H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2004
12/21/2004	US6833287 System for semiconductor package with stacked dies
12/21/2004	US6833286 Semiconductor device with variable pin locations
12/21/2004	US6833284 Method for subdividing wafers into chips
12/21/2004	US6833282 Method of forming an optical sensor device having a composite sandwich structure of alternating titanium and titanium nitride layers
12/21/2004	US6833280 Process for fabricating films of uniform properties on semiconductor devices
12/21/2004	US6833279 Method of fabricating and repairing ceramic components for semiconductor fabrication using plasma spray process
12/21/2004	US6833278 Low remanence flux concentrator for MRAM devices
12/21/2004	US6833277 Method and system for field assisted statistical assembly of wafers
12/21/2004	US6833233 Plugging via hole of semiconductor wafer with non- deep ultraviolet (UV) light-sensitive photoresist which remains after development and selective removal of deep photoresist
12/21/2004	US6833232 Micro-pattern forming method for semiconductor device
12/21/2004	US6833223 Multilayer-film reflective mirrors and optical systems comprising same
12/21/2004	US6833195 Low temperature germanium transfer
12/21/2004	US6833180 Cyclic structure-containing thermoplastic polymer comprising a cycloolefin polymer or an aromatic condensed polymer; and filler anisotropic electroconductivity
12/21/2004	US6833155 Substrate for a semiconductor device is wound in a roll form together with an interleaf before or after treatment; especially chemical vapor deposition
12/21/2004	US6833109 Method and apparatus for storing a semiconductor wafer after its CMP polishing
12/21/2004	US6833107 Heat-treating furnace with magnetic field and heat treatment method using same
12/21/2004	US6833084 Etching compositions
12/21/2004	US6833081 Method of metal etching post cleaning
12/21/2004	US6833079 Method of etching a shaped cavity
12/21/2004	US6833063 Electrochemical edge and bevel cleaning process and system
12/21/2004	US6833052 Deposition chamber and method for depositing low dielectric constant films
12/21/2004	US6833050 Apparatus for manufacturing semiconductor device
12/21/2004	US6833049 Apparatus for controlling the temperature of a gas distribution plate in a process reactor
12/21/2004	US6833048 Apparatus for in-cassette monitoring of semiconductor wafers
12/21/2004	US6833047 Alarm apparatus for exchanging lamps of wafer etching equipment
12/21/2004	US6833046 Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
12/21/2004	US6833035 Semiconductor processing system with wafer container docking and loading station
12/21/2004	US6833030 Mass flow controller connected to an injection valve, an auxiliary valve connected between, an auxiliary pump connected to the auxiliary valve and a relay electrically connected to the auxiliary valve
12/21/2004	US6833028 Particle deposition system with enhanced speed and diameter accuracy
12/21/2004	US6833027 Method of manufacturing high voltage schottky diamond diodes with low boron doping
12/21/2004	US6832949 Window member for chemical mechanical polishing and polishing pad
12/21/2004	US6832948 Thermal preconditioning fixed abrasive articles
12/21/2004	US6832863 Substrate treating apparatus and method
12/21/2004	US6832680 Work conveying system and traveling path sealing structure in the work conveying system
12/21/2004	US6832616 Substrate treating apparatus
12/21/2004	US6832439 Scribing device
12/21/2004	US6832422 Apparatus for assembling a post-CMP cleaning brush
12/21/2004	US6832420 Applying conductive and dielectric layers; plurality of capacitors in an ultra- small integrated package; miniaturization; printed circuits
12/16/2004	WO2004110119A1 A method for forming a joint
12/16/2004	WO2004109815A1 Contacts fabric using heterostructure of metal/semiconductor nanorods and fabrication method thereof
12/16/2004	WO2004109810A1 Prevention of parasitic channel in an integrated soi process
12/16/2004	WO2004109807A2 Semiconductor structure comprising integrated doping channels
12/16/2004	WO2004109805A1 Minute magnetic body having annular single magnetic domain structure, manufacturing method thereof, or magnetic recording element using the same
12/16/2004	WO2004109804A1 Method for fabricating semiconductor device
12/16/2004	WO2004109802A1 Memory expansion and integrated circuit stacking system and method
12/16/2004	WO2004109794A2 Coiled circuit device and method of making the same
12/16/2004	WO2004109792A1 Electronic component as well as semiconductor wafer and component support for the production of said component
12/16/2004	WO2004109790A1 Semiconductor device and method for manufacturing same
12/16/2004	WO2004109789A1 Field effect transistor having a lateral depletion structure
