H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2004
12/30/2004	US20040263812 Imaging device in a projection exposure facility
12/30/2004	US20040263809 Immersion exposure technique
12/30/2004	US20040263808 Immersion photolithography system and method using inverted wafer-projection optics interface
12/30/2004	US20040263746 Array substrate for LCD device having double-layered metal structure and manufacturing method thereof
12/30/2004	US20040263739 Progressive aligned deposition
12/30/2004	US20040263728 Liquid crystal display panel and method for manufacturing light reflecting film thereof
12/30/2004	US20040263712 Method for producing display-device
12/30/2004	US20040263709 Method of manufacturing thin film transistor array panel and liquid crystal display
12/30/2004	US20040263705 Liquid crystal display device having polycrystalline silicon thin film transistor and method of fabricating the same
12/30/2004	US20040263704 Polycrystalline liquid crystal display device and method of fabricating the same
12/30/2004	US20040263455 Display device and method of manufacturing the same
12/30/2004	US20040263429 Large field of view protection optical system with aberration correctability for flat panel displays
12/30/2004	US20040263308 Inductor formed between two layout layers
12/30/2004	US20040263269 MOS-type variable capacitance element and voltage control oscillation circuit
12/30/2004	US20040263235 Impedance adjustment circuit, impedance adjustment method, and semiconductor device
12/30/2004	US20040263205 Mask-programmable logic devices with programmable gate array sites
12/30/2004	US20040263193 Inspecting apparatus for semiconductor device
12/30/2004	US20040263145 Semiconductor integrated device
12/30/2004	US20040263132 Power supply control apparatus including control circuit chip with reverse-connected battery protection
12/30/2004	US20040263108 Decoupled planar positioning system
12/30/2004	US20040263000 Lithographic apparatus and device manufacturing method
12/30/2004	US20040262999 Linear motor armature and linear motor
12/30/2004	US20040262812 Method for wafer scale molding of protective caps
12/30/2004	US20040262811 Method for making a direct chip attach device and structure
12/30/2004	US20040262784 High performance cmos device structures and method of manufacture
12/30/2004	US20040262783 Semiconductor device with alignment mark
12/30/2004	US20040262782 Polymer encapsulated electrical devices
12/30/2004	US20040262780 Electronic component and method for its production
12/30/2004	US20040262778 Electromigration barrier layers for solder joints
12/30/2004	US20040262776 Mold compound cap in a flip chip multi-matrix array package and process of making same
12/30/2004	US20040262774 Multi-chip packages having a plurality of flip chips and methods of manufacturing the same
12/30/2004	US20040262772 Methods for bonding wafers using a metal interlayer
12/30/2004	US20040262771 Stacked capacitor-type semiconductor storage device and manufacturing method thereof
12/30/2004	US20040262770 Semiconductor capacitive element, method for manufacturing same and semiconductor device provided with same
12/30/2004	US20040262769 Semiconductor device and method of manufacturing the same
12/30/2004	US20040262768 Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same
12/30/2004	US20040262767 Semiconductor device
12/30/2004	US20040262764 Dual damascene interconnect structures having different materials for line and via conductors
12/30/2004	US20040262761 Metal thin film of semiconductor device and method for forming same
12/30/2004	US20040262760 Under bump metallization structure of a semiconductor wafer
12/30/2004	US20040262759 comprising adhesive, barrier and wetting layers for enhancing the bonding strength of the connection of bonding pads to wafers and solders
12/30/2004	US20040262758 Electronic device and method of manufacturing the same, and electronic instrument
12/30/2004	US20040262755 Under bump metallization structure of a semiconductor wafer
12/30/2004	US20040262754 IC die support structures for ball grid array package fabrication
12/30/2004	US20040262753 Flip chip packaging structure and related packaging method
12/30/2004	US20040262751 Electronic device manufacture
12/30/2004	US20040262750 Underfill and mold compounds including siloxane-based aromatic diamines
12/30/2004	US20040262747 Multichip module
