| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/02/2014 | DE102013211896A1 Bearbeitungsverfahren und Bearbeitungsvorrichtung Processing method and processing device |
| 01/02/2014 | DE102013200944A1 Verfahren zum Herstellen einer Halbleitervorrichtung und Halbleitervorrichtung A method of manufacturing a semiconductor device and semiconductor device |
| 01/02/2014 | DE102013200048A1 Verfahren zum Herstellen integrierter Schaltungen mit Ruthenium beschichtetem Kupfer A method of fabricating integrated circuits with ruthenium coated copper |
| 01/02/2014 | DE102013106932A1 Leadframe-Gehäuse und Verfahren zu ihrer Herstellung Leadframe housing and processes for their preparation |
| 01/02/2014 | DE102013106902A1 Superjunction-Halbleitervorrichtung mit einem Zellgebiet und einem Randgebiet Superjunction semiconductor device having a cell region and a peripheral area |
| 01/02/2014 | DE102013106795A1 Halbleitervorrichtung mit einem Randgebiet und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device having a peripheral area and methods of manufacturing a semiconductor device |
| 01/02/2014 | DE102013106683A1 Halbleitervorrichtungen und Verfahren zur Herstellung derselben Semiconductor devices and methods of manufacturing the same |
| 01/02/2014 | DE102013106577A1 Package-in-Packages und Verfahren zu ihrer Herstellung Package in packages and methods for their preparation |
| 01/02/2014 | DE102013106438A1 Chipgehäuse, Chipanordnungen, eine Leiterplatte und Verfahren zur Herstellung von Chipgehäusen Chip package, chip assemblies, a printed circuit board and process for the production of chip packages |
| 01/02/2014 | DE102013106383A1 Semiconductor integrated circuit design method, involves arranging first cutting area between first and second device areas, which is modified and electrically cuts first conductive line based on design rule |
| 01/02/2014 | DE102013106378A1 Chipgehäuse und verfahren zur herstellung eines chipgehäuses Chip package and method of manufacturing a chip package |
| 01/02/2014 | DE102013106190A1 Verfahren zum Herstellen eines Chipgehäuses, ein Verfahren zum Herstellen eines Waferebenengehäuses und eine Pressvorrichtung A method of manufacturing a chip package, a method of manufacturing a wafer-level housing, and a pressing device |
| 01/02/2014 | DE102013105074A1 Integrierter Schaltkreis, der FinFETs mit verschiedenen Finnenprofilen umfasst Integrated circuit FinFETs with different fin profiles includes |
| 01/02/2014 | DE102013010487A1 Gruppe III-Nitrid-Transistor unter Verwendung einer wiederaufgewachsenen Struktur Group III-nitride transistor using a re-grown structure |
| 01/02/2014 | DE102013010187A1 Schottky-Barriere-Vorrichtung mit lokal planarisierter Oberfläche und zugehöriges Halbleitererzeugnis Schottky barrier device with locally planarized surface and related semiconductor product |
| 01/02/2014 | DE102012211220A1 Elektrisches Bauteil und Verfahren zum Herstellen von elektrischen Bauteilen Electrical component and method for manufacturing of electrical components |
| 01/02/2014 | DE102012205662B4 MOS-Halbleitervorrichtung und Verfahren zu deren Herstellung MOS semiconductor device and process for their preparation |
| 01/02/2014 | DE102012107502A1 Verfahren und Waferlevelpackage für heterogene Integrationstechnologie Process and wafer level package for heterogeneous integration technology |
| 01/02/2014 | DE102011120133B4 Austauschbares Behandlungsbecken für nasschemische Prozesse und Verfahren dazu Interchangeable treatment tank for wet chemical processes and procedures to |
| 01/02/2014 | DE102011002170B4 Verfahren zur Herstellung eines Elektronikbauelement-Packages, Elektronikbauelement-Package und Verriegelungssystem A process for producing an electronic component package, the electronic component package and locking system |
