| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 12/30/2004 | US20040261701 Coating apparatus and coating method |
| 12/30/2004 | US20040261700 Industrial microdeposition system for polymer light emitting diode displays , printed circuit boards and the like |
| 12/30/2004 | US20040261695 Method for making semiconductor device including band-engineered superlattice |
| 12/30/2004 | US20040261692 Substrate for epitaxy |
| 12/30/2004 | US20040261689 Low temperature epitaxial growth of quartenary wide bandgap semiconductors |
| 12/30/2004 | US20040261550 Substrate detecting apparatus and method, substrate transporting apparatus and method, and substrate processing apparatus and method |
| 12/30/2004 | US20040261323 Abrasive grains which are sufficiently small relative to the line width of wirings so as to make it possible to perform fine and delicate polishing |
| 12/30/2004 | US20040261282 Alignment mark for aligning wafer of semiconductor device |
| 12/30/2004 | US20040261262 Apparatus and method for precise alignment of packaging caps on a substrate |
| 12/30/2004 | US20040261261 Flexible die removal device |
| 12/30/2004 | US20040261257 Substrate alignment method and apparatus |
| 12/30/2004 | DE202004017322U1 Inspection system for testing workpiece on carriers moving along conveyor comprises frame with uprights mounted on either side of conveyor, up which carrier can be raised while subsequent workpieces continue along conveyor |
| 12/30/2004 | DE19857037B4 Verfahren zum Bilden selbstjustierender Metall-Silizid-Schichten auf einer MOS-Transistorstruktur und MOS-Transistorstruktur A method of forming self-aligned metal silicide layer on a MOS transistor structure, and MOS transistor structure |
| 12/30/2004 | DE10345470A1 Semiconductor chip wafer contact structure has cup shaped test contact surfaces and active connection multiplexer circuit in sawing grid areas |
| 12/30/2004 | DE10331565A1 Wafer holding device for semiconductor chips in wafers has holed suction device on vacuum chamber that is transparent to electromagnetic radiation |
| 12/30/2004 | DE10326787A1 Semiconductor component for semiconductor devices comprises conducting layer containing strip conductor and/or resistor which are electrically insulating from remaining regions of conducting layer by oxidic regions |
| 12/30/2004 | DE10326333A1 Profilschiene und Verfahren zum Herstellen einer Profilschiene Profile rail and method for producing a profiled rail |
| 12/30/2004 | DE10325150A1 Parametrierte Halbleiterverbundstruktur mit integrierten Dotierungskanälen, Verfahren zur Herstellung und Anwendung davon Parameterized semiconductor composite structure with built-doping channels, methods of preparation and use thereof |
| 12/30/2004 | DE10324551A1 Determining thickness of layer grown on semiconductor substrate comprises forming periodic structure on surface of substrate, carrying out selective epitaxial growth, and carrying out scatterometric process |
| 12/30/2004 | DE10324550A1 Herstellungsverfahren für eine NROM-Halbleiterspeichervorrichtung und entsprechende NROM-Halbleiterspeichervorrichtung Manufacturing method of a semiconductor memory NROM device and corresponding NROM semiconductor memory device |
| 12/30/2004 | DE10324433A1 Verfahren zur Herstellung eines Substratkontakts für ein SOI-Halbleiterbauteil A method for producing a substrate contact on a SOI semiconductor component |
| 12/30/2004 | DE10324066A1 Stapelkondensator und Verfahren zur Herstellung eines solchen Stacked capacitor and methods for producing such |
| 12/30/2004 | DE10324065A1 Verfahren zur Herstellung eines integrierten Silizium-Germanium-Heterobipolartranistors und ein integrierter Silizium-Germanium Heterobipolartransitor A method for manufacturing an integrated silicon-germanium Heterobipolartranistors and an integrated silicon-germanium Heterobipolartransitor |
| 12/30/2004 | DE10324055A1 Integrierter Stapelkondensator und Verfahren zu dessen Herstellung Integrated stacked capacitor and process for its preparation |
| 12/30/2004 | DE10324050A1 Layer stack used in semiconductor industry comprises photoresist layer arranged on reflection-reducing layer made from semiconducting or insulating base material on substrate |
