| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/01/2014 | CN103489796A Manufacturing method for embedded type semiconductor package piece of element |
| 01/01/2014 | CN103489795A Frame-based AAQFN package with frame pre-plastic-package optimization technique adopted and manufacturing technique thereof |
| 01/01/2014 | CN103489794A Method for improving lead frame hardness in QFN packaging lead frame manufacturing technology |
| 01/01/2014 | CN103489793A Method for forming solder ball on bonding pad of substrate |
| 01/01/2014 | CN103489792A Encapsulation-etching three-dimensional system-level chip inversion encapsulation structure and process method |
| 01/01/2014 | CN103489791A Package carrier and manufacturing method thereof |
| 01/01/2014 | CN103489790A Encapsulation method for chip fan-out encapsulation structure |
| 01/01/2014 | CN103489789A Ceramic substrate dual surface photolithography technique and structure |
| 01/01/2014 | CN103489788A Manufacturing method of low-temperature polycrystalline silicon thin film, thin film transistor and display device |
| 01/01/2014 | CN103489787A Method for improving adhesive force of source drain contact and silicon nitride thin film |
| 01/01/2014 | CN103489786A Method for manufacturing array substrate |
| 01/01/2014 | CN103489785A Cell structure of super junction semiconductor device and technology realizing method |
| 01/01/2014 | CN103489784A Semiconductor devices having improved gate height uniformity and methods for fabricating same |
| 01/01/2014 | CN103489783A Method of forming thin film poly silicon layer and method of forming thin film transistor |
| 01/01/2014 | CN103489782A Method for manufacturing groove type power semiconductor structure |
| 01/01/2014 | CN103489781A Method for manufacturing semiconductor device by utilizing stress memory technology |
| 01/01/2014 | CN103489780A Forming method of fin type field-effect tube substrate and fin type field-effect tube |
| 01/01/2014 | CN103489779A 半导体结构及其制造方法 Semiconductor structure and manufacturing method |
| 01/01/2014 | CN103489778A Method for manufacturing semiconductor device |
| 01/01/2014 | CN103489777A Stress memory technology method |
| 01/01/2014 | CN103489776A Method for achieving process of field-stop type insulated gate bipolar transistor |
| 01/01/2014 | CN103489775A Novel field cut-off type insulated gate bipolar transistor manufacturing method |
| 01/01/2014 | CN103489774A Forming method of oxide layer in semiconductor element |
| 01/01/2014 | CN103489773A Method for manufacturing multiple grooves in substrate |
| 01/01/2014 | CN103489772A Method for machining wafer |
| 01/01/2014 | CN103489771A Silicon oxynitride insulation structure and manufacturing method thereof |
| 01/01/2014 | CN103489770A Grid oxide layer growth method and CMOS tube manufacturing method |
| 01/01/2014 | CN103489769A Method for manufacturing grid electrode lines with high evenness |
| 01/01/2014 | CN103489768A Method for manufacturing grid side wall of ONO structure |
| 01/01/2014 | CN103489767A Method for manufacturing high-evenness grid lines |
| 01/01/2014 | CN103489766A Magnesium oxide titanium high dielectric constant thin film and preparation method and application thereof |
| 01/01/2014 | CN103489765A Method for manufacturing NMOS metal gate electrode |
| 01/01/2014 | CN103489764A Semiconductor device manufacturing method and laser annealing apparatus |
| 01/01/2014 | CN103489763A Method for preventing doping ions from outgassing in process of ion implantation |
| 01/01/2014 | CN103489762A Method of forming thin film poly silicon layer |
| 01/01/2014 | CN103489761A Growing method of special epitaxial slice for Schottky chip |
| 01/01/2014 | CN103489760A SiC substrate homoepitaxy carbon silicon double-atomic-layer film method |
| 01/01/2014 | CN103489759A SiC substrate homogeneous Web Growth epitaxy method |
| 01/01/2014 | CN103489758A Method for forming hard mask layer |
| 01/01/2014 | CN103489757A Etching method for laminated insulating film |
| 01/01/2014 | CN103489756A Sheet bonding method in substrate thinning technique |
| 01/01/2014 | CN103489755A Sheet bonding method in substrate thinning technique |
| 01/01/2014 | CN103489754A Method for preparing small silver nanoparticles |
| 01/01/2014 | CN103489753A Method for manufacturing large-area small-size core-shell structure silicon nanowire array |
| 01/01/2014 | CN103489752A Surface orientation identification method of crystal bar with polygonal cross section and substrate slice |
| 01/01/2014 | CN103489751A Method and electrode structure for improving microelectrode array electrode density based on electrochemical bipolar behavior |
| 01/01/2014 | CN103489750A Method for preparing combined thin film |
| 01/01/2014 | CN103489749A Method for crystallizing amorphous silicon thin films in multi-cycle rapid thermal annealing auxiliary metal induced mode |
