| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/01/2014 | CN103491717A Jig for assembling chip |
| 01/01/2014 | CN103490769A RRAM (Resistive Random Access Memory)-based 1T1R (1 Transistor and 1 RRAM) array applied to FPGA (Field Programmable Gate Array) and manufacturing method thereof |
| 01/01/2014 | CN103489967A Method for preparing gallium oxide epitaxial film and gallium oxide epitaxial film |
| 01/01/2014 | CN103489961A Preparation method of antireflection film, antireflection film and solar cell |
| 01/01/2014 | CN103489955A Intelligent photovoltaic module calibration method |
| 01/01/2014 | CN103489954A Quartz boat |
| 01/01/2014 | CN103489928A Capacitor structure and manufacturing method thereof |
| 01/01/2014 | CN103489927A Quick-soft-recovery power switch diode and manufacturing method thereof |
| 01/01/2014 | CN103489925A Semiconductor device and method for manufacturing same |
| 01/01/2014 | CN103489924A Low-capacitance JFET device and manufacturing method thereof |
| 01/01/2014 | CN103489923A Film transistor as well as manufacturing method and repairation method thereof and array substrate |
| 01/01/2014 | CN103489922A Thin film transistor and preparation method thereof, array substrate and preparation method thereof and display device |
| 01/01/2014 | CN103489921A Thin film transistor, manufacturing method thereof, array substrate and display device |
| 01/01/2014 | CN103489920A Thin film transistor, preparation method of thin film transistor, array substrate and display device |
| 01/01/2014 | CN103489918A Thin-film transistor, array substrate and manufacturing method thereof |
| 01/01/2014 | CN103489916A N type LDMOS of ladder gate oxide layer and active drift region structure and manufacturing method of N type LDMOS |
| 01/01/2014 | CN103489913A Semiconductor device and method for manufacturing same |
| 01/01/2014 | CN103489911A GaN-based HEMT device and manufacturing method thereof |
| 01/01/2014 | CN103489910A Power semiconductor device and manufacturing method thereof |
| 01/01/2014 | CN103489909A IGBT terminal structure with hole recombination layer and method for preparing same |
| 01/01/2014 | CN103489907A Insulated gate bipolar transistor |
| 01/01/2014 | CN103489906A Insulated gate bipolar semiconductor device |
| 01/01/2014 | CN103489905A Trench gate IGBT and a method for manufacturing the same |
| 01/01/2014 | CN103489904A Semiconductor element, manufacturing method thereof and operating method thereof |
| 01/01/2014 | CN103489903A Trench IGBT and manufacturing method thereof |
| 01/01/2014 | CN103489902A Electrode, manufacturing method thereof, array substrate and display device |
| 01/01/2014 | CN103489901A 半导体结构及其形成方法 And method of forming a semiconductor structure |
| 01/01/2014 | CN103489900A Barrier layer, preparation method thereof, thin film transistor and array substrate |
| 01/01/2014 | CN103489899A Precursor composition of oxide semiconductor, thin film transistor substrate including oxide semiconductor, and method of manufacturing thin film transistor substrate including oxide semiconductor |
| 01/01/2014 | CN103489896A Gallium nitride based semiconductor device and method of manufacturing the same |
| 01/01/2014 | CN103489895A Trench super junction semiconductor device and manufacturing method thereof |
| 01/01/2014 | CN103489894A Active matrix organic electroluminescence display part and display device and manufacturing method thereof |
| 01/01/2014 | CN103489890A Organic light-emitting display device and method of manufacturing the same |
| 01/01/2014 | CN103489885A Wafer-level packaging method of image sensor chips |
| 01/01/2014 | CN103489884A Image sensor having compressive layers |
| 01/01/2014 | CN103489883A Image device and methods of forming the same |
| 01/01/2014 | CN103489882A Array substrate, preparation method for same and display device |
| 01/01/2014 | CN103489881A Thin film transistor array substrate, manufacturing method of thin film transistor array substrate as well as display device |
| 01/01/2014 | CN103489879A Array substrate, manufacturing method thereof and display device |
| 01/01/2014 | CN103489878A Array substrate, preparing method of array substrate and display device of array substrate |
| 01/01/2014 | CN103489877A Array substrate, manufacturing method thereof and display device |
| 01/01/2014 | CN103489876A Array substrate, preparing method of array substrate and display device of array substrate |
| 01/01/2014 | CN103489875A Array substrate, display device and method for manufacturing array substrate |
| 01/01/2014 | CN103489874A Array substrate, manufacturing method thereof and display device |
| 01/01/2014 | CN103489873A Array substrate, manufacture method thereof and display device |
| 01/01/2014 | CN103489869A Semiconductor memory device, memory system including the same and method of manufacturing the same |
| 01/01/2014 | CN103489868A Semiconductor device, memory system including the same, and method of manufacturing the same |
