Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2004
12/28/2004US6835507 Mask for use in measuring flare, method of manufacturing the mask, method of identifying flare-affected region on wafer, and method of designing new mask to correct for flare
12/28/2004US6835502 Masking having detectors for detection and measurement of variable film wear or thinning, induced by exposure to light sources during printing
12/28/2004US6835423 Method of fabricating a magnetic element with insulating veils
12/28/2004US6835415 Compliant layer chucking surface
12/28/2004US6835414 Low energy plasma discharges; generation high frequency electromagnetic radiation in container
12/28/2004US6835344 Process of making a thermoplastic container
12/28/2004US6835319 Method of patterning a substrate
12/28/2004US6835292 Electrochemical thin film polishing method and polishing apparatus
12/28/2004US6835289 Particle implantation apparatus and particle implantation method
12/28/2004US6835277 Ashing apparatus for semiconductor device
12/28/2004US6835276 Window for allowing end point of etching process to be detected and etching device comprising the same
12/28/2004US6835275 Reducing deposition of process residues on a surface in a chamber
12/28/2004US6835274 Electrical connecting device and electrical connecting method
12/28/2004US6835260 Method to produce pedestal features in constrained sintered substrates
12/28/2004US6835246 Nanostructures for hetero-expitaxial growth on silicon substrates
12/28/2004US6835233 Method and apparatus for reducing particle contamination
12/28/2004US6835121 Chemical-mechanical polishing methods
12/28/2004US6835120 Method and apparatus for mechanochemical polishing
12/28/2004US6835039 Method and apparatus for batch processing of wafers in a furnace
12/28/2004US6834848 Atomizer
12/28/2004US6834777 Closed loop control over delivery of liquid material to semiconductor processing tool
12/28/2004US6834656 During etching, from semiconductors/wafers; dielectrics; integrated circuits
12/28/2004US6834613 Plasma-resistant member and plasma treatment apparatus using the same
12/28/2004US6834440 Wafer spin drying apparatus with a plurality of supply nozzles and methods for using the same
12/23/2004WO2004112445A1 Soft x-ray applying apparatus, semiconductor assembling apparatus, and inspecting instrument
12/23/2004WO2004112238A1 Low-noise amplifier
12/23/2004WO2004112154A1 Process for producing light-emitting diode element emitting white light
12/23/2004WO2004112150A1 Field effect transistor
12/23/2004WO2004112149A1 Trench-gate semiconductor devices
12/23/2004WO2004112147A1 Gate-induced strain for mos performance improvement
12/23/2004WO2004112146A1 Finfet with dual silicon gate layer for chemical mechanical polishing planarization
12/23/2004WO2004112145A1 Semiconductor integrated circuit device having improved punch-through resistance and its manufacturing method, and semiconductor integrated circuit device including low-voltage transistor and high-voltage transistor
12/23/2004WO2004112144A1 Dc amplifier and semiconductor integrated circuit thereof
12/23/2004WO2004112143A1 Switch capacitor circuit and semiconductor integrated circuit thereof
12/23/2004WO2004112142A1 Limiter circuit and semiconductor integrated circuit thereof
12/23/2004WO2004112141A1 Frequency converting circuit of direct conversion reception, semiconductor integrated circuit thereof, and direct conversion receiver
12/23/2004WO2004112140A1 Mixer circuit
12/23/2004WO2004112139A1 Semiconductor device and its manufacturing method
12/23/2004WO2004112138A1 Semiconductor device and method for manufacturing same
12/23/2004WO2004112136A1 Electronic device
12/23/2004WO2004112135A1 Substrate for semiconductor devices and semiconductor device
12/23/2004WO2004112134A1 Package for a high-frequency electronic device
12/23/2004WO2004112132A1 Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe
12/23/2004WO2004112128A2 Low profile stacking system and method
12/23/2004WO2004112127A1 Soi shaped structure
12/23/2004WO2004112126A1 A method of preparation of an epitaxial substrate
12/23/2004WO2004112125A1 Method for production of a very thin layer with thinning by means of induced self-support
12/23/2004WO2004112124A2 Improved annealing method for stabilisation
12/23/2004WO2004112123A1 Dipolar electrostatic chuck
12/23/2004WO2004112122A1 Semiconductor crystal defect etch
