Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2005
06/21/2005US6908796 Method of manufacturing an electro-optical device
06/21/2005US6908794 Method of making a semiconductor package device that includes a conductive trace with recessed and non-recessed portions
06/21/2005US6908793 Method for fabricating a semiconductor device
06/21/2005US6908790 Chip carrier film, method of manufacturing the chip carrier film and liquid crystal display using the chip carrier film
06/21/2005US6908789 Method of making a microelectronic assembly
06/21/2005US6908788 Method of connecting a conductive trace to a semiconductor chip using a metal base
06/21/2005US6908787 System and method for increasing the strength of a bond made by a small diameter wire in ball bonding
06/21/2005US6908785 Multi-chip package (MCP) with a conductive bar and method for manufacturing the same
06/21/2005US6908784 Method for fabricating encapsulated semiconductor components
06/21/2005US6908783 Method of doping organic semiconductors with quinonediimine derivatives
06/21/2005US6908782 High carrier concentration p-type transparent conducting oxide films
06/21/2005US6908777 Compound semiconductor device and method for controlling characteristics of the same
06/21/2005US6908776 Semiconductor device and method of manufacturing the same, apparatus for manufacturing semiconductor device, circuit boa and electronic instrument
06/21/2005US6908775 Method for performing an alignment measurement of two patterns in different layers on a semiconductor wafer
06/21/2005US6908774 Method and apparatus for adjusting the thickness of a thin layer of semiconductor material
06/21/2005US6908772 Single transistor ferroelectric memory cell, device and method for the formation of the same incorporating a high temperature ferroelectric gate dielectric
06/21/2005US6908729 Amplified photoresist; radiation with ultraviolet radiation
06/21/2005US6908717 Positive photosensitive resin composition, process for its preparation, and semiconductor devices
06/21/2005US6908639 Mixed composition interface layer and method of forming
06/21/2005US6908569 Ruthenium silicide wet etch
06/21/2005US6908567 Contaminant removal by laser-accelerated fluid
06/21/2005US6908566 Local dry etching method
06/21/2005US6908565 Etch thinning techniques for wafer-to-wafer vertical stacks
06/21/2005US6908562 Method of forming electrode for saw device
06/21/2005US6908561 Applying adhesion promoter to aluminum or to etched and cleaned copper and/or titanium portions of substrate, curing, applying and curing silicone polyimide epoxy varnish and layer of adhesion promoter, laminating polyimide dielectric
06/21/2005US6908540 Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
06/21/2005US6908534 Substrate plating method and apparatus
06/21/2005US6908529 Plasma processing apparatus and method
06/21/2005US6908517 Physical vapor deposition target
06/21/2005US6908512 Temperature-controlled substrate holder for processing in fluids
06/21/2005US6908511 Apparatus for uniformly baking substrates such as photomasks
06/21/2005US6908361 Method of planarization of semiconductor devices
06/21/2005US6908311 Connection terminal and a semiconductor device including at least one connection terminal
06/21/2005US6908293 Resin encapsulation system
06/21/2005US6908027 Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process
06/21/2005US6907924 Thermally conductive chuck for vacuum processor
06/21/2005US6907892 Exhaust apparatus, semiconductor device manufacturing system and method for manufacturing semiconductor device
06/21/2005US6907890 Removal liquid from wet semiconductor surfaces
06/21/2005US6907742 Apparatus and method for controlling wafer temperature
06/21/2005US6907637 Edge wheel assembly in a substrate processing brush box
06/21/2005CA2218347C Shipping and transport cassette with kinematic coupling
06/21/2005CA2205189C Method of manufacturing bi-layered ferroelectric thin film
06/16/2005WO2005055326A1 Dual-gate field effect transistor
06/16/2005WO2005055325A1 Transistor and cvd apparatus used for forming gate insulating film thereof
06/16/2005WO2005055324A2 Bipolar transistor with raised base connector region and method for production thereof
06/16/2005WO2005055323A1 Silicon carbide semiconductor device and its manufacturing method
06/16/2005WO2005055322A1 Monolithic integrated enhancement mode and depletion mode field effect transistors and method of making the same
06/16/2005WO2005055315A1 Substrate positioning system
