Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2004
10/19/2004US6806506 Semiconductor device having leads provided with interrupter for molten resin
10/19/2004US6806503 Light-emitting diode and laser diode having n-type ZnO layer and p-type semiconductor laser
10/19/2004US6806502 3-5 Group compound semiconductor and light emitting device
10/19/2004US6806501 Integrated circuit having SiC layer
10/19/2004US6806500 Electro-optical device and electronic apparatus
10/19/2004US6806499 Semiconductor device and a method of manufacturing the same
10/19/2004US6806498 Semiconductor thin film, method and apparatus for producing the same, and semiconductor device and method of producing the same
10/19/2004US6806496 Display device and manufacturing method for the same
10/19/2004US6806495 Semiconductor device and method of fabricating the same
10/19/2004US6806472 Switching device of an X-ray sensor and method for manufacturing the same
10/19/2004US6806470 Infrared sensor device and manufacturing method thereof
10/19/2004US6806456 System and method for lithography process monitoring and control
10/19/2004US6806443 Ceramic susceptor
10/19/2004US6806438 Plasma processing apparatus including a plurality of plasma processing units having reduced variation
10/19/2004US6806437 Inductively coupled plasma generating apparatus incorporating double-layered coil antenna
10/19/2004US6806344 Poly-o-hydroxamide, polybenzoxazole, and electronic component including a dielectric having a barrier effect against copper diffusion, and processes for preparing poly-o-hydroxyamides, polybenzoxazoles, and electronic components
10/19/2004US6806335 PolymEric compound and resin composition for photoresist
10/19/2004US6806309 Maleimide containing monomer, cure initiator and polymers; controlled bond line thickness and uniformity; semiconductor packaging; stacking without need for spacer die
10/19/2004US6806211 Device and method for processing substrate
10/19/2004US6806210 Tantalum oxide film, use thereof, process for forming the same and composition
10/19/2004US6806208 Semiconductor device structured to prevent oxide damage during HDP CVD
10/19/2004US6806207 Method of depositing low K films
10/19/2004US6806206 Etching method and etching liquid
10/19/2004US6806205 Stiction-free microstructure releasing method for fabricating MEMS device
10/19/2004US6806204 Semiconductor etch speed modification
10/19/2004US6806203 Method of forming a dual damascene structure using an amorphous silicon hard mask
10/19/2004US6806202 Method of removing silicon oxide from a surface of a substrate
10/19/2004US6806200 Method of improving etch uniformity in deep silicon etching
10/19/2004US6806199 Method for manufacturing silicon mirror wafer, silicon mirror wafer, and heat treatment furnace
10/19/2004US6806198 Gas-assisted etch with oxygen
10/19/2004US6806197 Method of forming integrated circuitry, and method of forming a contact opening
10/19/2004US6806196 High precision integrated circuit capacitors
10/19/2004US6806195 Manufacturing method of semiconductor IC device
10/19/2004US6806194 Apparatus and methods for processing a workpiece
10/19/2004US6806192 Method of barrier-less integration with copper alloy
10/19/2004US6806191 Semiconductor device with a copper line having an increased resistance against electromigration and a method of forming the same
10/19/2004US6806190 Structure of semiconductor electronic device and method of manufacturing the same
10/19/2004US6806189 Method of silver (AG) electroless plating on ITO electrode
10/19/2004US6806188 Semiconductor device capable of preventing ring defect and method of manufacturing the same
10/19/2004US6806187 Electrical contact for high dielectric constant capacitors and method for fabricating the same
10/19/2004US6806186 Submicron metallization using electrochemical deposition
10/19/2004US6806185 Method for forming low dielectric constant damascene structure while employing a carbon doped silicon oxide capping layer
10/19/2004US6806184 Method to eliminate copper hillocks and to reduce copper stress
10/19/2004US6806183 Methods for forming capacitors on semiconductor substrates
10/19/2004US6806182 Method for eliminating via resistance shift in organic ILD
10/19/2004US6806181 Method of fabricating an air bridge
10/19/2004US6806180 Unitary interconnection structures integral with a dielectric layer
10/19/2004US6806179 Connection substrate, a method of manufacturing the connection substrate, a semiconductor device, and a method of manufacturing the semiconductor device
10/19/2004US6806178 Semiconductor device and method for fabricating the same
10/19/2004US6806177 Method of making self-aligned borderless contacts