12/23/2004WO2004112121A1 Mis transistor and cmos transistor
12/23/2004WO2004112120A1 Method for etching silicon substrate
12/23/2004WO2004112119A1 Method and apparatus for etching silicon and etched silicon body
12/23/2004WO2004112118A1 A method of fault detection in manufaturing equipment
12/23/2004WO2004112116A1 Method for processing nitride semiconductor crystal surface and nitride semiconductor crystal obtained by such method
12/23/2004WO2004112115A1 Remover liquid and removing method for antireflective film and buried material containing silicon
12/23/2004WO2004112114A1 Process for depositing film, process for fabricating semiconductor device, semiconductor device and system for depositing film
12/23/2004WO2004112113A1 Semiconductor wafer heat-treatment method and vertical boat for heat treatment
12/23/2004WO2004112112A1 Iii nitride crystal and method for producing same
12/23/2004WO2004112111A1 Compound semiconductor, method for producing same and compound semiconductor device
12/23/2004WO2004112110A1 Crystallized film and process for production thereof
12/23/2004WO2004112109A1 Defect-free semiconductor templates for epitaxial growth and method of making same
12/23/2004WO2004112106A1 Resist exfoliating apparatus
12/23/2004WO2004112105A2 Multi-step chemical mechanical polishing of a gate area in a finfet
12/23/2004WO2004112104A2 Low temperature process for tft fabrication
12/23/2004WO2004112103A1 Pressure controlled heat source and method for using such for rtp
12/23/2004WO2004112102A2 Method for forming a sgoi by annealing near the sige alloy melting point
12/23/2004WO2004112100A1 Bonding device and bonding method
12/23/2004WO2004112096A2 Method and system for high volume transfer of dies to substrates
12/23/2004WO2004112095A2 Thermoplastic fluxing underfill composition and method
12/23/2004WO2004112092A2 Adjustable gas distribution system
12/23/2004WO2004112091A2 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
12/23/2004WO2004112089A2 Method and system for fabricating multi layer devices on a substrate
12/23/2004WO2004112077A2 Rf current return path for a large area substrate plasma reactor
12/23/2004WO2004112056A1 Multilayer unit
12/23/2004WO2004112042A2 Non-volatile memory device
12/23/2004WO2004111735A1 Micropattern formation material and method of micropattern formation
12/23/2004WO2004111730A2 Developer composition for resists and method for formation of resist pattern
12/23/2004WO2004111728A1 Method for storing data and device for storing data
12/23/2004WO2004111727A2 Methods of removing photoresist from substrates
12/23/2004WO2004111659A2 Methods and apparatus for packaging integrated circuit devices
12/23/2004WO2004111319A2 Sacrificial template method of fabricating a nanotube
12/23/2004WO2004111297A1 Treatment gas supply mechanism, film-forming device, and film-forming method
12/23/2004WO2004111296A2 Stress reduction of sioc low k film by addition of alkylenes to omcts based processes
12/23/2004WO2004111157A1 Polishing fluid for metal and polishing method
12/23/2004WO2004111148A1 Film-like adhesive, process for producing the same, adhesive sheet and semiconductor device
12/23/2004WO2004111146A1 Polishing composition and method for polishing a conductive material
12/23/2004WO2004110957A1 Aluminum nitride conjugate body and method of producing the same
12/23/2004WO2004110952A1 Barium titanate based semiconductor porcelain composition
12/23/2004WO2004110929A1 Silane polymer and method for forming silicon film
12/23/2004WO2004110698A2 Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes
12/23/2004WO2004110657A2 Uniform cavitation for particle removal
12/23/2004WO2004097944A3 Silicon carbide mosfets with integrated antiparallel junction barrier schottky free wheeling diodes and methods of fabricating same
12/23/2004WO2004097894A3 Self-organized nanopore arrays with controlled symmetry and order
12/23/2004WO2004095554A3 Method for preparing a device structure having a wafer structure deposited on a composite substrate having a matched coefficient of thermal expansion
12/23/2004WO2004095553A3 Method for producing a strained layer on a substrate and corresponding layer structure
12/23/2004WO2004090937A3 Copper cmp slurry composition
12/23/2004WO2004086466A3 System and method for monitoring contamination
12/23/2004WO2004084303A3 Flip-chip arrangment on a substrate carrier
12/23/2004WO2004081989A3 Angled implant for trench isolation