H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2004
12/30/2004	US20040262667 Methods of forming memory devices and memory cell constructions
12/30/2004	US20040262666 Semiconductor storage device, mobile electronic apparatus, and method for controlling the semiconductor storage device
12/30/2004	US20040262665 Semiconductor storage device, method for operating thereof, semiconductor device and portable electronic equipment
12/30/2004	US20040262664 Non-volatile memory cell with dielectric spacers along sidewalls of a component stack, and method for forming same
12/30/2004	US20040262663 Semiconductor device with transistor and capacitor and its manufacture method
12/30/2004	US20040262662 Method for fabricating capacitor of semiconductor device
12/30/2004	US20040262661 Integrated circuit devices with metal-insulator-metal capacitors and methods of forming the same
12/30/2004	US20040262660 Single poly-si process for DRAM by deep N well (NW) plate
12/30/2004	US20040262659 Semiconductor memory with trench capacitor and method of manufacturing the same
12/30/2004	US20040262658 Method of forming integrated circuit structures in silicone ladder polymer
12/30/2004	US20040262657 Interconnect line selectively isolated from an underlying contact plug
12/30/2004	US20040262656 Memory device
12/30/2004	US20040262655 Ferroelectric random access memory capacitor and method for manufacturing the same
12/30/2004	US20040262654 Magnetoresistive effect element and magnetic memory device
12/30/2004	US20040262650 Semiconductor device, method for producing the same, and information processing apparatus
12/30/2004	US20040262649 forming layers of nickel over silicon regions of substrate, then forming layer cobalt over the nickel layer to form a multilayer and annealing to silicide films, for integrated circuit and semiconductors; siliciding; chemical resistance
12/30/2004	US20040262647 Variable threshold voltage complementary MOSFET with SOI structure
12/30/2004	US20040262646 Pixel design to maximize photodiode capacitance and method of forming same
12/30/2004	US20040262644 Hybrid integrated circuit device
12/30/2004	US20040262642 Semiconductor device and manufacturing method thereof
12/30/2004	US20040262641 Trench isolation for semiconductor devices
12/30/2004	US20040262640 Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor
12/30/2004	US20040262639 Semiconductor integrated circuit
12/30/2004	US20040262638 Integrated circuit with dram memory cell
12/30/2004	US20040262637 Memory device for storing electrical charge and method for fabricating the same
12/30/2004	US20040262636 Fluidic nanotubes and devices
12/30/2004	US20040262635 Three-dimensional integrated circuit structure and method of making same
12/30/2004	US20040262634 Hetero-junction bipolar transistor and manufacturing method thereof
12/30/2004	US20040262631 Controlling threading dislocation densities in Ge on Si using graded GeSi layers and planarization
12/30/2004	US20040262630 Group III nitride crystals usable as group III nitride substrate, method of manufacturing the same, and semiconductor device including the same
12/30/2004	US20040262629 Semiconductor component and method of manufacturing same
12/30/2004	US20040262628 Semiconductor device including band-engineered superlattice
12/30/2004	US20040262624 GaN substrate and method of fabricating the same, nitride semiconductor device and method of fabricating the same
12/30/2004	US20040262621 Bonding pad for gallium nitride-based light-emitting devices
12/30/2004	US20040262613 Silicon nitride film, a semiconductor device, a display device and a method for manufacturing a silicon nitride film
12/30/2004	US20040262611 [thin film tansistor array panel and fabricating method thereof]
12/30/2004	US20040262610 Liquid crystal display device having polycrystalline TFT and fabricating method thereof
12/30/2004	US20040262609 Reduced barrier photodiode/transfer gate device structure of high efficiency charge transfer and reduced lag and method of formation, and
12/30/2004	US20040262606 Semiconductor device and method for forming the same
12/30/2004	US20040262604 Test structure for detecting defect size in a semiconductor device and test method using same
12/30/2004	US20040262599 Organic field effect transistor, method for production and use thereof in the assembly of integrated circuits
12/30/2004	US20040262598 Logic apparatus and logic circuit
12/30/2004	US20040262597 Semiconductor device including mosfet having band-engineered superlattice
12/30/2004	US20040262596 Semiconductor device including band-engineered superlattice
12/30/2004	US20040262595 Semiconductor device including band-engineered superlattice
12/30/2004	US20040262594 Semiconductor structures having improved conductivity effective mass and methods for fabricating same
12/30/2004	US20040262583 Quantum dots of group IV semiconductor materials
