H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2004
12/23/2004	WO2004079744A3 Magnetic memory cell junction and method for forming a magnetic memory cell junction
12/23/2004	WO2004076574A3 Cmp composition comprising a sulfonic acid and a method for polishing noble metals
12/23/2004	WO2004073023A3 Low voltage nmos-based electrostatic discharge clamp
12/23/2004	WO2004070817A3 Method of eliminating residual carbon from flowable oxide fill material
12/23/2004	WO2004066345A3 Doped semiconductor nanocrystal layers and preparation thereof
12/23/2004	WO2004063417A3 Method to improve cracking thresholds and mechanical properties of low-k dielectric material
12/23/2004	WO2004055594A3 Method and system for determining characteristics of substrates employing fluid geometries
12/23/2004	WO2004051752A3 Boron phosphide-based compound semiconductor device, production method thereof and light-emitting diode
12/23/2004	WO2004044963B1 Atomic layer deposition methods
12/23/2004	WO2004025739A3 Method for producing an integrated pin diode and corresponding circuit
12/23/2004	WO2004025727A8 Method for sealing a microcavity and package comprising at least one microcavity
12/23/2004	WO2004021457A3 Method for producing an electromagnetic radiation-emitting semiconductor chip and a corresponding electromagnetic radiation-emitting semiconductor chip
12/23/2004	WO2004001433A9 Electronic circuit with asynchronously operating components
12/23/2004	WO2003097532A8 Process for manufacturing a gallium rich gallium nitride film
12/23/2004	WO2003096351A8 Memories and memory circuits
12/23/2004	WO2003052797A9 Electrically pumped long-wavelength vcsel and methods of fabrication
12/23/2004	WO2003013993A9 Reticle protection and transport
12/23/2004	WO2002091809A3 Method and device for generating an activated gas curtain for surface treatment
12/23/2004	US20040261048 Wire trimmed programmable logic array
12/23/2004	US20040261044 Method for setting design margin for LSI
12/23/2004	US20040260992 Test circuit, integrated circuit, and test method
12/23/2004	US20040260983 Latched sense amplifiers as high speed memory in a memory system
12/23/2004	US20040260975 Semiconductor integrated circuit
12/23/2004	US20040260920 Starting point configuration determination for complex configurable systems
12/23/2004	US20040260713 LSI apparatus
12/23/2004	US20040260660 Service method, service system and manufacturing / inspection apparatus
12/23/2004	US20040260503 Inspecting apparatus for semiconductor device
12/23/2004	US20040260496 Method for inspecting defect and system therefor
12/23/2004	US20040260420 Processing method and processing system
12/23/2004	US20040260404 Method and apparatus for self-configuring supervisory control and data acquisition (SCADA) system for distributed control
12/23/2004	US20040260031 Preparation of polymer and resist composition
12/23/2004	US20040259761 Cleaning composition, method of cleaning semiconductor substrate, and method of forming wiring on semiconductor substrate
12/23/2004	US20040259486 Polishing apparatus
12/23/2004	US20040259482 Chemical mechanical polishing apparatus and method of chemical mechanical polishing
12/23/2004	US20040259481 Method of polishing semiconductor copper interconnect integrated with extremely low dielectric constant material
12/23/2004	US20040259477 Pad conditioner control using feedback from a measured polishing pad roughness level
12/23/2004	US20040259476 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
12/23/2004	US20040259453 Method for manufacturing light emitting device
12/23/2004	US20040259402 Tray transfer unit and automatic test handler having same
12/23/2004	US20040259389 Method for manufacturing a semiconductor device
12/23/2004	US20040259388 Method for heat treating a semiconductor wafer
12/23/2004	US20040259387 Laser irradiation apparatus and method of fabricating semiconductor device
12/23/2004	US20040259386 Semiconductor device and method of manufacturing the same
12/23/2004	US20040259385 Method of forming insulating film improved in electric insulating property
12/23/2004	US20040259384 Integrated circuit insulator and method
12/23/2004	US20040259383 Method of forming a metal oxide film
12/23/2004	US20040259382 Apparatus and method of producing dope
12/23/2004	US20040259381 Method for manufacturing semiconductor device
12/23/2004	US20040259380 Plasma surface treatment system and plasma surface treatment method
12/23/2004	US20040259379 Low temperature nitridation of silicon
12/23/2004	US20040259378 Methods and devices for the suppression of copper hillock formation
