Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2013
12/27/2013WO2013190838A1 Tft substrate, method for producing same, organic el display device, and method for manufacturing organic el display device
12/27/2013WO2013190815A1 Method for manufacturing active matrix substrate and method for manufacturing display apparatus
12/27/2013WO2013190812A1 Method for production of semiconductor device, semiconductor device, and production system for semiconductor device
12/27/2013WO2013190805A1 Plasma processing device and filter unit
12/27/2013WO2013190800A1 Substrate transport system
12/27/2013WO2013190765A1 Hard mask and process for producing hard mask
12/27/2013WO2013190759A1 Solid-state imaging element and method for manufacturing same
12/27/2013WO2013190749A1 Surface mounted piezoelectric vibrator
12/27/2013WO2013190741A1 Semiconductor device and programming method
12/27/2013WO2013190638A1 Connection structure of conductor, electronic equipment
12/27/2013WO2013190444A2 Systems and methods for dry processing fabrication of binary masks with arbitrary shapes for ultra-violet laser micromachining
12/27/2013WO2013190370A1 System for substrate handling and processing
12/27/2013WO2013190358A2 Plasma processing system with movable chamber housing parts
12/27/2013WO2013190040A1 Monitoring method and apparatus for excimer laser annealing process
12/27/2013WO2013189976A1 Layer system for thin-film solar cells
12/27/2013WO2013189939A1 Method for manufacturing a photovoltaic device using laser irradiation
12/27/2013WO2013189873A1 Method for producing semiconductor thin films on foreign substrates
12/27/2013WO2013189857A1 Method of manufacturing structures of leds or solar cells
12/27/2013WO2013189716A1 Ald coating system
12/27/2013WO2013189160A1 Array substrate and manufacturing method thereof and display devicearray substrate, manufacturing method therefor and display device thereof
12/27/2013WO2013189144A1 Array substrate, manufacturing method thereof, and display device
12/27/2013WO2013189141A1 Method for manufacturing flexible display substrate
12/27/2013WO2013189139A1 Manufacturing method for amorphous silicon flat panel x-ray sensor
12/27/2013WO2013189132A1 Method for determining pn junction depth
12/27/2013WO2013189127A1 Semiconductor structure and fabrication method therefor
12/27/2013WO2013189096A1 Semiconductor device and manufacturing method thereof
12/27/2013WO2013189066A1 Detection device for glass substrate cartridge
12/27/2013WO2013188924A1 Conductive portions in insulating materials
12/27/2013WO2013139878A3 Arrangement and method for transporting radicals
12/27/2013WO2013121289A3 Gallium nitride nanowire based electronics
12/26/2013US20130344704 Enhancement in uv curing efficiency using oxygen-doped purge for ultra low-k dielectric film
12/26/2013US20130344703 Film forming method and film forming apparatus
12/26/2013US20130344702 Method of etching silicon nitride films
12/26/2013US20130344701 Methods for high temperature etching a high-k gate structure
12/26/2013US20130344700 Electrostatic deflector, lithography apparatus, and method of manufacturing device
12/26/2013US20130344699 Sidewall protection of low-k material during etching and ashing
12/26/2013US20130344698 Pattern formation method
12/26/2013US20130344697 Method of fabricating nmos devices
12/26/2013US20130344696 Method for forming through-base wafer vias
12/26/2013US20130344695 Semiconductor chips and methods of forming the same
12/26/2013US20130344694 Probe-on-substrate
12/26/2013US20130344692 Methods for fabricating integrated circuits with fluorine passivation
12/26/2013US20130344690 Method of manufacturing semiconductor device
12/26/2013US20130344689 Method for processing substrate, method for manufacturing semiconductor device, and substrate processing apparatus
12/26/2013US20130344688 Atomic Layer Deposition with Rapid Thermal Treatment
12/26/2013US20130344687 Methods of Fabricating Thick Semi-Insulating or Insulating Epitaxial Gallium Nitride Layers
12/26/2013US20130344686 Method of cutting object to be processed
12/26/2013US20130344685 Processing method and processing apparatus
12/26/2013US20130344684 Methods and systems for using subsurface laser engraving (ssle) to create one or more wafers from a material