12/16/2004	WO2004109788A1 Removing agent composition and removing/cleaning method using same
12/16/2004	WO2004109787A1 Method for polishing wafer
12/16/2004	WO2004109786A1 Adhesive sheet, dicing tape integrated type adhesive sheet, and semiconductor device producing method
12/16/2004	WO2004109785A1 Impurity doping method, impurity doping apparatus and semiconductor device produced by using same
12/16/2004	WO2004109784A1 Ion doping system, ion doping method and semiconductor device
12/16/2004	WO2004109783A1 Process for fabricating semiconductor device
12/16/2004	WO2004109782A1 Nitride semiconductor device and method for manufacturing same
12/16/2004	WO2004109781A1 Substrate for stressed systems and method for crystal growth on such a substrate
12/16/2004	WO2004109779A1 Method for improving surface roughness of processed film of substrate and apparatus for processing substrate
12/16/2004	WO2004109778A1 Mutilayer film reflector and x-ray exposure system
12/16/2004	WO2004109777A1 Exposure method and device, device manufacturing method, and device
12/16/2004	WO2004109776A2 SiGe LATTICE ENGINEERING USING A COMBINATION OF OXIDATION THINNING AND EPITAXIAL REGROWTH
12/16/2004	WO2004109775A2 Formation of highly dislocation free compound semiconductor on a lattice mismatched substrate
12/16/2004	WO2004109773A2 Method and system for heating a substrate using a plasma
12/16/2004	WO2004109772A2 Method and system for etching a high-k dielectric material
12/16/2004	WO2004109771A2 Stackable semiconductor device and method of manufacturing the same
12/16/2004	WO2004109770A2 Through wafer via process and amplifier with through wafer via
12/16/2004	WO2004109769A2 Microelectromechanical systems and methods for encapsulating
12/16/2004	WO2004109763A2 High impedance radio frequency power plastic package
12/16/2004	WO2004109761A2 Gas distribution system
12/16/2004	WO2004109756A2 Method and system for using ion implantation for treating a low-k dielectric film
12/16/2004	WO2004109750A2 Wiring for semiconductor device, thin film transistor array panel including wiring, and manufacturing method thereof
12/16/2004	WO2004109748A2 Supporting shelf for front opening unified pod
12/16/2004	WO2004109729A1 Low freezing electrolyte for an electrolytic capacitor
12/16/2004	WO2004109705A2 Ferroelectric memory device
12/16/2004	WO2004109584A1 Method for producing an integrated fingerprint sensor, sensor circuit arrangement, and injection arrangement
12/16/2004	WO2004109376A1 Array substrate inspection method
12/16/2004	WO2004109306A1 Method and apparatus for testing electrical characteristics of object under test
12/16/2004	WO2004109304A1 Electronic component handling device, and method for temperature application in electronic component handling device
12/16/2004	WO2004109031A2 Surface-covering article and methods of installing the same
12/16/2004	WO2004109030A1 Profiled rail and method for producing a profiled rail
12/16/2004	WO2004108985A2 Methods for forming aluminum containing films utilizing amino aluminum precursors
12/16/2004	WO2004108982A2 Adaptable processing element for a processing system and a method of making the same
12/16/2004	WO2004108980A1 Thin film forming device and thin film forming method
12/16/2004	WO2004108979A1 Thin film forming device and thin film forming method
12/16/2004	WO2004108780A1 Resin for photoresist composition, photoresist composition and method for forming resist pattern
12/16/2004	WO2004108592A1 Method for producing highly pure solutions using gaseous hydrogen fluoride
12/16/2004	WO2004108566A2 Conveyor for plate-shaped members
12/16/2004	WO2004108357A1 Polishing apparatus, method of manufacturing semiconductor device using the appratus, and semiconductor device manufactured by the method
12/16/2004	WO2004108353A2 Integrated tool with interchangeable wet processing components and automated calibration systems
12/16/2004	WO2004097932A3 Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent cmp process
12/16/2004	WO2004095583A3 Radiation-hardened transistor fabricated by modified cmos process
12/16/2004	WO2004094547A3 Coated metal oxide particles for cmp
12/16/2004	WO2004088725A3 Method for the multi-stage production of diffusion soldered connections for power components comprising semiconductor chips
12/16/2004	WO2004086488B1 Semiconductor epitaxial wafer
12/16/2004	WO2004084283B1 Method of growing semiconductor crystal
12/16/2004	WO2004081982A3 Shallow trench isolation process
12/16/2004	WO2004081976A3 Thin film transistor substrate ofa display device and method of manufacturing the same
12/16/2004	WO2004081262A8 Method of electroplating a workpiece having high-aspect ratio holes
12/16/2004	WO2004076605B1 Dilute sulfuric peroxide at point-of-use
12/16/2004	WO2004075011A3 Methods and apparatus for data analysis

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