12/23/2004	US20040259376 Method of reducing stress migration in integrated circuits
12/23/2004	US20040259375 Removal of metal oxidation
12/23/2004	US20040259374 Semiconductor device and method for manufacturing same
12/23/2004	US20040259373 Chemically amplified resist composition, process for manufacturing semiconductor device and patterning process
12/23/2004	US20040259371 Reduction of resist defects
12/23/2004	US20040259370 Vapor phase etching MEMS devices
12/23/2004	US20040259369 Method of forming gate electrode in semiconductor device
12/23/2004	US20040259368 Method for forming a bottle-shaped trench
12/23/2004	US20040259366 Method and composition for the chemical-vibrational-mechanical planarization of copper
12/23/2004	US20040259365 Polishing method polishing system and method for fabricating semiconductor device
12/23/2004	US20040259364 Stage base, substrate processing apparatus, and maintenance method for stage
12/23/2004	US20040259361 Surface processing method of a specimen and surface processing apparatus of the specimen
12/23/2004	US20040259360 STI structure and fabricating methods thereof
12/23/2004	US20040259358 Self-aligned mask to reduce cell layout area
12/23/2004	US20040259357 Surface treatment method, semiconductor device, method of fabricating semiconductor device, and treatment apparatus
12/23/2004	US20040259356 Processing method
12/23/2004	US20040259355 Boron-doped amorphous carbon film for use as a hard etch mask during the formation of a semiconductor device
12/23/2004	US20040259354 Deposition stop time detection apparatus and methods for fabricating copper wiring using the same
12/23/2004	US20040259353 Methods of forming boron carbo-nitride layers for integrated circuit devices
12/23/2004	US20040259352 Corrosion resistance for copper interconnects
12/23/2004	US20040259351 Method for manufacturing semiconductor package
12/23/2004	US20040259350 Forming method of silicide film
12/23/2004	US20040259349 Method of manufacturing a semiconductor device including a multi-layer interconnect structure
12/23/2004	US20040259348 Method of reducing post-CMP defectivity
12/23/2004	US20040259347 Method and an apparatus for a hard-coded bit value changeable in any layer of metal
12/23/2004	US20040259346 Semiconductor device having a ball grid array and a fabrication process thereof
12/23/2004	US20040259345 Formation method of conductive bump
12/23/2004	US20040259344 Method for forming a metal layer method for manufacturing a semiconductor device using the same
12/23/2004	US20040259343 Composite spacer liner for improved transistor performance
12/23/2004	US20040259342 Hatted polysilicon gate structure for improving salicide performance and method of forming the same
12/23/2004	US20040259341 Method of forming dual gate insulator layers for CMOS applications
12/23/2004	US20040259340 Transistor with notched gate
12/23/2004	US20040259339 Process for producing semiconductor integrated circuit device and semiconductor integrated circuit device
12/23/2004	US20040259338 Etch stop layer in poly-metal structures
12/23/2004	US20040259337 Method for fabricating a metallic oxide of high dielectric constant, metallic oxide of high dielectric constant, gate insulating film and semiconductor element
12/23/2004	US20040259336 [method of forming contact opening and method of forming semiconductor device]
12/23/2004	US20040259335 Photovoltaic cell and production thereof
12/23/2004	US20040259334 High-quality SGOI by annealing near the alloy melting point
12/23/2004	US20040259333 Method to planarize and reduce defect density of silicon germanium
12/23/2004	US20040259332 Method for manufacturing semiconductor chip
12/23/2004	US20040259331 Method of manufacturing a semiconductor device
12/23/2004	US20040259330 Semiconductor device and method for producing the same by dicing
12/23/2004	US20040259329 Machining substrates, particulary semiconductor wafers
12/23/2004	US20040259328 Substrate manufacturing method and substrate processing apparatus
12/23/2004	US20040259327 Method for manufacturing SOI wafer and thus-manufactured SOI wafer
12/23/2004	US20040259326 Manufacturing process for ultra slim electrooptic display device unit
12/23/2004	US20040259325 Wafer level chip scale hermetic package
12/23/2004	US20040259324 Chemical thinning of silicon body of an SOI substrate
12/23/2004	US20040259323 Semiconductor structure containing field oxide and method for fabricating the same

1 ... 4041 4042 4043 4044 4045 4046 4047 4048 4049 4050 4051 4052 4053 4054 4055 4056 4057 4058 4059 4060 4061 ... 6590