12/26/2013US20130344683 Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
12/26/2013US20130344682 Stacked packaging improvements
12/26/2013US20130344681 Semiconductor substrate and method for manufacturing semiconductor device
12/26/2013US20130344680 Trap Rich Layer Formation Techniques for Semiconductor Devices
12/26/2013US20130344678 Semiconductor device and method for fabricating the same
12/26/2013US20130344677 Shallow trench isolation structures
12/26/2013US20130344673 Semiconductor device fabrication methods
12/26/2013US20130344669 Methods for fabricating integrated circuits with drift regions and replacement gates
12/26/2013US20130344667 Trench FET with Source Recess Etch
12/26/2013US20130344662 Bumpless build-up layer and laminated core hybrid structures and methods of assembling same
12/26/2013US20130344661 Method of fabricating semiconductor package
12/26/2013US20130344660 Heatsink attachment module
12/26/2013US20130344658 Method for manufacturing semiconductor device
12/26/2013US20130344657 Package assembly using a carrier-free technique
12/26/2013US20130344656 Method of making surface mount stacked semiconductor devices
12/26/2013US20130344652 Reconstituted wafer stack packaging with after-applied pad extensions
12/26/2013US20130344651 Discharge surface treatment apparatus and discharge surface treatment method
12/26/2013US20130344629 Improved system for substrate processing
12/26/2013US20130344628 Alignment between layers of multilayer electronic support structures
12/26/2013US20130344627 Method of fabricating wafer level package
12/26/2013US20130344626 Method for manufacturing semiconductor device, and film formation device
12/26/2013US20130344625 Endpointing detection for chemical mechanical polishing based on spectrometry
12/26/2013US20130344624 Semiconductor manufacturing optimization by combining small lots into individual carriers
12/26/2013US20130344285 Adhesive material used for joining chamber components
12/26/2013US20130343844 Overhead substrate handling and storage system
12/26/2013US20130343841 Semiconductor manufacturing systems
12/26/2013US20130342952 Substrate mounting table and substrate processing apparatus
12/26/2013US20130342263 Heater for semiconductor device
12/26/2013US20130341835 Method of forming substrate carriers and articles from compositions comprising carbon nanotubes
12/26/2013US20130341802 Integrated circuit package having offset vias
12/26/2013US20130341801 Redeposition Control in MRAM Fabrication Process
12/26/2013US20130341800 Integrated Circuit Packages and Methods for Forming the Same
12/26/2013US20130341799 Through silicon via structure and method of fabricating the same
12/26/2013US20130341798 Apparatuses including stair-step structures and methods of forming the same
12/26/2013US20130341797 Semiconductor devices and methods of manufacturing the same
12/26/2013US20130341796 Semiconductor device with redistributed contacts
12/26/2013US20130341795 Methods of Forming Semiconductor Constructions
12/26/2013US20130341793 Semiconductor device and method of manufacturing the same
12/26/2013US20130341792 Method for producing graphene, graphene produced on substrate, and graphene on substrate
12/26/2013US20130341791 Process For Enhanced 3D Integration and Structures Generated Using the Same
12/26/2013US20130341786 Package on Package Devices and Methods of Packaging Semiconductor Dies
12/26/2013US20130341785 Semiconductor chip with expansive underbump metallization structures
12/26/2013US20130341784 Semiconductor Device and Method of Forming an Embedded SOP Fan-Out Package
12/26/2013US20130341783 Interposer with identification system
12/26/2013US20130341780 Chip arrangements and a method for forming a chip arrangement
12/26/2013US20130341779 Method of manufacturing a semiconductor device and semiconductor device
12/26/2013US20130341778 Device Contact, Electric Device Package and Method of Manufacturing an Electric Device Package
12/26/2013US20130341777 Electro-Thermal Cooling Devices and Methods of Fabrication Thereof
12/26/2013US20130341776 Semiconductor Device Apparatus and Assembly with Opposite Die Orientations
12/26/2013US20130341774 Semiconductor package and method of fabricating the same
12/26/2013US20130341772 Substrate conductor structure and method
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