafer contamination
10/21/2004US20040206299 Semiconductor base and its manufacturing method, and semiconductor crystal manufacturing method
10/21/2004US20040206298 Method for producing semi-insulating resistivity in high purity silicon carbide crystals
10/21/2004US20040206297 In situ growth of oxide and silicon layers
10/21/2004US20040206179 Nozzle clogging detection device, droplet ejecting device, electronic optical device, method for producing same, and electronic device
10/21/2004US20040205961 Electronic component mounting apparatus and electronic component mounting method
10/21/2004US20040205958 Methods for fabricating MRAM device structures
10/21/2004DE202004013515U1 Device for storing and transporting breakable objects comprises a transport container with a carrier plate which is constituted as a damping element supporting at least one box with breakable objects
10/21/2004DE19855655B4 Plasmakammer mit erosionsresistenten Halteschrauben Plasma chamber with erosion-resistant mounting screws
10/21/2004DE19853092B4 Übernahme- und Haltesystem für ein Substrat Acquisition and retention system for a substrate
10/21/2004DE19801488B4 Verfahren zum Zusammenbau eines Halbleiterbausteins A method of assembling a semiconductor device
10/21/2004DE19727262B4 Halbleiterspeichervorrichtung mit über Leckdetektionsmittel gesteuerter Substratspannungserzeugungsschaltung A semiconductor memory device with more than leak detection means controlled substrate voltage generating circuit
10/21/2004DE19613669B4 Verfahren zur Herstellung eines Halbleiterelements mit einer Platinschicht A process for producing a semiconductor element with a layer of platinum
10/21/2004DE10358963A1 Verfahren zum Herstellen einer MTJ-Zelle eines magnetischen Direktzugriffsspeichers A method for producing an MTJ cell of a magnetic random access memory
10/21/2004DE10354020A1 Verfahren zum Testen einer Halbleitervorrichtung A method for testing a semiconductor device
10/21/2004DE10347458A1 Semiconductor device forming method e.g. for embedded memory, involves forming single layer spacer on side walls of conductive pattern by etching one spacer layer using another spacer as mask
10/21/2004DE10337808B3 Manufacturing method for semiconductor element with charge compensation structure obtained by successive positive and negative doping via respective doping beams with different directions
10/21/2004DE10328634B3 Production of a buried strap contact for a storage capacitor of a storage cell comprises back etching the inner electrode layer in a trench, removing the exposed insulating layer from the trench wall and further processing
10/21/2004DE10314595A1 Production of transistors of different conductivity type in the surface of a semiconductor substrate used as DRAM component comprises forming a gate electrode layer of first conductivity type doping on the substrate, and further processing
10/21/2004DE10314151A1 Semiconductor device, has protection structure which allows determination of parasitic current, and generates compensating current for well region accordingly
10/21/2004DE10314150A1 Detecting environmental or process parameters in process-wafer manufacturing environment for semiconductor integrated circuit manufacture, by exposing wafer comprising sensors to manufacturing environment
10/21/2004DE102004015282A1 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same
10/21/2004DE102004014940A1 Halbleitervorrichtung, Verfahren zum Aufwachsen eines Nidridhalbleiters und Verfahren zur Herstellung einer Halbleitervorrichtung A semiconductor device, method for growing a Nidridhalbleiters and method of manufacturing a semiconductor device
10/21/2004DE102004014917A1 Halbleitervorrichtung und Verfahren eines Drahtkontaktierens für eine Halbleitervorrichtung A semiconductor device and method of a wire for contacting a semiconductor device
10/21/2004DE102004014721A1 Nanosilizium-Leichtelement und Verfahren zu seiner Herstellung Nano-silicon light element and process for its preparation
10/21/2004DE102004014229A1 Verfahren zum Ätzen eines Halbleitersubstrats A method of etching a semiconductor substrate
10/21/2004DE102004013926A1 Verfahren zum Ausbilden eines selbstjustierenden Buried-Strap-Kontakts unter Verwendung von dotiertem HDP-Oxid A method for forming a self-aligned buried strap contact using doped HDP oxide
10/21/2004DE102004013626A1 Verfahren und Vorrichtung zur Abscheidung dünner Schichten Method and device for depositing thin layers
10/21/2004DE102004012012A1 Verfahren zum Teilen eines Halbleiterwafers A method for dividing a semiconductor wafer
10/21/2004DE10024634B4 Elektronenstrahl-Belichtungsvorrichtung und -verfahren Electron beam exposure apparatus and method
10/21/2004CA2517511A1 Potassium hydrogen peroxymonosulfate solutions
10/20/2004EP1469526A2 Thin film transistor and method for fabricating the same
