H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2004
11/25/2004	WO2004044965A3 Method of producing semiconductor device
11/25/2004	WO2004044963A3 Atomic layer deposition methods
11/25/2004	WO2004042783A3 Hafnium nitride buffer layers for growth of gan on silicon
11/25/2004	WO2004034437A3 Improved performance of electronic and optoelectronic devices using a surfactant during epitaxial growth
11/25/2004	WO2004033103A9 High temperature, high strength, colorable materials for device processing systems
11/25/2004	WO2004027870A3 Series memory architecture
11/25/2004	WO2004020689A8 Systems and methods for forming metal oxides using metal organo-amines and metal organo-oxides
11/25/2004	WO2004010462A3 Infrared thermopile detector system for semiconductor process monitoring and control
11/25/2004	WO2003100826A8 Lithography laser with beam delivery and beam pointing control
11/25/2004	WO2003081671A3 Logic components from organic field effect transistors
11/25/2004	WO2003060991A3 Method of filling an isolation trench including two silicon nitride etching steps
11/25/2004	WO2003025255A3 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
11/25/2004	US20040237060 Integrated circuit device, clock layout system, clock layout method, and clock layout program
11/25/2004	US20040236548 Computer implemented method for development profile simulation, computer program product for controlling a computer system so as to simulate development profile, and computer implemented method for mask pattern data correction
11/25/2004	US20040236533 Test substrate reclamation method and apparatus
11/25/2004	US20040236530 System and method of heating up a semiconductor device in a standard test environment
11/25/2004	US20040236528 Method, device, computer-readable storage medium and computer program element for monitoring of a manufacturing process
11/25/2004	US20040236449 Flow conversion system for a manufacturing process, method for converting a process flow, system for controlling manufacturing process, method for controlling a manufacturing process and a computer program product
11/25/2004	US20040235996 Thermoplastic polymer or thermosetting resin (particulary an epoxy) and a catalyst, and optionally a phenoxy-containing compound; expandable filler(s); solvent; expands with heat to form a closed-cell foam structure used to apply chip scale packages to electronic components
11/25/2004	US20040235971 Using polysiloxane comprised of such as methyltrimethoxysilane and tetramethoxysilane; adhesion, uniformity, mechanical strength, reduced moisture absorption
11/25/2004	US20040235635 Photolithography methods and systems
11/25/2004	US20040235399 Method using active retainer rings for improving edge performance in CMP applications
11/25/2004	US20040235398 Chemical mechanical planarization method and apparatus for improved process uniformity, reduced topography and reduced defects
11/25/2004	US20040235396 Chemical/mechanical polishing method for STI
11/25/2004	US20040235393 Substrate polishing apparatus
11/25/2004	US20040235392 Polishing apparatus and polishing pad
11/25/2004	US20040235314 Method of manufacturing semiconductor device having nitride film with improved insulating properties
11/25/2004	US20040235313 Process for fabricating a semiconductor device having an insulating layer formed over a semiconductor substrate
11/25/2004	US20040235312 Process of cvd of hf and zr containing oxynitride films
11/25/2004	US20040235311 Base method treating method and electron device-use material
11/25/2004	US20040235310 Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring units
11/25/2004	US20040235308 Substrate treatment method and sustrate treatment apparatus
11/25/2004	US20040235307 Method and apparatus for process control in time division multiplexed (TDM) etch process
11/25/2004	US20040235306 Cleaning composition and method of washing a silicon wafer
11/25/2004	US20040235305 Method of making mirror image memory cell transistor pairs featuring poly floating spacers
11/25/2004	US20040235304 Plasma treatment apparatus
11/25/2004	US20040235302 Method of atomic layer deposition on plural semiconductor substrates simultaneously
11/25/2004	US20040235301 Method and device for polishing
11/25/2004	US20040235300 Transistor with independent gate structures
11/25/2004	US20040235299 Plasma ashing apparatus and endpoint detection process
11/25/2004	US20040235298 Plating solution, semiconductor device and method for manufacturing the same
11/25/2004	US20040235297 Reverse electroplating for damascene conductive region formation
11/25/2004	US20040235296 Control of stress in metal films by controlling the atmosphere during film deposition
11/25/2004	US20040235295 Methods for improving quality of high temperature oxide (HTO) formed from halogen-containing precursor and products thereof and apparatus thereof
11/25/2004	US20040235294 Method of electroless plating and semiconductor wafer having metal plating layer formed thereon
11/25/2004	US20040235293 Method for manufacturing semiconductor device
11/25/2004	US20040235292 Reduction of hillocks prior to dielectric barrier deposition in Cu damascene
11/25/2004	US20040235291 Very low dielectric constant plasma-enhanced CVD films