| 01/02/2014 | DE102010052635B4 Halte-Reinigungsvorrichtung und Verfahren zum abschnittsweisen Reinigen gesägter Wafer Holding cleaning apparatus and method for piecewise cleaning sawn wafer |
| 01/02/2014 | DE102008059984B4 Verfahren zum Herstellen von einer Siliziumkarbid-Halbleitervorrichtung A method for producing a silicon carbide semiconductor device |
| 01/02/2014 | DE102007050433B4 Halbleitermodul, Verfahren zum Herstellen eines Halbleitermoduls und Board mit einem Halbleitermodul A semiconductor module, method for manufacturing a semiconductor module and board with a semiconductor module |
| 01/02/2014 | DE102006052714B4 Laserstrahlbearbeitungsmaschine Laser beam processing machine |
| 01/02/2014 | DE102006018899B4 Laserstrahlbearbeitungsmaschine Laser beam processing machine |
| 01/02/2014 | DE102005049195B4 Nichtflüchtiges Speicherbauelement und Herstellungsverfahren A non-volatile memory device and manufacturing method |
| 01/02/2014 | DE102005036517B4 Metallbondingverfahren Metallbondingverfahren |
| 01/02/2014 | DE102005012992B4 Verfahren, Bondeinrichtung und System zum Bonden eines Halbleiterelementes A method, system and bonding device for bonding a semiconductor element |
| 01/01/2014 | EP2680324A1 Method of manufacturing a LED |
| 01/01/2014 | EP2680323A1 Method for manufacturing a light-emitting diode (LED) |
| 01/01/2014 | EP2680312A2 High breakdown voltage LDMOS device |
| 01/01/2014 | EP2680311A1 Tunnel-effect transistor |
| 01/01/2014 | EP2680309A1 Composite substrate, electronic component, and production methods for composite substrate and electronic component |
| 01/01/2014 | EP2680307A2 Semiconductor device package and method of manufacture |
| 01/01/2014 | EP2680302A1 Integrated circuit |
| 01/01/2014 | EP2680301A1 Electronic-component-mounting structure |
| 01/01/2014 | EP2680300A2 Semiconductor device and driver circuit with drain and isolation structure interconnected through a diode circuit, and method of manufacture thereof |
| 01/01/2014 | EP2680299A2 Semiconductor device and driver circuit with a current carrying region and isolation structure interconnected through a resistor circuit, and method of manufacture thereof |
| 01/01/2014 | EP2680298A1 Method and device for detecting termination of etching |
| 01/01/2014 | EP2680297A1 Film forming method and film forming device |
| 01/01/2014 | EP2679962A1 Position measuring device |
| 01/01/2014 | EP2679707A1 Method of manufacturing gallium nitride substrate and gallium nitride substrate manufactured by the same |
| 01/01/2014 | EP2679661A1 Water-soluble working fluid for fixed abrasive grain wire saw |
| 01/01/2014 | EP2679562A1 Cordierite sintered body and member for semiconductor device composed of cordierite sintered body |
| 01/01/2014 | EP2679342A1 Polishing composition |
| 01/01/2014 | EP2678882A2 Charge storage apparatus, systems and methods |
| 01/01/2014 | EP2678881A1 Semiconductor device and fabrication method |
| 01/01/2014 | EP2678880A2 Design based device risk assessment |
| 01/01/2014 | EP2678287A1 Method for joining substrates |
| 01/01/2014 | CN203377214U Integrated circuit |
| 01/01/2014 | CN203377207U Vacuum-packaged CMOS and MEMS chip |
| 01/01/2014 | CN203377206U Chip-taking device |
| 01/01/2014 | CN203377205U Production device of flexible display member |
| 01/01/2014 | CN203377204U Ceramic positioning cap |
| 01/01/2014 | CN203377203U Transmission assembly correction device |
| 01/01/2014 | CN203377202U Horizontal moving apparatus for conveying electronic components |
| 01/01/2014 | CN203377201U Device which automatically eliminates diode consistent machine workpiece cross fault |
