H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2004
11/30/2004	US6824665 Seed layer deposition
11/30/2004	US6824660 Molecular recognition type chemical CCD
11/30/2004	US6824655 Process for charged particle beam micro-machining of copper
11/30/2004	US6824643 Method and device of peeling semiconductor device using annular contact members
11/30/2004	US6824627 Stepped upper electrode for plasma processing uniformity
11/30/2004	US6824622 Cleaner and method for removing fluid from an object
11/30/2004	US6824621 Single wafer type substrate cleaning method and apparatus
11/30/2004	US6824619 Method and device for rotating a wafer
11/30/2004	US6824618 Substrate receiving apparatus and method thereof
11/30/2004	US6824617 Input/output valve switching apparatus of semiconductor manufacturing system
11/30/2004	US6824616 Substrate processing method and substrate processing system
11/30/2004	US6824613 Substrate processing apparatus
11/30/2004	US6824612 Electroless plating system
11/30/2004	US6824610 Process for producing gallium nitride crystal substrate, and gallium nitride crystal substrate
11/30/2004	US6824609 Liquid phase growth method and liquid phase growth apparatus
11/30/2004	US6824579 Anionic polyelectrolyte is for selectively polishing silicon dioxide as compared to silicon nitride, or a cationic polyelectrolyte which is for selectively polishing metals as compared to silicon dioxide, silicon nitride and/or silicon
11/30/2004	US6824456 Configuration for polishing disk-shaped objects
11/30/2004	US6824455 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
11/30/2004	US6824454 Polishing apparatus
11/30/2004	US6824447 Transparent window is formed on a part of the polishing pad so as to let a laser beam or visible light pass therethrough to detect the end point of polishing rate
11/30/2004	US6824363 Linear inductive plasma pump for process reactors
11/30/2004	US6824344 Drive-section-isolated FOUP opener
11/30/2004	US6824343 Substrate support
11/30/2004	US6824277 Optical beam guidance system and method for preventing contamination of optical components contained therein
11/30/2004	US6824127 Thimble-type stream injection humidifier and quick response steam generator
11/30/2004	US6824037 Bonding device
11/30/2004	US6823915 Heat-conducting adhesive joint with an adhesive-filled, porous heat conductor
11/30/2004	US6823880 High pressure processing apparatus and high pressure processing method
11/30/2004	US6823876 Methodology of rotational etching tool maintenance
11/30/2004	US6823815 Wafer area pressure control for plasma confinement
11/30/2004	US6823753 Sensor signal transmission from processing system
11/30/2004	US6823752 Polyhedron inspection feeder and polyhedron inspection apparatus
11/30/2004	US6823589 Flexibly suspended gas distribution manifold for plasma chamber
11/30/2004	US6823560 Buffering structure for wheels
11/30/2004	CA2175483C Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics
11/25/2004	WO2004103039A1 Double-sided wiring board, double-sided wiring board manufacturing method, and multilayer wiring board
11/25/2004	WO2004102793A2 Maintaining the dimensions of features being etched on a lithographic mask
11/25/2004	WO2004102690A2 Organic polymers, laminates, and capacitors
11/25/2004	WO2004102686A1 Led fabrication via ion implant isolation
11/25/2004	WO2004102682A1 Photodiode passivation technique
11/25/2004	WO2004102674A1 Trench memory capacitor and method for producing the same
11/25/2004	WO2004102673A2 Trenched dmos devices and processes for making same
11/25/2004	WO2004102671A1 Power device with high switching speed and manufacturing method thereof
11/25/2004	WO2004102668A1 Soi wafer and process for producing the same
11/25/2004	WO2004102667A2 Integrated circuit arrangement comprising isolating trenches and a field effect transistor, and associated production method
11/25/2004	WO2004102666A1 Bit line structure and production method therefor
11/25/2004	WO2004102664A1 Fuse circuit and semiconductor integrated circuit device
11/25/2004	WO2004102661A1 Interconnection pattern design
11/25/2004	WO2004102658A1 Bit line structure and method for the production thereof
11/25/2004	WO2004102655A1 Clean device with clean box-opening/closing device
11/25/2004	WO2004102654A1 Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine
11/25/2004	WO2004102652A1 Organic polymers, electronic devices, and methods
11/25/2004	WO2004102651A1 Ozone post-deposition treatment to remove carbon in a flowable oxide film
