| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/23/2005 | US20050133786 Semiconductor testing device and semiconductor testing method |
| 06/23/2005 | US20050133779 Field emission device, display adopting the same and method of manufacturing the same |
| 06/23/2005 | US20050133759 Aqueous sodium hydroxide containing <1 pp copper, nickel, magnesium and chromium, <5 ppb lead and iron, <10 ppb aluminum calcium and zinc, 0.01-10 wt % of nitrate/nitrite, <1 ppm or less each of chloride sulfate and phosphate ions, and other nitrogen compounds, good surface flatness; noncontamination |
| 06/23/2005 | US20050133758 Method for fabricating liquid crystal display device |
| 06/23/2005 | US20050133743 Method for position determination, method for overlay optimization, and lithographic projection apparatus |
| 06/23/2005 | US20050133739 Charged beam writing method and writing tool |
| 06/23/2005 | US20050133738 Ion source and ion implanter having the same |
| 06/23/2005 | US20050133737 Ion implanting apparatus and ion implanting method using the same |
| 06/23/2005 | US20050133734 Exposure apparatus, exposure method and semiconductor device production method |
| 06/23/2005 | US20050133723 Surface-normal optical path structure for infrared photodetection |
| 06/23/2005 | US20050133641 Fan jet nozzle for use with ultra high pressure liquid phase cleaning media for use in deflashing apparatus |
| 06/23/2005 | US20050133572 Methods of forming solder areas on electronic components and electronic components having solder areas |
| 06/23/2005 | US20050133571 Flip-chip solder bump formation using a wirebonder apparatus |
| 06/23/2005 | US20050133570 Method and apparatus for conductive ball bonding of components |
| 06/23/2005 | US20050133566 Wire bonding simulation |
| 06/23/2005 | US20050133565 Laser annealing apparatus for processing semiconductor devices in inline manner |
| 06/23/2005 | US20050133563 Wire bonding apparatus and method for clamping a wire |
| 06/23/2005 | US20050133479 Equipment and process for creating a custom sloped etch in a substrate |
| 06/23/2005 | US20050133476 Methods of bridging lateral nanowires and device using same |
| 06/23/2005 | US20050133404 Universal matrix tray for electronic devices |
| 06/23/2005 | US20050133402 Lid unit for thin-plate supporting container |
| 06/23/2005 | US20050133380 Electroetching methods and systems using chemical and mechanical influence |
| 06/23/2005 | US20050133379 Electrode immersed in solution configured proximate to conductive layer having a longitudinal dimension extending to edge of wafer; elongated contact electrode configured to receive a potential difference; isolator, voltage supplier |
| 06/23/2005 | US20050133363 Conductive polishing article for electrochemical mechanical polishing |
| 06/23/2005 | US20050133362 Transferable micro spring structure |
| 06/23/2005 | US20050133340 Conveyorized storage and transportation system |
| 06/23/2005 | US20050133241 Chip orientation and attachment method |
| 06/23/2005 | US20050133167 Apparatuses and methods for suppressing thermally-induced motion of a workpiece |
| 06/23/2005 | US20050133166 Tuned potential pedestal for mask etch processing apparatus |
| 06/23/2005 | US20050133164 Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift |
| 06/23/2005 | US20050133162 Plasma processing apparatus and plasma processing method |
| 06/23/2005 | US20050133159 Systems and methods for epitaxially depositing films on a semiconductor substrate |
| 06/23/2005 | US20050133158 Mask handler apparatus |
| 06/23/2005 | US20050133157 Temperature controller system for controlling temperature of an object and an apparatus including same |
| 06/23/2005 | US20050133156 Apparatus and method for wafer planarization |
| 06/23/2005 | US20050133152 Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 06/23/2005 | US20050133075 Non-dripping nozzle apparatus |
| 06/23/2005 | US20050133073 Substrate carrier for receiving and retaining in position a planar element |
| 06/23/2005 | US20050133068 Method for cleaning a creamic member for use in a system for producing semiconductors, a cleaning agent and a combination of cleaning agents |
| 06/23/2005 | US20050133067 Processing a workpiece using water, a base, and ozone |
| 06/23/2005 | US20050133066 Substrate treating method and apparatus |
