Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2005
01/04/2005US6837984 Methods and apparatus for electropolishing metal interconnections on semiconductor devices
01/04/2005US6837983 Endpoint detection for electro chemical mechanical polishing and electropolishing processes
01/04/2005US6837979 Plating conductive layer by applying a plating solution using an anode having a pad attached, when anode and substrate are energized with electric power; altering texture of top portion of conductive layer when pad makes contact with top portion
01/04/2005US6837978 Actuator is connected to the holder and adjustably positions the substrate relative to the electrolyte cell;
01/04/2005US6837975 Asymmetric rotating sidewall magnet ring for magnetron sputtering
01/04/2005US6837968 Lower pedestal shield
01/04/2005US6837967 Method and apparatus for cleaning deposited films from the edge of a wafer
01/04/2005US6837966 Method and apparatus for an improved baffle plate in a plasma processing system
01/04/2005US6837965 Method and apparatus for etch processing with end point detection thereof
01/04/2005US6837963 Generating and accelerating the ions by means of an electric field and radiating an ion flow onto an edge part of semiconductor substrate to clean the edge part of the substrate
01/04/2005US6837944 Cleaning and drying method and apparatus
01/04/2005US6837943 Method and apparatus for cleaning a semiconductor substrate
01/04/2005US6837941 Cleaning and handling methods of electronic component and cleaning apparatus thereof
01/04/2005US6837940 Film-forming device with a substrate rotating mechanism
01/04/2005US6837938 Apparatus associatable with a deposition chamber to enhance uniformity of properties of material layers formed on semiconductor substrates therein
01/04/2005US6837936 Semiconductor manufacturing device
01/04/2005US6837781 Dissolving an inert gas in a polyurethane with raw materials; reaction injection molding yields foam with small and uniform cells; semiconductor wafers
01/04/2005US6837777 Wafer edge cleaning utilizing polish pad material
01/04/2005US6837776 Flat-object holder and method of using the same
01/04/2005US6837773 Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates
01/04/2005US6837672 Apparatus for and method of transferring substrates
01/04/2005US6837663 Loading and unloading station for semiconductor processing installations
01/04/2005US6837632 Substrate treating apparatus
01/04/2005US6837631 Substrate processing method and substrate processing apparatus
01/04/2005US6837619 Furnace temperature detector
01/04/2005US6837589 Heater module of rapid thermal processing apparatus
01/04/2005US6837483 Gate valve assembly
01/04/2005US6837418 Bondhead lead clamp apparatus and method
01/04/2005US6837374 300MM single stackable film frame carrier
01/04/2005US6837253 Processing tank with improved quick dump valve
01/04/2005US6837252 Apparatus for treating a workpiece with steam and ozone
01/04/2005US6836959 Size reduction of chip mounting system
01/04/2005CA2258731C Insulating film for semiconductor device and semiconductor device
01/04/2005CA2123133C Hybridization of polynucleotides conjugated with chromophores and fluorophores to generate donor-to-donor energy transfer system
12/2004
12/30/2004US20040268291 Method and device for checking lithography data
12/30/2004US20040268286 Integrated circuit with interface tile for coupling to a stacked-die second integrated circuit
12/30/2004US20040268272 Method and apparatus for manufacturing multiple circuit patterns using a multiple project mask
12/30/2004US20040268193 Test circuit, integrated circuit, and test method
12/30/2004US20040268027 Semiconductor memory device, page buffer resource assigning method and circuit therefor, computer system and mobile electronic device
12/30/2004US20040268025 Data line disturbance free memory block divided flash memory and microcomputer having flash memory therein
12/30/2004US20040267399 Feedforward, feedback wafer to wafer control method for an etch process
12/30/2004US20040266919 different types of self-assembling molecules are combined with each other under conditions sufficient to produce a composite ordered structure from the two types of molecules, then crosslinking one of the types, while the other is not crosslinkable, removing the uncrosslinked type to form uniform pores
12/30/2004US20040266637 Stability; controlling pH; cleaning semiconductor substrate; mixture of quaternary ammonium compound and buffer
12/30/2004US20040266635 Mixture of supercritical fluid and adjuvant
12/30/2004US20040266330 Clean room system
12/30/2004US20040266327 Conductive polishing article for electrochemical mechanical polishing
12/30/2004US20040266322 Polishing pad, polishing apparatus and method for polishing wafer