| 01/01/2014 | CN103489744A Gas modulation to control edge exclusion in a bevel edge etching plasma chamber |
| 01/01/2014 | CN103489506A Short circuit chip for surface gold-coated microwave circuit and manufacturing method thereof |
| 01/01/2014 | CN103488063A Align marker and manufacturing method thereof |
| 01/01/2014 | CN103488060A Method for determining photoetching exposure defocusing amount |
| 01/01/2014 | CN103488058A Method for manufacturing grid line with high uniformity through double exposure |
| 01/01/2014 | CN103488041A Frequency doubling using spacer mask |
| 01/01/2014 | CN103488012A Pixel structure, manufacturing method of pixel structure and active element array substrate |
| 01/01/2014 | CN103488007A Array substrate, manufacturing method of array substrate and displaying device |
| 01/01/2014 | CN103487593A Gas analysis device and method |
| 01/01/2014 | CN103484864A Tungsten layer removal solution |
| 01/01/2014 | CN103484837A Substrate support and semiconductor manufacturing apparatus |
| 01/01/2014 | CN103484035A Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material |
| 01/01/2014 | CN103484025A Self-stop GST (Ge2Sb2Te5) chemical mechanical polishing solution as well as preparation method and application thereof |
| 01/01/2014 | CN102675881B High temperature resistant rubber base composite material used for chip packaging and application thereof |
| 01/01/2014 | CN102569169B Interconnection method based on press printing technology |
| 01/01/2014 | CN102543665B Improved rapid thinning method of gallium arsenide substrate |
| 01/01/2014 | CN102540710B Resist pattern improving material, method for forming resist pattern, and method for producing semiconductor device |
| 01/01/2014 | CN102496573B Manufacturing method of trench IGBT |
| 01/01/2014 | CN102496568B Method for manufacturing trench power device structure |
| 01/01/2014 | CN102496562B Method of adhering flexible thin-film material to glass substrate |
| 01/01/2014 | CN102487024B SOI/III-V full wafer bonding method adopting three-dimensional vent-hole device |
| 01/01/2014 | CN102468174B Semiconductor device and forming method thereof |
| 01/01/2014 | CN102456630B Method for preparing multi-component brazing filler metal coatings of microelectronic device salient points |
| 01/01/2014 | CN102456572B Method for manufacturing semiconductor device structure comprising stress layer |
| 01/01/2014 | CN102449090B Adhesive sheet and method for grinding back surface of semiconductor wafer |
| 01/01/2014 | CN102437088B Semiconductor structure and manufacture method thereof |
| 01/01/2014 | CN102414625B Method for formation of resist pattern, and developing solution |
| 01/01/2014 | CN102403252B Automatic silicon chip mounting machine assisting etching process |
| 01/01/2014 | CN102394214B Hose squeezing mechanism for vacuum pump aeration device |
| 01/01/2014 | CN102368469B Cover for forevacuum cavity of novel ICP (Inductively Coupled Plasma) etcher |
| 01/01/2014 | CN102356452B Vacuum processing apparatus |
| 01/01/2014 | CN102317512B Method for growing group 3b nitride crystal, and group 3b nitride crystal |
| 01/01/2014 | CN102306663B JEET (junction field-effect transistor) and formation method thereof |
| 01/01/2014 | CN102292407B Adhesive for electronic components |
| 01/01/2014 | CN102290441B Semiconductor device and production method |
| 01/01/2014 | CN102280366B Rotating window piece apparatus used for laser processing |
| 01/01/2014 | CN102272925B Method for producing lamps |
| 01/01/2014 | CN102263043B Assembling Device For FPD Components |
| 01/01/2014 | CN102263025B Plasma processing apparatus and processing gas supply structure thereof |
| 01/01/2014 | CN102257645B A nanostructured device |
| 01/01/2014 | CN102254830B DEPMOS (Drain Expansion P-type Metal Oxide Semiconductor) transistor and forming method thereof |
| 01/01/2014 | CN102246278B Platen and adapter assemblies for facilitating silicon electrode polishing |
| 01/01/2014 | CN102244035B Pixel structure and manufacturing method thereof |
| 01/01/2014 | CN102239549B Semiconductor device, process for producing semiconductor device, semiconductor substrate, and process for producing semiconductor substrate |
| 01/01/2014 | CN102233639B Resin sealing device and resin sealing method |
| 01/01/2014 | CN102194736B Making method of semiconductor device |
| 01/01/2014 | CN102194728B 衬底处理设备 The substrate processing apparatus |
| 01/01/2014 | CN102171811B 半导体器件 Semiconductor devices |
| 01/01/2014 | CN102054671B Method for manufacturing semiconductor device and semiconductor device |
| 01/01/2014 | CN102034707B Method for manufacturing IGBT |
| 01/01/2014 | CN102024748B Method for reducing critical dimension of contact hole |
| 01/01/2014 | CN102017119B Wafer container with tubular environmental control components |