| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 12/16/2004 | US20040251490 SONOS memory device and method of erasing data from the same |
| 12/16/2004 | US20040251489 SONOS memory device and method of manufacturing the same |
| 12/16/2004 | US20040251488 Nonvolatile semiconductor memory device and method of reading out same |
| 12/16/2004 | US20040251487 Non-volatile memory device |
| 12/16/2004 | US20040251486 Systems and methods using non-volatile memory cells |
| 12/16/2004 | US20040251485 Semiconductor memory device with surface strap and method of fabricating the same |
| 12/16/2004 | US20040251484 Semiconductor integrated circuit device |
| 12/16/2004 | US20040251483 Planar avalanche photodiode |
| 12/16/2004 | US20040251481 Isolation region implant permitting improved photodiode structure |
| 12/16/2004 | US20040251480 Method for making a semiconductor device having increased carrier mobility |
| 12/16/2004 | US20040251479 Semiconductor device and method for fabricating the same |
| 12/16/2004 | US20040251478 Diamondoid-containing materials for passivating layers in integrated circuit devices |
| 12/16/2004 | US20040251475 Zero threshold voltage pFET and method of making same |
| 12/16/2004 | US20040251474 Organic semiconductor element and fabrication method thereof |
| 12/16/2004 | US20040251473 Bipolar transistor and fabrication method thereof |
| 12/16/2004 | US20040251471 Light emitting element structure using nitride bulk single crystal layer |
| 12/16/2004 | US20040251468 Photodiode with self-aligned implants for high quantum efficiency and method of formation |
| 12/16/2004 | US20040251463 CMOS thin film transistor and display device using the same |
| 12/16/2004 | US20040251462 Thin film transistor and method of fabricating the same |
| 12/16/2004 | US20040251461 Semiconductor device and method of manufacturing the same |
| 12/16/2004 | US20040251460 Device for seating semiconductor device in semiconductor test handler |
| 12/16/2004 | US20040251458 Semiconductor substrate, field-effect transistor, and their manufacturing methods |
| 12/16/2004 | US20040251457 Electronic devices formed of high-purity molybdenum oxide |
| 12/16/2004 | US20040251432 Ion implanter and method for controlling the same |
| 12/16/2004 | US20040251427 Charged particle beam application apparatus |
| 12/16/2004 | US20040251424 Ion source apparatus and electronic energy optimized method therefor |
| 12/16/2004 | US20040251398 Photodiode with ultra-shallow junction for high quantum efficiency CMOS image sensor and method of formation |
| 12/16/2004 | US20040251236 [deposition-selective etch-deposition process for dielectric film gapfill] |
| 12/16/2004 | US20040251235 Method of and apparatus for processing substrates |
| 12/16/2004 | US20040251234 Bilayered metal hardmasks for use in dual damascene etch schemes |
| 12/16/2004 | US20040251230 Method for fabricating thick film alumina structures used in high frequency, low loss applications and a structure resulting therefrom |
| 12/16/2004 | US20040251229 Manufacturing method for membrane member |
| 12/16/2004 | US20040251160 Non-contact protective packaging for surface-sensitive articles |
| 12/16/2004 | US20040251142 Methods of reducing interlayer discontinuities in electrochemically fabricated three-dimensional structures |
| 12/16/2004 | US20040250996 Method and apparatus for cooling a planar workpiece in an evacuated environment with dynamically moveable heat sinks |
| 12/16/2004 | US20040250955 RF current return path for a large area substrate plasma reactor |
| 12/16/2004 | US20040250949 Method and apparatus for expanding a semiconductor wafer |
| 12/16/2004 | US20040250924 Textured-grain-powder metallurgy tantalum sputter target |
| 12/16/2004 | US20040250853 Gas supply system, valve assembly and method of forming reactant pulses by operating a valve assembly |