| 06/23/2005 | US20050133061 Apparatuses and methods for cleaning a substrate |
| 06/23/2005 | US20050133060 Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids |
| 06/23/2005 | US20050133059 Performing a plasma process using an oxygen plasma from gases free of nitrogen and fluorine; performing a second plasma process using argon; performing a third plasma process using fluorine |
| 06/23/2005 | US20050132962 Pipe structure, alignment apparatus, electron beam lithography apparatus, exposure apparatus, exposure apparatus maintenance method, semiconductor device manufacturing method, and semiconductor device manufacturing factory |
| 06/23/2005 | US20050132961 Catalytic CVD equipment, method for catalytic CVD, and method for manufacturing semiconductor device |
| 06/23/2005 | US20050132955 Chemical solution coating method and chemical solution coating apparatus |
| 06/23/2005 | US20050132954 Method and device for the temperature control of surface temperatures of substrates in a CVD reactor |
| 06/23/2005 | US20050132953 Edge dry manifold |
| 06/23/2005 | US20050132952 Semiconductor alloy with low surface roughness, and method of making the same |
| 06/23/2005 | US20050132950 Method of growing aluminum-containing nitride semiconductor single crystal |
| 06/23/2005 | US20050132914 Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus |
| 06/23/2005 | US20050132829 Multi-position stop mechanism |
| 06/23/2005 | US20050132814 Semiconductor pressure sensor and pressure sensing device |
| 06/23/2005 | US20050132773 Method for calibrating a bondhead |
| 06/23/2005 | US20050132680 Dust bin and filter for robotic vacuum cleaner |
| 06/23/2005 | US20050132659 Aluminum oxide particles |
| 06/23/2005 | US20050132568 subjecting substrates comprising dielectric thermosetting or thermoplastic resins, to reactive ion etching, to form passageways for conductor wires, used for mounting electronics such as semiconductors and printed circuits, which is free of short circuiting |
| 06/23/2005 | US20050132549 Method for making metal capacitors with low leakage currents for mixed-signal devices |
| 06/23/2005 | US20050132515 Proximity brush unit apparatus and method |
| 06/23/2005 | DE4219319B4 MOS-FET und Herstellungsverfahren dafür MOS-FET and production method thereof |
| 06/23/2005 | DE19756529B4 Halbleitereinrichtung, die fähig ist, eine Eingangs-/Ausgangsanschlußstiftzuordnung von außen gesehen spiegelsymmetrisch zu invertieren A semiconductor device that is capable, as seen from the outside to invert an input / output pin assignment mirror-symmetrically |
| 06/23/2005 | DE19702346B4 MOSFET-Struktur und Verfahren zu deren Herstellung MOSFET structure and process for their preparation |
| 06/23/2005 | DE19612948B4 Verfahren zur Herstellung einer Halbleitereinrichtung mit vertiefter Kanalstruktur A process for producing a semiconductor device with recessed channel structure |
| 06/23/2005 | DE10358599B3 Making trench capacitor in semiconductor substrate employs series of partial collars, fillings and self-adjusting masking to achieve high aspect ratio |
| 06/23/2005 | DE10353530A1 Processing, especially thinning, wafers with components on one side involves applying coating system to wafer front with separating coating so coating system supports or carries wafer during thinning |
| 06/23/2005 | DE10352820A1 Flanschbaugruppe eines optischen Systems The flange assembly of an optical system |
| 06/23/2005 | DE10352349A1 Halbleiterchip mit Flip-Chip-Kontakten und Verfahren zur Herstellung desselben Of the same semiconductor chip having flip chip contacts, and processes for preparing |
| 06/23/2005 | DE10313692B4 Verfahren zur Oberflächen-und/oder Tiefenbehandlung von zumindest einem Halbleitersubstrat und Tauchbadvorrichtung dazu A process for the surface and / or deep treatment of at least a semiconductor substrate and to Tauchbadvorrichtung |
| 06/23/2005 | DE10259252B4 Arbeitseinheit für Reinraumsysteme Work unit for clean room systems |
| 06/23/2005 | DE10248506B4 Vakuumofen, System, das diesen enthält, und Verfahren zu dessen Verwendung Vacuum oven system containing them, and method of use |
| 06/23/2005 | DE102004057775A1 Handling facility for feeding electronic components like integrated circuits in a component carrier to a test device has a component holder (CH) with a device for positioning the component in the CH |