12/30/2004	US20040262746 High-density chip scale package and method of manufacturing the same
12/30/2004	US20040262744 Diamondoid-containing thermally conductive materials
12/30/2004	US20040262742 Semiconductor package with heat sink
12/30/2004	US20040262741 Resin molded semiconductor device and mold
12/30/2004	US20040262736 Tape carrier package
12/30/2004	US20040262735 Semiconductor device and production method thereof
12/30/2004	US20040262732 Semiconductor device and manufacturing method thereof
12/30/2004	US20040262730 Semiconductor carrier film, and semiconductor device and liquid crystal module using the same
12/30/2004	US20040262726 Electromigration barrier layers for solder joints
12/30/2004	US20040262723 Semiconductor device
12/30/2004	US20040262722 Chip mounting method and mounted substrate manufacturing apparatus
12/30/2004	US20040262721 Manufacturing method for power semiconductor electronic devices
12/30/2004	US20040262716 Semiconductor package having built-in micro electric mechanical system and manufacturing method thereof
12/30/2004	US20040262715 Semiconductor device and manufacturing method for the same
12/30/2004	US20040262714 Semiconductor device and method of manufacturing the same
12/30/2004	US20040262713 High fT and fmax Bipolar Transistor and Method of Making Same
12/30/2004	US20040262710 Semiconductor device
12/30/2004	US20040262709 Semiconductor apparatus including a thin-metal-film resistor element and a method of manufacturing the same
12/30/2004	US20040262708 Semiconductor device and method of fabricating the same
12/30/2004	US20040262707 Semiconductor device and method of manufacturing the same
12/30/2004	US20040262706 Semiconductor memory device having pick-up structure
12/30/2004	US20040262702 Low-density, high-resistivity titanium nitride layer for use as a contact for low-leakage dielectric layers
12/30/2004	US20040262701 Nitridation process for independent control of device gate leakage and drive current
12/30/2004	US20040262700 Lanthanide oxide / hafnium oxide dielectrics
12/30/2004	US20040262699 N-gate transistor
12/30/2004	US20040262698 High-density finfet integration scheme
12/30/2004	US20040262697 Semiconductor gate structure and method for fabricating a semiconductor gate structure
12/30/2004	US20040262695 Selective silicon-on-insulator isolation structure and method
12/30/2004	US20040262694 Transistor device containing carbon doped silicon in a recess next to MDD to create strain in channel
12/30/2004	US20040262693 Semiconductor storage device and semiconductor integrated circuit
12/30/2004	US20040262692 Nonplanar device with stress incorporation layer and method of fabrication
12/30/2004	US20040262691 Semiconductor structure having a compensated resistance in the LDD area and method for producing the same
12/30/2004	US20040262690 High-density MOS transistor
12/30/2004	US20040262688 METHOD OF MAKING A finFET HAVING SUPPRESSED PARASITIC DEVICE CHARACTERISTICS
12/30/2004	US20040262687 Fin field effect transistors and fabrication methods thereof
12/30/2004	US20040262686 Layer transfer technique
12/30/2004	US20040262683 PMOS transistor strain optimization with raised junction regions
12/30/2004	US20040262682 Silicon oxidation method
12/30/2004	US20040262681 Semiconductor device
12/30/2004	US20040262680 Dmos transistor
12/30/2004	US20040262679 Semiconductor storage device and semiconductor integrated circuit
12/30/2004	US20040262678 Semiconductor device and a method of manufacturing the same
12/30/2004	US20040262677 Vertical MOS transistor
12/30/2004	US20040262676 Methods of fabricating Fin-field effect transistors (Fin-FETs) having protection layers and devices related thereto
12/30/2004	US20040262675 Semiconductor device
12/30/2004	US20040262674 Semiconductor memory device with bit line of small resistance and manufacturing method thereof
12/30/2004	US20040262673 Read-only memory cell and fabrication method thereof
12/30/2004	US20040262672 [high-k tunneling dielectric for read only memory device and fabrication method thereof]
12/30/2004	US20040262671 Flash cell with trench source-line connection
12/30/2004	US20040262670 Semiconductor device including nonvolatile memory and method for fabricating the same
12/30/2004	US20040262669 One transistor flash memory cell
12/30/2004	US20040262668 Novel dual bit split gate flash memory

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