11/25/2004	US20040235290 Semiconductor device with tapered contact hole and wire groove
11/25/2004	US20040235289 Semiconductor integrated circuit device and method for making the same
11/25/2004	US20040235288 Semiconductor device and production method therefor
11/25/2004	US20040235287 Method of manufacturing semiconductor package and method of manufacturing semiconductor device
11/25/2004	US20040235286 Method of depositing an oxide layer on a substrate and a photovoltaic cell using said substrate
11/25/2004	US20040235285 Methods of producing integrated circuit devices utilizing tantalum amine derivatives
11/25/2004	US20040235284 Method for manufacturing device substrate with metal back-gate and structure formed thereby
11/25/2004	US20040235283 Multiple-gate MOS device and method for making the same
11/25/2004	US20040235282 Method of manufacturing semiconductor device
11/25/2004	US20040235281 Apparatus and methods for junction formation using optical illumination
11/25/2004	US20040235280 Method of forming a shallow junction
11/25/2004	US20040235279 Method of fabricating polycrystalline silicon and switching device using polycrystalline silicon
11/25/2004	US20040235278 Low-temperature, low-resistivity heavily doped P-type polysilicon deposition
11/25/2004	US20040235277 2N mask design for sequential lateral solidification
11/25/2004	US20040235276 Method of fabricating polysilicon film by excimer laser crystallization process
11/25/2004	US20040235275 Semiconductor device and method for manufacturing same
11/25/2004	US20040235274 Manufacturing method for a silicon substrate having strained layer
11/25/2004	US20040235273 Silicon-on-insulator (SOI) substrate and method for manufacturing the same
11/25/2004	US20040235272 Scribe street width reduction by deep trench and shallow saw cut
11/25/2004	US20040235271 Manufacture of wafer level semiconductor device with quality markings on the sealing resin
11/25/2004	US20040235269 Semiconductor wafer protective device and semiconductor wafer treatment method
11/25/2004	US20040235268 Fabrication of substrates with a useful layer of monocrystalline semiconductor material
11/25/2004	US20040235267 Lamination and delamination technique for thin film processing
11/25/2004	US20040235266 Method of room temperature covalent bonding
11/25/2004	US20040235264 Gettering of silicon on insulator using relaxed silicon germanium epitaxial proximity layers
11/25/2004	US20040235263 Method of improving HDP fill process
11/25/2004	US20040235262 Silicon-on-nothing fabrication process
11/25/2004	US20040235261 Solid state imaging device, method for producing the same, and portable electronic device
11/25/2004	US20040235260 Stack-type capacitor, semiconductor memory device having the same, and methods of manufacturing the capacitor and the semiconductor memory device
11/25/2004	US20040235259 Via0 etch process for fram integration
11/25/2004	US20040235256 Semiconductor device and method for manufacturing the same
11/25/2004	US20040235255 Method of manufacturing semiconductor device capable of suppressing impurity concentration reduction in doped channel region arising from formation of gate insulating film
11/25/2004	US20040235254 Method of manufacturing semiconductor device
11/25/2004	US20040235253 Method of fabricating recess transistor in integrated circuit device and recess transistor in integrated circuit device fabricated by the same
11/25/2004	US20040235252 Semiconductor device with increased effective channel length and method of manufacturing the same
11/25/2004	US20040235251 Method for making a semiconductor device having a high-k gate dielectric
11/25/2004	US20040235250 Symmetric trench MOSFET device and method of making same
11/25/2004	US20040235249 Method of manufacturing a semiconductor device with non-volatile memory comprising a memory cell with an access gate and with a control gate and a charge storage region
11/25/2004	US20040235248 Fabrication method of semiconductor integrated circuit device
11/25/2004	US20040235246 Fabrication of an OTP-EPROM having reduced leakage current
11/25/2004	US20040235245 Ferroelectric memory cell and methods for fabricating the same
11/25/2004	US20040235244 Method for forming uniform bottom electrode in trench of trench capacitor
11/25/2004	US20040235243 Circuit and method for a folded bit line memory cell with vertical transistor and trench capacitor
11/25/2004	US20040235242 Methods of forming capacitor constructions
11/25/2004	US20040235241 Method of manufacturing semiconductor device having capacitor
11/25/2004	US20040235240 Method of fabricating memory device with vertical transistors and trench capacitors
11/25/2004	US20040235239 Passivation planarization
11/25/2004	US20040235238 Multi-layer integrated circuit capacitor electrodes and methods of manufacturing the same
11/25/2004	US20040235237 Semiconductor device and method for manufacturing the same
11/25/2004	US20040235236 Integrated circuit with improved channel stress properties and a method for making it
11/25/2004	US20040235234 Semiconductor device and method of manufacturing the same
11/25/2004	US20040235233 Non-volatile memory device and a method of fabricating the same

1 ... 4073 4074 4075 4076 4077 4078 4079 4080 4081 4082 4083 4084 4085 4086 4087 4088 4089 4090 4091 4092 4093 ... 6590