06/16/2005WO2005055314A1 Substrate-processing apparatus
06/16/2005WO2005055313A1 Electrostatic chuck, exposure apparatus, and object chucking method
06/16/2005WO2005055312A1 Substrate positioning system
06/16/2005WO2005055311A2 Device having a compliant electrical interconnects and compliant sealing element
06/16/2005WO2005055310A2 Process for packaging components, and packaged components
06/16/2005WO2005055309A1 Thin film transistor, display device and liquid crystal display device and method for manufacturing the same
06/16/2005WO2005055308A1 Process for improving the surface roughness of a wafer
06/16/2005WO2005055307A1 Process for improving the surface roughness of a semiconductor wafer
06/16/2005WO2005055306A1 Ultra-low dielectrics for copper inter connect
06/16/2005WO2005055305A1 Method of cleaning semiconductor substrate conductive layer surface
06/16/2005WO2005055304A1 Plasma generator and plasma etching device
06/16/2005WO2005055303A1 Plasma etching method
06/16/2005WO2005055302A1 Method for manufacturing single-side mirror surface wafer
06/16/2005WO2005055301A1 Silicon wafer producing method
06/16/2005WO2005055300A1 Method for production of semiconductor chip and semiconductor chip
06/16/2005WO2005055299A1 Method for manufacturing semiconductor chip
06/16/2005WO2005055298A1 Plasma processing apparatus and multi-chamber system
06/16/2005WO2005055297A1 Semiconductor processing unit
06/16/2005WO2005055296A1 Exposure apparatus, exposure method, device producing method, and optical component
06/16/2005WO2005055295A1 Exposure method and system, and device producing method
06/16/2005WO2005055294A1 Developing method and developing apparatus
06/16/2005WO2005055293A1 Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unit
06/16/2005WO2005055292A1 Mim capacitor structure and method of fabrication
06/16/2005WO2005055291A1 Apparatus and method for reducing electrical noise in a thermally controlled chuck
06/16/2005WO2005055290A2 Method of fabricating a strained semiconductor-on-insulator substrate
06/16/2005WO2005055289A2 Bipolar complementary semiconductor device
06/16/2005WO2005055288A2 Method and device for the alternating contacting of two wafers
06/16/2005WO2005055281A2 Flexible electronics using ion implantation to adhere polymer substrate to single crystal silicon substrate
06/16/2005WO2005055280A2 Wafer container and door with cam latching mechanism
06/16/2005WO2005055279A2 Wafer container with door actuated wafer restraint
06/16/2005WO2005055278A2 Customized microelectronic device and method for making customized electrical interconnections
06/16/2005WO2005055243A2 Low voltage eeprom memory arrays with isolated wells for each colum
06/16/2005WO2005055178A1 Display device, method for manufacturing the same, and television apparatus
06/16/2005WO2005055130A1 Electronic device manufacturing method
06/16/2005WO2005054949A2 Laser thin film poly-silicon annealing system
06/16/2005WO2005054543A1 Cleaning method
06/16/2005WO2005054405A1 Removal of mems sacrificial layers using supercritical fluid/chemical formulations
06/16/2005WO2005054345A1 Production process tape for film-shaped wiring board
06/16/2005WO2005054336A1 Pellicle and novel fluorinated polymer
06/16/2005WO2005054147A1 Bonding method, device produced by this method, and bonding device
06/16/2005WO2005054134A1 Method for producing composition for forming dielectric film, composition for forming dielectric film, dielectric film and method for producing same
06/16/2005WO2005053893A2 Laser thin film poly-silicon annealing optical system
06/16/2005WO2005041289A3 Method for gluing a circuit component to a circuit substrate
06/16/2005WO2005038941A3 Oled having non-hole blocking buffer layer
06/16/2005WO2005038922A3 Field effect transistor, particularly vertical field effect transistor, memory cell, and production method
06/16/2005WO2005038883A3 Manufacturing method of a ferroelectric capacitor
06/16/2005WO2005036588A3 Tray with flat bottom reference surface
06/16/2005WO2005035437A3 High-precision feedback control for ion sculpting of solid state features
06/16/2005WO2005034214A3 Protective layer during scribing
06/16/2005WO2005027220A3 Manufacture of a non-volatile memory device with a single access gate and differently doped source and drain
06/16/2005WO2005027215A3 A process for the production of a nitrogenous layer on a semiconductor or metal surface
06/16/2005WO2005015608A3 Method of inhibiting corrosion of copper plated or metallized surfaces and circuitry during semiconductor manufacturing processes