| 12/30/2004 | DE10322588A1 Method of forming a resistive layer on a substrate for integrated circuits deposits a polycrystalline crystallite layer makes partly amorphous and anneals to give a different crystallite size |
| 12/30/2004 | DE10321214A1 Process for forming electrical contacts on a chip of a chip wafer for low cost radiofrequency identification chips brings contacts to the side faces of the chip |
| 12/30/2004 | DE102004026656A1 Verfahren zum Füllen von Gräben A method of filling trenches |
| 12/30/2004 | DE102004026521A1 Dynamic RAM test device selects address of address pointer and pattern generator while generating back pattern after count of defective number of bits, for output to failed memory |
| 12/30/2004 | DE102004025959A1 Processing a substrate by pressurizing processing chamber before, after, and/or simultaneous with application of radiation to heat substrate and/or processing chemistry contained in processing chamber |
| 12/30/2004 | DE102004023425A1 Verfahren zur Feststellung der Cu-Konzentration eines Siliciumsubstrats Method for the determination of Cu concentration of a silicon substrate |
| 12/30/2004 | DE102004020270A1 Laserstrahl-Bearbeitungsmaschine Laser beam processing machine |
| 12/30/2004 | DE102004019199A1 Formation of semiconductor device, e.g. complementary metal oxide semiconductor transistor, involves forming silicide layers at silicidation temperature which is less than anneal temperature |
| 12/30/2004 | DE102004009597A1 Verfahren zur Herstellung einer Halbleiterbaugruppe A process for producing a semiconductor package |
| 12/30/2004 | DE102004004885A1 Verfahren und Vorrichtung für eine Datenkommunikation auf einem Chip Method and apparatus for data communication on a chip |
| 12/30/2004 | DE102004002015A1 Halbleitervorrichtung mit Scheinelektrode A semiconductor device having dummy electrode |
| 12/30/2004 | DE10142307B4 Verfahren zur Herstellung von Feldeffekttransistoren mit erhöhten Source/Drain-Gebieten Process for the preparation of field effect transistors with elevated source / drain regions |
| 12/30/2004 | DE10054045B4 Arbeitstisch mit einer Tischplatte Work table with a table top |
| 12/30/2004 | CA2472687A1 Impedance adjustment circuit, impedance adjustment method, and semiconductor device |
| 12/29/2004 | WO2004114523A1 Semiconductor integrated circuit device |
| 12/29/2004 | WO2004114427A2 MAGNETIC TUNNEL JUNCTION PATTERNING USING SiC OR SiN |
| 12/29/2004 | WO2004114422A1 P-n heterojunction structure of zinc oxide-based nanorod and semiconductor thin film, preparation thereof, and nano-device comprising same |
| 12/29/2004 | WO2004114413A1 Semiconductor device and its manufacturing method |
| 12/29/2004 | WO2004114412A1 Semiconductor device and method for fabricating the same |
| 12/29/2004 | WO2004114408A1 Integrated circuit arrangement with npn and pnp bipolar transistors and corresponding production method |
| 12/29/2004 | WO2004114407A1 Optimized multi-application assembly |
| 12/29/2004 | WO2004114405A1 Micro lead frame package and method to manufacture the micro lead frame package |
| 12/29/2004 | WO2004114402A1 Wiring board and its production method, and structure for mounting semiconductor chip on wiring board |
| 12/29/2004 | WO2004114400A1 High-performance cmos soi device on hybrid crystal-oriented substrates |
| 12/29/2004 | WO2004114399A1 Substrate engineering for optimum cmos device performance |
| 12/29/2004 | WO2004114398A1 Integration of ald tantalum nitride for copper metallization |
| 12/29/2004 | WO2004114397A1 Electronic device, assembly and methods of manufacturing an electronic device |
| 12/29/2004 | WO2004114396A1 Interconnect structures in integrated circuit devices |
| 12/29/2004 | WO2004114395A2 Dual damascene interconnect structures having different materials for line and via conductors |
| 12/29/2004 | WO2004114394A1 Load lock system for supercritical fluid cleaning |
| 12/29/2004 | WO2004114393A1 Board laminating device |
| 12/29/2004 | WO2004114392A1 Method and equipment for inspecting electric characteristics of specimen |
| 12/29/2004 | WO2004114391A1 Semiconductor device, its manufacturing method, and electronic device |