| 12/16/2004 | US20040250848 Oriented arrays of nanostructures wherein two or more materials of different elctron affinities alternate |
| 12/16/2004 | US20040250839 Dual outlet nozzle for the combined edge bead removal and backside wash of spin coated wafers |
| 12/16/2004 | US20040250838 Wafer cleaning apparatus and method of anticipating malfunction of pump |
| 12/16/2004 | US20040250835 Compositions for dissolution of low-k dielectric films, and methods of use |
| 12/16/2004 | US20040250776 Sample-setting moving stage, manufacturing apparatus for circuit pattern, and inspection apparatus for circuit pattern |
| 12/16/2004 | US20040250775 Cvd apparatus and method of cleaning the cvd apparatus |
| 12/16/2004 | US20040250774 Wafer heater with protected heater element |
| 12/16/2004 | US20040250773 Semiconductor film formation device |
| 12/16/2004 | US20040250772 Cylinder for thermal processing chamber |
| 12/16/2004 | US20040250771 Microwave plasma substrate processing device |
| 12/16/2004 | US20040250768 Ozone processing device |
| 12/16/2004 | US20040250765 Processing apparatus |
| 12/16/2004 | US20040250762 Substrate processing apparatus and substrate processing method |
| 12/16/2004 | US20040250755 Microelectronic fabrication system components and method for processing a wafer using such components |
| 12/16/2004 | US20040250754 Method of forming a thin film transistor by utilizing a laser crystallization process |
| 12/16/2004 | US20040250752 Heteroatomic single-crystal layers |
| 12/16/2004 | US20040250600 Method of mass flow control flow verification and calibration |
| 12/16/2004 | US20040250572 Method for producing radiation-resistant quartz glass material, and quartz glass material |
| 12/16/2004 | US20040250519 [front opening unified pod and associated method for preventing outgassing pollution] |
| 12/16/2004 | US20040250476 Colloidal silica, a periodic acid compound, ammonia, ammonium nitrate and water; pH is 1.8-4.0; reduces erosion when used in a final polishing step of manufacturing semiconductors |
| 12/16/2004 | US20040250444 Method and apparatus for removing liquid from substrate surfaces using suction |
| 12/16/2004 | US20040250417 Method, system, and apparatus for transfer of dies using a die plate |
| 12/16/2004 | US20040250411 Integrated inductor |
| 12/16/2004 | US20040250407 Device comprising components vertically stacked thereon and method for manufacturing the same |
| 12/16/2004 | US20040250392 Method for forming trench capacitor |
| 12/16/2004 | DE69133365T2 Halbleiterspeicher mit sequenzgetakteten Zugriffscodes zum Eintritt in den Prüfmodus Semiconductor memory with sequence clocked access code to enter the test mode |
| 12/16/2004 | DE4106933B4 Strukturierungsverfahren Patterning methods |
| 12/16/2004 | DE19860505B4 ESD-Schutzschaltung und Verfahren zu deren Herstellung ESD protection circuit and method for their preparation |
| 12/16/2004 | DE19722112B4 Verfahren zur Bildung eines flachen Übergangs in einem Halbleiter-Bauelement A method for forming a shallow junction in a semiconductor device |
| 12/16/2004 | DE19629250B4 Verfahren zur Herstellung von Proben zur Analyse von Defekten von Halbleitereinrichtungen Process for the preparation of samples for analysis of defects of semiconductor devices |
| 12/16/2004 | DE10359346A1 Verfahren zum Herstellen eines Halbleiterbauelements A method of manufacturing a semiconductor device |
| 12/16/2004 | DE10348821B3 Arrangement for transporting and aligning disk-shaped elements, especially wafers, has at least one detector arranged on carriage carrier to determine position of markings on disk-shaped element |
| 12/16/2004 | DE10326319B3 Production of an electrical contact in an integrated circuit comprises applying and structuring a hard mask layer on an insulating layer to form regions for contact hole openings in the insulating layer, and further processing |