10/19/2004US6806176 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument
10/19/2004US6806175 Method for forming protective films and spacers
10/19/2004US6806174 Semiconductor devices and methods for fabricating the same
10/19/2004US6806173 Method for producing highly doped semiconductor components
10/19/2004US6806172 Physical vapor deposition of nickel
10/19/2004US6806171 Method of producing a thin layer of crystalline material
10/19/2004US6806170 Method for forming an interface free layer of silicon on a substrate of monocrystalline silicon
10/19/2004US6806169 Semiconductor device manufacturing method
10/19/2004US6806168 Healing of micro-cracks in an on-chip dielectric
10/19/2004US6806167 Method of making chip-type electronic device provided with two-layered electrode
10/19/2004US6806166 Substrate removal as a function of emitted photons at the back side of a semiconductor chip
10/19/2004US6806165 Isolation trench fill process
10/19/2004US6806164 Semiconductor apparatus and method for fabricating the same
10/19/2004US6806163 Ion implant method for topographic feature corner rounding
10/19/2004US6806161 Process for preparing insulating material having low dielectric constant
10/19/2004US6806159 Method for manufacturing a semiconductor device with sinker contact region
10/19/2004US6806158 Mixed crystal layer growing method and device, and semiconductor device
10/19/2004US6806157 Metal oxide semiconductor field effect transistor for reducing resistance between source and drain and method for fabricating the same
10/19/2004US6806156 Process for fabricating a MOS transistor of short gate length and integrated circuit comprising such a transistor
10/19/2004US6806155 Method and system for scaling nonvolatile memory cells
10/19/2004US6806154 Method for forming a salicided MOSFET structure with tunable oxynitride spacer
10/19/2004US6806153 Method of manufacturing a field effect transistor
10/19/2004US6806152 Retrograde doped buried layer transistor and method for producing the same
10/19/2004US6806151 Methods and apparatus for inducing stress in a semiconductor device
10/19/2004US6806150 Methods of manufacturing semiconductor memory devices with epitaxial contact nodes
10/19/2004US6806149 Sidewall processes using alkylsilane precursors for MOS transistor fabrication
10/19/2004US6806148 Method of manufacturing non-volatile memory device
10/19/2004US6806147 Method and apparatus for suppressing the channeling effect in high energy deep well implantation
10/19/2004US6806146 Method for making a semiconductor device having a high-k gate dielectric
10/19/2004US6806145 Low temperature method of forming a gate stack with a high k layer deposited over an interfacial oxide layer
10/19/2004US6806144 Forming thin films of silicon oxide on silicon wafers, by heating in furnaces having gas flow passageways, then purging with inert gases to remove impurities; oxidation
10/19/2004US6806143 Self-aligned source pocket for flash memory cells
10/19/2004US6806142 Method for coding semiconductor permanent store ROM
10/19/2004US6806141 Field effect transistor with gate layer and method of making same
10/19/2004US6806140 Semiconductor memory device for eliminating floating body effect and method of fabricating the same
10/19/2004US6806139 Method of fabricating a MIM capacitor using etchback
10/19/2004US6806138 Integration scheme for enhancing capacitance of trench capacitors
10/19/2004US6806137 Trench buried bit line memory devices and methods thereof
10/19/2004US6806136 Method of forming a semiconductor device having a capacitor and a resistor
10/19/2004US6806135 Method of manufacturing a semiconductor device using a two-step deposition process
10/19/2004US6806134 Sidewall strap for complementary semiconductor structures and method of making same
10/19/2004US6806133 Method for fabricating semiconductor device with triple well structure
10/19/2004US6806132 Semiconductor device having two-layered charge storage electrode
10/19/2004US6806131 Process for manufacturing a DMOS transistor
10/19/2004US6806130 Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit device
10/19/2004US6806129 Self-aligned process using indium gallium arsenide etching to form reentry feature in heterojunction bipolar transistors
10/19/2004US6806128 Semiconductor integrated circuit device and a method of manufacturing the same
10/19/2004US6806127 Method and structure for contacting an overlying electrode for a magnetoelectronics element
10/19/2004US6806126 Method of manufacturing a semiconductor component
10/19/2004US6806125 Method of manufacturing a thin film transistor device
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