H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2004
11/25/2004	US20040233419 Combined high speed optical profilometer and ellipsometer
11/25/2004	US20040233409 Projection objective having adjacently mounted aspheric lens surfaces
11/25/2004	US20040233407 Exposure apparatus and method
11/25/2004	US20040233404 Exposure device and exposure method
11/25/2004	US20040233401 Exposure apparatus
11/25/2004	US20040233340 Display unit and production method therefor, and projection type display unit
11/25/2004	US20040233314 Solid-state imaging apparatus and manufacturing method thereof
11/25/2004	US20040233265 Liquid droplet ejecting apparatus, liquid droplet ejecting system, electro-optical device, method of manufacturing electro-optical device, method of forming a metal wiring line, and electronic apparatus
11/25/2004	US20040233035 Methods for manufacturing resistors using a sacrificial layer
11/25/2004	US20040232974 Voltage generating circuit
11/25/2004	US20040232973 Switch circuit
11/25/2004	US20040232942 Field programmable gate array and microcontroller system-on-a-chip
11/25/2004	US20040232940 Method of detecting defects in TFT-arrays and a TFT-array testing system incorporating the same
11/25/2004	US20040232937 Semiconductor integrated circuit device
11/25/2004	US20040232928 Testing circuits on substrates
11/25/2004	US20040232925 Integrated circuit probe card
11/25/2004	US20040232920 Method and apparatus for wall film monitoring
11/25/2004	US20040232910 Test structures for estimating dishing and erosion effects in copper damascene technology
11/25/2004	US20040232893 Thermal switching element and method for manufacturing the same
11/25/2004	US20040232572 Optical device and method for manufacturing the same, and electronic apparatus
11/25/2004	US20040232567 Semiconductor integrated circuit
11/25/2004	US20040232563 Adhesive tape
11/25/2004	US20040232562 System and method for increasing bump pad height
11/25/2004	US20040232561 System and method to increase die stand-off height
11/25/2004	US20040232560 Flip chip assembly process and substrate used therewith
11/25/2004	US20040232559 Interconnect method for directly connected stacked integrated circuits
11/25/2004	US20040232558 Semiconductor device and method of manufacturing the same
11/25/2004	US20040232557 Semiconductor device having a metal insulator metal capacitor
11/25/2004	US20040232556 Integrated circuit inductor with integrated vias
11/25/2004	US20040232555 Semiconductor device with reduced interconnect capacitance
11/25/2004	US20040232554 Semiconductor device with effective heat-radiation
11/25/2004	US20040232553 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
11/25/2004	US20040232552 Air gap dual damascene process and structure
11/25/2004	US20040232551 Electrode structure for use in an integrated circuit
11/25/2004	US20040232549 Semiconductor device and manufacturing method thereof
11/25/2004	US20040232547 High aspect ratio contact surfaces having reduced contaminants
11/25/2004	US20040232546 Chip carrier plate
11/25/2004	US20040232545 Semiconductor device
11/25/2004	US20040232544 Semiconductor device and method of manufacturing the same
11/25/2004	US20040232543 Electronic component with a plastic housing and method for production thereof
11/25/2004	US20040232542 Carrier with metal bumps for semiconductor die packages
11/25/2004	US20040232540 Electronic device and method of manufacturing the same, circuit board, and electronic instrument
11/25/2004	US20040232539 Rearrangemet sheet, semiconductor device and method of manufacturing thereof
11/25/2004	US20040232537 Method and structure for interfacing electronic devices
11/25/2004	US20040232536 Semiconductor device comprising magnetic element
11/25/2004	US20040232533 Semiconductor apparatus and fabricating method for the same
11/25/2004	US20040232531 Semiconductor package device and method for fabricating the same
11/25/2004	US20040232530 Pre-applied thermoplastic reinforcement for electronic components
11/25/2004	US20040232528 Semiconductor device and method of manufacturing the same
11/25/2004	US20040232527 Semiconductor device
11/25/2004	US20040232525 Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same
11/25/2004	US20040232524 Scribe street width reduction by deep trench and shallow saw cut
11/25/2004	US20040232522 Semiconductor device, method of manufacturing semiconductor device, and method of evaluating manufacturing process of semiconductor device
11/25/2004	US20040232519 Electronic device and method of testing and of manufacturing