12/30/2004US20040266317 Grinding method for workpiece, jet guide means and jet regulation means used for the method
12/30/2004US20040266272 Contactor for testing semiconductor device and manufacturing method thereof
12/30/2004US20040266223 Laser irradiation method, laser irradiation apparatus, and method of manufacturing a semiconductor device
12/30/2004US20040266222 Heat treatment apparatus and heat treatment method
12/30/2004US20040266221 Method of manufacturing semiconductor device
12/30/2004US20040266220 Films deposited at glancing incidence for multilevel metallization
12/30/2004US20040266219 Methods of forming layers over substrates
12/30/2004US20040266218 Methods for forming a gap filling layer using high density plasma
12/30/2004US20040266217 Method of forming high dielectric film using atomic layer deposition and method of manufacturing capacitor having the high dielectric film
12/30/2004US20040266216 Method for improving uniformity in deposited low k dielectric material
12/30/2004US20040266215 Method of manufacturing semiconductor device
12/30/2004US20040266214 Annealing furnace, manufacturing apparatus, annealing method and manufacturing method of electronic device
12/30/2004US20040266213 Ion-assisted oxidation methods and the resulting structures
12/30/2004US20040266212 Method for manufacturing semiconductor device
12/30/2004US20040266211 Semiconductor interfaces
12/30/2004US20040266210 Etchant for etching nitride and method for removing a nitride layer using the same
12/30/2004US20040266209 Manufacturing method for electronic device and multiple layer circuits thereof
12/30/2004US20040266208 Method for preventing particle-based contamination of substrates and structure therefor
12/30/2004US20040266207 Patterning of devices
12/30/2004US20040266206 Post vertical interconnects formed with silicide etch stop and method of making
12/30/2004US20040266205 Apparatus and method for removing photoresist from a substrate
12/30/2004US20040266204 Method for patterning metal wire in semiconductor device
12/30/2004US20040266203 Methods for forming fine photoresist patterns
12/30/2004US20040266202 Multi-run selective pattern and etch wafer process
12/30/2004US20040266201 Method for forming damascene structure utilizing planarizing material coupled with diffusion barrier material
12/30/2004US20040266200 Method of compensating for etch rate non-uniformities by ion implantation
12/30/2004US20040266199 Method of manufacturing flash memory device
12/30/2004US20040266198 Method for determining endpoint of etch layer and etching process implementing said method in semiconductor element fabrication
12/30/2004US20040266197 Methods of forming layers over substrates; and methods of forming trenched isolation regions
12/30/2004US20040266196 CMP of noble metals
12/30/2004US20040266195 Methods of planarization
12/30/2004US20040266194 Method for manufacturing a semiconductor device
12/30/2004US20040266191 Process for the wet-chemical surface treatment of a semiconductor wafer
12/30/2004US20040266190 Sputter etch methods
12/30/2004US20040266189 Method of crystallizing amorphous silicon layer and crystallizing apparatus thereof
12/30/2004US20040266188 Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device
12/30/2004US20040266187 Methods of forming an electrically conductive line
12/30/2004US20040266186 Slider processing system utilizing polyvinyl alcohol release layer
12/30/2004US20040266185 Method for reducing integrated circuit defects
12/30/2004US20040266184 Post-deposition modification of interlayer dielectrics
12/30/2004US20040266183 Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low K dielectrics
12/30/2004US20040266182 Nickel alloy salicide transistor structure and method for manufacturing same
12/30/2004US20040266181 Coated semiconductor wafer, and process and device for producing the semiconductor wafer
12/30/2004US20040266180 Tungsten plug corrosion prevention method using water
12/30/2004US20040266179 Directional ion etching process for patterning self-aligned via contacts
12/30/2004US20040266178 Method for forming metal interconnect of semiconductor device
12/30/2004US20040266177 Semiconductor device and method of manufacturing the same
12/30/2004US20040266176 Semiconductor device and method of manufacturing the same
12/30/2004US20040266175 Methods and apparatus for forming barrier layers in high aspect ratio vias
12/30/2004US20040266174 Method and apparatus of preventing tungsten pullout during tungsten chemical mill processing
12/30/2004US20040266173 Method for forming patterns for semiconductor devices
12/30/2004US20040266172 Method for forming metal lines
12/30/2004US20040266171 Manufacturing method of semiconductor device