10/20/2004EP1469525A2 MOSFET with Schottky source and drain contacts and method of manufacturing the same
10/20/2004EP1469513A2 Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
10/20/2004EP1469512A1 Module device
10/20/2004EP1469511A2 Method of fabricating a magneto-resistive random access memory (MRAM) device
10/20/2004EP1469510A2 Method for fabricating a gate structure of a field effect transistor
10/20/2004EP1469509A1 Method and device for processing substrate, and apparatus for manufacturing semiconductor device
10/20/2004EP1469508A1 Boat for heat treatment and vertical heat treatment equipment
10/20/2004EP1469507A2 D/A converter circuit, semiconductor device incorporating the D/A converter circuit, and manufacturing method of these
10/20/2004EP1469480A2 Non-volatile semiconductor memory device, electronic card using the same and electronic apparatus
10/20/2004EP1469416A2 Electrostatic capacitance detection device
10/20/2004EP1469354A1 Coating material for pattern fineness enhancement and method of forming fine pattern with the same
10/20/2004EP1469352A2 Illuminator controlled tone reversal printing
10/20/2004EP1469351A1 Lithographic apparatus and device manufacturing method
10/20/2004EP1469350A2 Exposure apparatus and aberration correction method
10/20/2004EP1469347A1 Lithographic apparatus and device manufacturing method
10/20/2004EP1469345A2 Complementary division condition determining method and program and complementary division method
10/20/2004EP1469319A1 Flip-chip mounting method and mounting apparatus of electronic part
10/20/2004EP1469015A1 Amorphous perfluorinated polymers
10/20/2004EP1468776A2 Microelectronics spring contact elements
10/20/2004EP1468774A1 Laser irradiation method, laser irradiation apparatus, and method for manufacturing semiconductor device
10/20/2004EP1468752A2 Cleaning sheet and method of cleaning a substrate
10/20/2004EP1468454A1 Semiconductor arrangement comprising a pn-transition and method for producing a semiconductor arrangement
10/20/2004EP1468453A2 High voltage power mosfet having a voltage sustaining region that includes doped columns formed by trench etching using an etchant gas that is also a doping source
10/20/2004EP1468452A1 High voltage power mosfet includes doped columns
10/20/2004EP1468451A1 Body-tied silicon on insulator semiconductor device and method therefor
10/20/2004EP1468450A1 Wide bandgap bipolar transistors
10/20/2004EP1468447A2 Adaptive threshold voltage control with positive body bias for n and p-channel transistors
10/20/2004EP1468446A1 Method for production of dielectric layers using polyfunctional carbosilanes
10/20/2004EP1468445A2 Optimized method of transfer of a thin layer of silicon carbide to a receiving substrate
10/20/2004EP1468444A2 Process for preparation of separable semiconductor assemblies, particularly to form substrates for electronics, optoelectronics and optics
10/20/2004EP1468443A1 Apparatus incorporating small-feature-size and large-feature-size components and method for making same
10/20/2004EP1468442A2 Method for the production of a capacitor in a dielectric layer
10/20/2004EP1468441A1 Simultaneous formation of deep trench capacitor and resistor
10/20/2004EP1468440A2 FIELD EFFECT TRANSISTOR HAVING SOURCE AND/OR DRAIN FORMING SCHOTTKY OR SCHOTTKY−LIKE CONTACT WITH STRAINED SEMICONDUCTOR SUBSTRATE
10/20/2004EP1468439A2 Method for fabricating a high voltage power mosfet having a voltage sustaining region that includes doped columns formed by rapid diffusion
10/20/2004EP1468433A1 Coil on a semiconductor substrate and method for production thereof
10/20/2004EP1468335A1 A cleaning agent composition for a positive or a negative photoresist
10/20/2004EP1468333A2 Method for constructing an optical beam guide system in a contamination-free atmosphere and universal optical module for said construction
10/20/2004EP1468233A1 Resistance furnace
10/20/2004EP1468128A2 Method for manufacturing a free-standing substrate made of monocrystalline semi-conductor material
10/20/2004EP1468057A1 Tungsten polishing solution
10/20/2004EP1468048A1 Apparatus and method for cleaning test probes
10/20/2004EP1467915A2 Apparatus and method for monitoring environment within a container
10/20/2004EP1467840A1 Process control in electro-chemical mechanical polishing
10/20/2004EP1467839A2 Method and apparatus for applying downward force on wafer during cmp
10/20/2004EP1446698A4 An interferometer system for a semiconductor exposure system
10/20/2004EP1344222B1 Method for reading out or in a status from or to a ferroelectrical transistor of a memory cell and memory matrix
10/20/2004EP1274875A4 Method and apparatus for providing uniform gas delivery to substrates in cvd and pecvd processes
10/20/2004EP1268734B1 Fluorinated solvent compositions containing ozone
10/20/2004EP1262002B1 Quantum well intermixing
10/20/2004EP1135236B1 Reverse linear polisher with loadable housing