11/25/2004	WO2004102650A1 Plasma processing device
11/25/2004	WO2004102649A1 Film forming method and apparatus
11/25/2004	WO2004102647A1 Method for crystallizing semiconductor thin film
11/25/2004	WO2004102645A1 Exposure method, mask, semiconductor device manufacturing method, and semiconductor device
11/25/2004	WO2004102644A1 Method and apparatus for determining a substrate exchange position in a processing system
11/25/2004	WO2004102643A2 Contact opening metrology
11/25/2004	WO2004102642A2 Envelope follower end point detection in time division multiplexed processes
11/25/2004	WO2004102640A1 Wide temperature range chuck system
11/25/2004	WO2004102635A2 Methods for preserving strained semiconductor layers during oxide layer formation
11/25/2004	WO2004102634A2 Metal mems devices and methods of making same
11/25/2004	WO2004102633A2 Method for fabrication of sige layer having small poly grains and related structure
11/25/2004	WO2004102624A2 Unitary dual damascene process using imprint lithography
11/25/2004	WO2004102622A2 Screen print under-bump metalization (ubm) to produce low cost flip chip substrate
11/25/2004	WO2004102620A2 Method to passivate conductive surfaces during semiconductor processing
11/25/2004	WO2004102619A2 Chemical vapor deposition epitaxial growth
11/25/2004	WO2004102592A2 Capacitor constructions, and their methods of forming
11/25/2004	WO2004102307A2 Method and system for monitoring and control of a chamber process
11/25/2004	WO2004102279A2 Method of manufacturing an electronic device
11/25/2004	WO2004102277A2 Method providing an improved bi-layer photoresist pattern
11/25/2004	WO2004102274A2 Use of spin-on, photopatternable, interplayer dielectric materials and intermediate semiconductor device structure utilizing the same
11/25/2004	WO2004102207A1 Probe for testing electric conduction
11/25/2004	WO2004102171A1 External view inspection method, master pattern used for the same, and external view inspection device having the master pattern
11/25/2004	WO2004102076A2 Multi-zone ceramic heating system and method of manufacture thereof
11/25/2004	WO2004102073A2 Vestibule assembly for a heat treatment furnace
11/25/2004	WO2004102055A1 Methods and apparatus for sealing an opening of a processing chamber
11/25/2004	WO2004101856A2 Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization
11/25/2004	WO2004101855A2 Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures
11/25/2004	WO2004101845A1 Treating device using raw material gas and reactive gas
11/25/2004	WO2004101840A1 Gapfill process using a combination of spin-on-glass deposition and chemical vapor deposition techniques
11/25/2004	WO2004101702A1 Ceria abrasive for cmp
11/25/2004	WO2004101701A1 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same
11/25/2004	WO2004101428A1 Methods and apparatus for attaching mems devices to housing
11/25/2004	WO2004101223A1 Substrate polishing apparatus
11/25/2004	WO2004101222A2 Chemical mechanical polishing compositions for step-ii copper liner and other associated materials and method of using same
11/25/2004	WO2004101221A2 Improved chemical mechanical polishing compositions for copper and associated materials and method of using same
11/25/2004	WO2004101181A2 System and method for cleaning of workpieces using supercritical carbon dioxide
11/25/2004	WO2004088726A3 Isotropic etch process for top plate pull-back in a metal- insulator- metal capacitor
11/25/2004	WO2004086465A3 Method and apparatus for high speed wafer handling
11/25/2004	WO2004081974A3 A method of producing substrates or components on substrates involving transfer of a useful layer, for microelectronics, optoelectronics, or optics
11/25/2004	WO2004077499A3 Method for integration of single and dual gate logic into one mask set
11/25/2004	WO2004064144A3 Semiconductor packaging with a partially prepatterned lead frame and method of manufacturing the same
11/25/2004	WO2004062341A3 Method and apparatus for layer by layer deposition of thin films
11/25/2004	WO2004061933B1 Diffusion barrier and method therefor
11/25/2004	WO2004061921A8 Strained silicon-on-insulator (ssoi) and method to form the same
11/25/2004	WO2004060610A3 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
11/25/2004	WO2004053926A3 A method for depositing a metal layer on a semiconductor interconnect structure
11/25/2004	WO2004051380A8 Method for forming resist pattern and resist pattern

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