| 12/29/2004 | WO2004114390A1 Semiconductor device and production method therefor |
| 12/29/2004 | WO2004114389A1 Nonvolatile memory device with a floating gate comprising semiconductor nanocrystals |
| 12/29/2004 | WO2004114388A1 Semiconductor device producing method |
| 12/29/2004 | WO2004114387A1 Method for producing semiconductor single crystal wafer and laser processing device used therefor |
| 12/29/2004 | WO2004114386A2 Methods and system for processing a microelectronic topography |
| 12/29/2004 | WO2004114385A1 Evaporation method and evaporator |
| 12/29/2004 | WO2004114384A1 Silicon epitaxial wafer manufacturing method and silicon epitaxial wafer |
| 12/29/2004 | WO2004114383A2 Strained-silicon-on-insulator single- and double-gate mosfet and method for forming the same |
| 12/29/2004 | WO2004114382A1 Method for forming pattern and method for manufacturing semiconductor device |
| 12/29/2004 | WO2004114381A1 Method for manufacturing semiconductor device |
| 12/29/2004 | WO2004114379A1 Single-wafer type heat treatment apparatus for semiconductor processing system |
| 12/29/2004 | WO2004114378A1 Clean unit, clean unit system, functional unit, functional unit system, material treatment method, element manufacturing method, cell line culturing method, and plant body culturing method |
| 12/29/2004 | WO2004114377A1 Heat treatment apparatus |
| 12/29/2004 | WO2004114376A2 Automated dense phase fluid cleaning system |
| 12/29/2004 | WO2004114375A1 Method and apparatus for thin-layer chemical processing of semiconductor wafers |
| 12/29/2004 | WO2004114374A2 Method of using pre-applied underfill encapsulant |
| 12/29/2004 | WO2004114373A2 Stud formation for mram manufacturing |
| 12/29/2004 | WO2004114372A1 Device and method for wet treating disc-like substrates |
| 12/29/2004 | WO2004114371A2 Compound used to form a self-assembled monolayer, layer structure, semiconductor component having a layer structure, and method for producing a layer structure |
| 12/29/2004 | WO2004114368A2 METHOD FOR PREPARING GE1-x-ySnxEy (E=P, As, Sb) SEMICONDUCTORS AND RELATED Si-Ge-Sn-E AND Si-Ge-E ANALOGS |
| 12/29/2004 | WO2004114367A2 Method and apparatus for increasing bulk conductivity of a ferroelectric material |
| 12/29/2004 | WO2004114366A2 Hdp-cvd multistep gapfill process |
| 12/29/2004 | WO2004114365A2 Lost cost chip carrier manufactured from conductive loaded resin-based material |
| 12/29/2004 | WO2004114336A2 Method for forming a high-voltage / high-power die package |
| 12/29/2004 | WO2004114334A2 Method of patterning a magnetic memory cell bottom electrode before magnetic stack deposition |
| 12/29/2004 | WO2004114038A1 Device for dividing and feeding gas flow from flow rate- regulating device-equipped gas-feeding equipment to chamber |
| 12/29/2004 | WO2004114024A2 Exposure method and exposure apparatus |
| 12/29/2004 | WO2004114022A1 Positive resist composition |
| 12/29/2004 | WO2004114018A2 Lithographic apparatus, device manufacturing method, and device manufactured thereby |
| 12/29/2004 | WO2004113890A1 Time resolution measurement device and position detection electron multiplier |
| 12/29/2004 | WO2004113888A1 Time-resolved measurement apparatus |
| 12/29/2004 | WO2004113833A1 3-d shape measuring unit, processing unit, and production method for semiconductor device |
| 12/29/2004 | WO2004113585A2 Atomic layer deposition of barrier materials |
| 12/29/2004 | WO2004113486A1 Cleaning composition, method of cleaning semiconductor substrate, and method of forming wiring on semiconductor substrate |
| 12/29/2004 | WO2004113228A2 Process boat and shell for wafer processing |
| 12/29/2004 | WO2004113205A1 Thin plate-supporting body |
| 12/29/2004 | WO2004113041A2 Method for producing a ceramic/metal substrate |
| 12/29/2004 | WO2004113023A1 Chemical-solution supplying apparatus |
| 12/29/2004 | WO2004113022A1 Apparatus and method for controlling the film thickness on a polishing pad |
| 12/29/2004 | WO2004113020A1 Substrate polishing apparatus and substrate polishing method |
| 12/29/2004 | WO2004112952A1 Process for the recovery of surfactants |
| 12/29/2004 | WO2004102277A3 Method providing an improved bi-layer photoresist pattern |