| 06/23/2005 | DE102004056090A1 Formation of inter-conductor dielectric layer between first and second conductive layers involves providing dielectric layer on first conductive layer following second heat treatment |
| 06/23/2005 | DE102004055443A1 Waferbearbeitungsverfahren Wafer processing method |
| 06/23/2005 | DE102004054789A1 Informationsspeichermedium mit Ladungsträger-Dipol-Kopplung Information storage medium having carrier-dipole coupling |
| 06/23/2005 | DE102004054280A1 Vorrichtung und Verfahren für eine verbesserte Wafertransportumgebung Apparatus and method for improved wafer transport environment |
| 06/23/2005 | DE102004052252A1 Bearbeitungsverfahren unter Verwendung eines Laserstrahls Machining method using a laser beam |
| 06/23/2005 | DE102004051348A1 Superjunction Vorrichtung mit verbesserter Robustheit Superjunction device with improved robustness |
| 06/23/2005 | DE102004050358A1 Etching composition hydrogen fluoride useful for selectively etching oxide layer and for manufacturing semiconductor device comprises ammonium fluoride, non-ionic polymer surfactant and water |
| 06/23/2005 | DE102004049735A1 Mask for microlithographic projection exposure apparatus, has pattern of opaque structures applied on support, where intermediate spaces between bar-like structures of opaque structures are filled with dielectric material |
| 06/23/2005 | DE102004043267A1 Vorrichtung zur Substratbearbeitung Apparatus for substrate processing |
| 06/23/2005 | DE102004043084A1 Einrichtung und Verfahren für die Montage oder Verdrahtung von Halbleiterchips Apparatus and method for the assembly or wiring of semiconductor chips |
| 06/23/2005 | DE102004034360A1 Integrated semiconductor circuit, formed by a primary gate layer and a trough region, a doping the material using a lacquer mask |
| 06/23/2005 | DE102004028138A1 Hochspannungstransistor High voltage transistor |
| 06/23/2005 | DE102004020157A1 Capacitor for semiconductor devices, has lower electrode, upper electrode, and dielectric layer with portion formed by alloying hafnium oxide and aluminum oxide together |
| 06/23/2005 | DE102004007703B3 Electronic component testing and rotating device, e.g. for flip-chip testing, with reception elements for electronic components on opposite sides of rotatable component rotated through 180 degrees |
| 06/23/2005 | DE102004002205B3 Forming alignment mask for semiconductor memory unit, includes stages of electrode formation, dielectric deposition, selective filling, collar- and hollow formation |
| 06/23/2005 | DE102004001237A1 Halbleiterbauelement mit verringerten durch heiße Ladungsträger bedingten Effekten und Verfahren zur Verringerung von durch heiße Ladungsträger bedingten Effekten bei einem Transistorbauelement A semiconductor device having reduced due to hot carrier effects and related method for reducing hot carrier effects in a transistor device |
| 06/23/2005 | DE10161902B4 Verfahren und Vorrichtung zum Handhaben von Platten Method and device for handling of plates |
| 06/23/2005 | DE10102129B4 Schaltungsanordnung zur Erzeugung einer Referenzspannung Circuit arrangement for generating a reference voltage |
| 06/23/2005 | DE10008829B4 Verfahren zum Entfernen von adsorbierten Molekülen aus einer Kammer A method for removing adsorbed molecules from a chamber |
| 06/23/2005 | DE10003014B4 Verfahren zur Herstellung einer planaren und dicht struktuierten Silizium-auf-Isolator-Struktur A process for producing a planar and dense struktuierten silicon-on-insulator structure |
| 06/23/2005 | CA2590325A1 Resist, barc and gap fill material stripping chemical and method |
| 06/22/2005 | EP1545181A1 Part mounting apparatus and part mounting method |
| 06/22/2005 | EP1545180A2 Thermal transfer mat for electrical or electronic apparatuses and process for producing it |
| 06/22/2005 | EP1545170A1 Wiring circuit board |
| 06/22/2005 | EP1545016A1 Wireless communication apparatus and semiconductor device |
| 06/22/2005 | EP1544920A2 Semiconductor device having a heterojunction or a Schottky junction |
| 06/22/2005 | EP1544918A2 Semiconductor device with ESD element |
| 06/22/2005 | EP1544916A1 Raised solder pad and method using the same |