| 12/16/2004 | DE10324533A1 Stabile Lösungen von organischen halbleitenden Verbindungen Stable solutions of organic semiconducting compounds |
| 12/16/2004 | DE10324202A1 Maskenhaltevorrichtung Mask holding device |
| 12/16/2004 | DE10322983A1 Production of semiconductor structure used in production of integrated circuits comprises preparing semiconductor substrate having trench, filling trench with first material, back-etching and further processing |
| 12/16/2004 | DE10321496A1 Production of trench capacitor for semiconductor memory cell comprises forming trench in semiconductor substrate using hard mask, partially masking upper trench region and further processing |
| 12/16/2004 | DE10321466A1 Trench-Speicherkondensator und Verfahren zu dessen Herstellung Trench storage capacitor and process for its preparation |
| 12/16/2004 | DE10320375B3 Temporary, reversible fixing of 2 flat workpieces involves applying thin coating to sides to be joined, joining coated sides with adhesive, dissolving coatings in defined solvent to reverse connection |
| 12/16/2004 | DE10261364B4 Verfahren zur Herstellung einer temperbarer Mehrschichtkontaktbeschichtung, insbesondere einer temperbaren Mehrschichtkontaktmetallisierung A process for producing a multilayer temperbarer contact coating, in particular a temperable Mehrschichtkontaktmetallisierung |
| 12/16/2004 | DE10238050B4 Integrierte Halbleiterschaltung A semiconductor integrated circuit |
| 12/16/2004 | DE102004025976A1 EEPROM-Zellenstruktur mit ungleichmäßiger Kanaldielektrikumdicke und Herstellungsverfahren EEPROM cell structure with non-uniform Kanaldielektrikumdicke and manufacturing processes |
| 12/16/2004 | DE102004024784A1 Circuit elements set-up method in semiconductor components forming physical lay-out according to circuit plan, using standard cell library, by placing subsequently circuit elements and their constituents in lay-out |
| 12/16/2004 | DE102004024111A1 Protective circuit against reverse current flow through body diode of FET power switch component for series-connected load, e.g. motor which can deliver voltage along source |
| 12/16/2004 | DE102004022199A1 Verfahren zur Herstellung einer Halbleiteranordnung A process for producing a semiconductor device |
| 12/16/2004 | DE102004004880A1 Verbindungsverfahren für direkt verbundene gestapelte integrierte Schaltungen Connection method to directly connected stacked integrated circuits |
| 12/16/2004 | DE10030143B4 Photomaske, Herstellungsverfahren davon und Halbleitereinrichtung Photomask manufacturing method thereof, and semiconductor device |
| 12/16/2004 | CA2527401A1 Surface-covering article and methods of installing the same |
| 12/15/2004 | EP1487248A2 Holding structure and a molded part with the same |
| 12/15/2004 | EP1487028A1 Field effect transistor and method for manufacturing the same |
| 12/15/2004 | EP1487024A1 Lateral junctiion field-effect transistor and its manufacturing method |
| 12/15/2004 | EP1487023A2 Semiconductor device comprising a MIS transistor and method for manufacturing the same |
| 12/15/2004 | EP1487022A2 Electronic devices formed of high-purity molybdenum oxide |
| 12/15/2004 | EP1487021A1 Semiconductor device |
| 12/15/2004 | EP1487019A1 Electronic device and method of manufacturing thereof |
| 12/15/2004 | EP1487018A2 Flexible substrate for a semiconductor package and method of manufacturing the same |
| 12/15/2004 | EP1487016A2 Flip-chip interconnect with increased current-carrying capability |
| 12/15/2004 | EP1487014A1 Semiconductor device and method for assembling the same |
| 12/15/2004 | EP1487013A2 SONOS memory device and method of manufacturing the same |
| 12/15/2004 | EP1487012A2 Method of making an heterogeneous structure and structure obtained by said method |
| 12/15/2004 | EP1487011A1 Integrated circuits having adjacent P-type doped regions having shallow trench isolation structures without liner layers therein therebetween and methods of forming same |