| 01/01/2014 | CN203377200U Chip package testing structure |
| 01/01/2014 | CN203377199U A crimping apparatus |
| 01/01/2014 | CN203377198U Automatic IC package mold |
| 01/01/2014 | CN1969060B Gas distribution system having fast gas switching capabilities |
| 01/01/2014 | CN103493602A Plasma processing apparatus |
| 01/01/2014 | CN103493316A 氮化物半导体激光器及外延基板 The nitride semiconductor laser and an epitaxial substrate |
| 01/01/2014 | CN103493229A Method and apparatus for manufacturing optical device |
| 01/01/2014 | CN103493210A Thin film transistor structure, and thin film transistor and display device provided with said structure |
| 01/01/2014 | CN103493209A Thin film transistor structure, and thin film transistor and display device provided with said structure |
| 01/01/2014 | CN103493208A Semiconductor device and method for producing same |
| 01/01/2014 | CN103493206A III-N device structures and methods |
| 01/01/2014 | CN103493201A Dual-plane memory array |
| 01/01/2014 | CN103493198A Electronic device and manufacturing method thereof |
| 01/01/2014 | CN103493195A Holder for supporting a substrate, and substrate-processing apparatus using same |
| 01/01/2014 | CN103493194A Electrostatic chuck aln dielectric repair |
| 01/01/2014 | CN103493193A Wafer exchange device and hand for wafer support |
| 01/01/2014 | CN103493192A 光学终点检测系统 Optical endpoint detection system |
| 01/01/2014 | CN103493191A Method for producing electronic component module and electronic component module |
| 01/01/2014 | CN103493190A Junction structure |
| 01/01/2014 | CN103493189A Method for cutting a carrier for electrical components |
| 01/01/2014 | CN103493188A Normally-off heterojunction field-effect transistor |
| 01/01/2014 | CN103493187A 薄膜晶体管 Thin film transistor |
| 01/01/2014 | CN103493186A Thin film transistor array manufacturing method, thin film transistor array and display device |
| 01/01/2014 | CN103493185A Apparatus and method for UV treatment, chemical treatment, and deposition |
| 01/01/2014 | CN103493184A Semiconductor wafer and method for manufacturing same |
| 01/01/2014 | CN103493183A Method for polishing non-oxide single crystal substrate |
| 01/01/2014 | CN103493182A Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies |
| 01/01/2014 | CN103493181A Material vaporization supply device |
| 01/01/2014 | CN103493180A 半导体基板处理系统 The semiconductor substrate processing system |
| 01/01/2014 | CN103493179A Hot wire atomic layer deposition apparatus and methods of use |
| 01/01/2014 | CN103493178A Apparatus and process for atomic layer deposition |
| 01/01/2014 | CN103493177A Bonded-substrate fabrication method, bonded substrate, substrate bonding method, bonded-substrate fabrication device, and substrate assembly |
| 01/01/2014 | CN103493141A Controlling a non-volatile memory |
| 01/01/2014 | CN103493140A Method for driving semiconductor storage device |
| 01/01/2014 | CN103492939A 液晶显示面板 The liquid crystal display panel |
| 01/01/2014 | CN103492617A Process for filling vias in the microelectronics |
| 01/01/2014 | CN103492519A Compositions and methods for selective polishing of silicon nitride materials |
| 01/01/2014 | CN103492518A Polishing slurry and polishing method thereof |
| 01/01/2014 | CN103492517A Photocurable dicing die bonding tape |
| 01/01/2014 | CN103492499A Silica-coating-forming composition for use with inkjets, method for forming silica coating, semiconductor device, and solar-cell system |
| 01/01/2014 | CN103492466A Substrate film and method for manufacturing same |
| 01/01/2014 | CN103492139A A method of generating a hole or recess or well in an electrically insulating or semiconducting substrate |
| 01/01/2014 | CN103492135A Suction chuck, and transfer device of workpiece including same |