| 01/01/2014 | CN103489866A Semiconductor device with spacers for capping air gaps and method for fabricating the same |
| 01/01/2014 | CN103489865A Horizontal integrated SOI semiconductor power device |
| 01/01/2014 | CN103489863A Homo-junction diode structures using fin field effect transistor processing |
| 01/01/2014 | CN103489862A Power MOSFET current sensing structure and method |
| 01/01/2014 | CN103489852A Structure and method for packaging radio-frequency inductor |
| 01/01/2014 | CN103489850A CTE adaption in a semiconductor package |
| 01/01/2014 | CN103489847A PGA/BGA (Pin Grid Array/Ball Grid Array) three-dimensional structure for assembling components and production method thereof |
| 01/01/2014 | CN103489846A Chip package and method for forming the same |
| 01/01/2014 | CN103489845A Electric device package and method of making an electric device package |
| 01/01/2014 | CN103489844A Methods and apparatus of packaging semiconductor devices |
| 01/01/2014 | CN103489843A Metal-oxide semiconductor chip electrode bonding pad and manufacturing method thereof |
| 01/01/2014 | CN103489842A Semiconductor packaging structure |
| 01/01/2014 | CN103489840A Through-silicon via and fabrication method thereof |
| 01/01/2014 | CN103489839A Hard mask spacer structure and fabrication method thereof |
| 01/01/2014 | CN103489836A Radiator based on high-density graphene and manufacturing method thereof |
| 01/01/2014 | CN103489835A Security chip and packing method |
| 01/01/2014 | CN103489833A Chip-packaging module for a chip and a method for forming a chip-packaging module |
| 01/01/2014 | CN103489832A Package substrate plate structure for package, package substrate, semiconductor package and fabrication method thereof |
| 01/01/2014 | CN103489831A Semiconductor device with multi-layered storage node and method for fabricating the same |
| 01/01/2014 | CN103489830A Method for manufacturing integrated circuit |
| 01/01/2014 | CN103489829A Wafer processing method, wafer and semiconductor manufacturing method |
| 01/01/2014 | CN103489828A Method for manufacturing thin film transistor array substrate |
| 01/01/2014 | CN103489827A Thin film transistor driving backplane, manufacturing method thereof and display panel |
| 01/01/2014 | CN103489826A Array substrate, manufacturing method and display device |
| 01/01/2014 | CN103489825A Process method for solving problem of peeling of interface of silicon nitride and nickel silicide |
| 01/01/2014 | CN103489824A Array substrate, manufacturing method of array substrate, and display device |
| 01/01/2014 | CN103489823A Multilayer film substrate, method of manufacturing multilayer film substrate |
| 01/01/2014 | CN103489822A Method for manufacturing semiconductor device |
| 01/01/2014 | CN103489821A Method for filling groove with high aspect ratio |
| 01/01/2014 | CN103489820A Method for isolating device |
| 01/01/2014 | CN103489819A Method for temporarily bonding and debonding slice applied to semiconductor manufacturing process |
| 01/01/2014 | CN103489818A Silicon wafer pre-alignment device |
| 01/01/2014 | CN103489817A Defect detecting system and method |
| 01/01/2014 | CN103489816A Grain double-face sieve tray |
| 01/01/2014 | CN103489815A Grain sieve tray |
| 01/01/2014 | CN103489814A Full-automation mega sound wave semiconductor wafer cleaning device |
| 01/01/2014 | CN103489813A Multi-step system and method for curing a dielectric film |
| 01/01/2014 | CN103489812A Laser annealing systems and methods with ultra-short dwell time |
| 01/01/2014 | CN103489811A Dual-path chip-pickup turning mechanism on bonding equipment |
| 01/01/2014 | CN103489810A Method for conducting quantization monitoring on process window for etching through holes |
| 01/01/2014 | CN103489809A Defect detection system for particles on surface of wafer and working method of defect detection system |
| 01/01/2014 | CN103489808A Electron beam defect detection method capable of carrying out classification according to ion implantation areas |
| 01/01/2014 | CN103489807A Method of test probe alignment control |
| 01/01/2014 | CN103489806A Method for monitoring ion damage on line |
| 01/01/2014 | CN103489805A 晶圆键合系统 Wafer Bonding Systems |
| 01/01/2014 | CN103489804A Method for forming semiconductor packaging structure |
| 01/01/2014 | CN103489803A Method for forming semiconductor packaging structure |
| 01/01/2014 | CN103489802A Chip packaging structure and formation method thereof |
| 01/01/2014 | CN103489801A System and method of forming solder bumps on three dimensional module |
| 01/01/2014 | CN103489800A Dual-path bonding mechanism on bonding equipment |
| 01/01/2014 | CN103489799A Semiconductor charging device with buckling preventing function |
| 01/01/2014 | CN103489798A Method of marking semiconductor element, method of manufacturing semiconductor device, and semiconductor device |
| 01/01/2014 | CN103489797A Integrated circuit packaging system with film assist and method of manufacture thereof |