12/30/2004	US20040262569 Etchant for etching double-layered copper structure and method of forming array substrate having double-layered copper structures
12/30/2004	US20040262548 Wafer mapping device and load port with the device
12/30/2004	US20040262545 Laser-produced plasma EUV light source with isolated plasma
12/30/2004	US20040262543 Variably shaped beam EB writing system
12/30/2004	US20040262540 Surface treating device and surface treating method
12/30/2004	US20040262539 Electron beam source and electron beam exposure apparatus employing the electron beam source
12/30/2004	US20040262529 Pattern defect inspection method and its apparatus
12/30/2004	US20040262519 Electron beam inspection apparatus and method for testing an operation state of an electron beam inspection apparatus
12/30/2004	US20040262373 Solder ball mounting method and apparatus therefor
12/30/2004	US20040262370 High reliability solder joint with multilayer structure
12/30/2004	US20040262369 Semiconductor device and a wire bonding method
12/30/2004	US20040262290 Method and system to process semiconductor wafers
12/30/2004	US20040262272 Sequential lateral solidification device
12/30/2004	US20040262265 Wet processing apparatus, wet processing method and manufacturing method of semiconductor device
12/30/2004	US20040262264 Improved cd uniformity of chrome etch to photomask process
12/30/2004	US20040262263 Etching methods and apparatus and substrate assemblies produced therewith
12/30/2004	US20040262262 Process for patterning high-k dielectric material
12/30/2004	US20040262260 Method and system for processing multi-layer films
12/30/2004	US20040262256 Detection of hardmask removal using a selective etch
12/30/2004	US20040262254 Processed object processing apparatus, processed object processing method, pressure control method, processed object transfer method, and transfer apparatus
12/30/2004	US20040262245 Device for accomodating substrates
12/30/2004	US20040262187 Clean room transportation package for process chamber kit
12/30/2004	US20040262168 Methods of electopolishing patterned substrates
12/30/2004	US20040262165 Plating method
12/30/2004	US20040262035 Electronic component mounting structure
12/30/2004	US20040262032 Multilayer composite and method for preparing the same
12/30/2004	US20040261981 For dissipation of heat generated in electronic devices
12/30/2004	US20040261977 Mask and substrate alignment for solder bump process
12/30/2004	US20040261947 Bonding apparatus
12/30/2004	US20040261946 Plasma processing apparatus, focus ring, and susceptor
12/30/2004	US20040261944 Polishing device and substrate processing device
12/30/2004	US20040261904 underlays comprising anhydride adducts of rosins and derivatives, for use in microelectronic packages
12/30/2004	US20040261839 Fabrication of back-contacted silicon solar cells using thermomigration to create conductive vias
12/30/2004	US20040261823 Providing encapsulating transport, applying the at least one encapsulating transport to the layer, the layer being a chemically reactive layer; wherein the encapsulating transport ruptures on the chemically reactive layer and releases the reactive gas onto the chemically reactive layer
12/30/2004	US20040261818 Method and apparatus for determining liquid flow rate
12/30/2004	US20040261817 Foreign matter removing apparatus, substrate treating apparatus, and substrate treating method
12/30/2004	US20040261816 Exposing a semiconductor wafer to bidentate chelating ligands; andremoving metal complexes formed by those chelating ligands
12/30/2004	US20040261814 Methods for resist stripping and cleaning surfaces substantially free of contaminants
12/30/2004	US20040261722 Multi-thermal zone shielding apparatus
12/30/2004	US20040261721 Substrate support having dynamic temperature control
12/30/2004	US20040261720 High-density plasma processing apparatus
12/30/2004	US20040261719 Proximity deposition
12/30/2004	US20040261718 Plasma source coil for generating plasma and plasma chamber using the same
12/30/2004	US20040261717 Matching device and plasma processing apparatus
12/30/2004	US20040261714 Plasma processing apparatus
12/30/2004	US20040261713 Monitoring system for plasma deposition facility
12/30/2004	US20040261712 Plasma processing apparatus
12/30/2004	US20040261711 Apparatus and system for, and method of supplying process gas in semiconductor device manufacturing equipment
12/30/2004	US20040261710 Processing apparatus, transferring apparatus, and transferring method
12/30/2004	US20040261709 Manufacturing apparatus
12/30/2004	US20040261706 Method of growing a thin film onto a substrate
12/30/2004	US20040261705 Mass flow controller and gas supplying apparatus having the same
12/30/2004	US20040261704 Method and device for monitoring a CVD-process

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