11/25/2004	US20040232518 Semiconductor memory device
11/25/2004	US20040232517 Semiconductor wafer, semiconductor device, and process for manufacturing the semiconductor device
11/25/2004	US20040232516 Semiconductor device and method for manufacturing the same
11/25/2004	US20040232515 Semiconductor device having two-layered charge storage electrode
11/25/2004	US20040232514 Semiconductor device having isolation region and method of manufacturing the same
11/25/2004	US20040232513 Silicon strain engineering accomplished via use of specific shallow trench isolation fill materials
11/25/2004	US20040232512 Semiconductor device and manufacturing method thereof
11/25/2004	US20040232511 Semiconductor device and method of manufacturing the same
11/25/2004	US20040232510 HV-SOI LDMOS device with integrated diode to improve reliability and avalanche ruggedness
11/25/2004	US20040232499 Transistor in semiconductor devices and method of fabricating the same
11/25/2004	US20040232498 Semiconductor integrated circuit device and manufacture method therefore
11/25/2004	US20040232497 Semiconductor device and method for manufacturing the same
11/25/2004	US20040232496 Use of voids between elements in semiconductor structures for isolation
11/25/2004	US20040232495 Thin-film transistor and method for manufacturing the same
11/25/2004	US20040232494 Semiconductor device and its manufacturing method, and electronic device
11/25/2004	US20040232493 Integrated circuits having channel regions with different ion levels
11/25/2004	US20040232492 Charge-device model electrostatic discharge protection using active device for CMOS circuits
11/25/2004	US20040232491 Semiconductor device and method for manufacturing the same
11/25/2004	US20040232490 SOI substrate and manufacturing method thereof
11/25/2004	US20040232489 Method for improving silicon-on-insulator (SOI) film uniformity on a semiconductor wafer
11/25/2004	US20040232488 Silicon oxycarbide substrates for bonded silicon on insulator
11/25/2004	US20040232487 Ultra-thin semiconductors bonded on glass substrates
11/25/2004	US20040232486 High-voltage lateral transistor with a multi-layered extended drain structure
11/25/2004	US20040232485 Semiconductor device
11/25/2004	US20040232483 Field effect transistor and application device thereof
11/25/2004	US20040232482 Trenched DMOS devices and methods and processes for making same
11/25/2004	US20040232481 Structure and method for forming a trench MOSFET having self-aligned features
11/25/2004	US20040232480 Semiconductor device and manufacturing method therefor
11/25/2004	US20040232479 Methods of forming vertical power devices having trench-based source electrodes with sidewall source contacts
11/25/2004	US20040232478 SONOS memory device having nano-sized trap elements
11/25/2004	US20040232477 Semiconductor memory device, semiconductor device and methods of manufacturing them, portable electronic equipment, and IC card
11/25/2004	US20040232476 EEPROM cell structures having non-uniform channel-dielectric thickness and methods of making the same
11/25/2004	US20040232475 Semiconductor memory
11/25/2004	US20040232474 Nonvolatile semiconductor memory device
11/25/2004	US20040232473 [flash memory cell, flash memory cell array and manufacturing method thereof]
11/25/2004	US20040232472 Nonvolatile semiconductor memory and method of manufacturing the same
11/25/2004	US20040232471 Semiconductor integrated circuit device and its manufacturing method
11/25/2004	US20040232469 Semiconductor device using high-dielectric-constant material and method of manufacturing the same
11/25/2004	US20040232468 Barrier layers for protecting metal oxides from hydrogen degradation
11/25/2004	US20040232467 TiSiN film forming method, diffusion barrier TiSiN film, semiconductor device, method of fabricating the same and TiSiN film forming system
11/25/2004	US20040232466 Memory cell with trench capacitor and vertical select transistor and an annular contact-making region formed between them
11/25/2004	US20040232464 Semiconductor integrated circuit device and manufacturing method thereof
11/25/2004	US20040232463 Capacitors including a cavity containing a buried layer and methods of manufacturing the same
11/25/2004	US20040232462 Semiconductor device manufacturing method and semiconductor device
11/25/2004	US20040232461 Single poly-si process for dram by deep n well (nw) plate
11/25/2004	US20040232460 Magnetic random access memory and a method for manufacturing thereof

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