Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2005
06/14/2005US6905555 Methods for transferring supercritical fluids in microelectronic and other industrial processes
06/14/2005US6905541 Method and apparatus of generating PDMAT precursor
06/14/2005US6905402 Polishing pad for planarization
06/14/2005US6905389 Toy top game unit
06/14/2005US6905333 Method of heating a substrate in a variable temperature process using a fixed temperature chuck
06/14/2005US6905107 Inflatable slit/gate valve
06/14/2005US6905079 Shower head structure and cleaning method thereof
06/14/2005US6905063 Method of manufacturing semiconductor device
06/14/2005US6905059 Solder ball attachment system
06/14/2005US6905058 Bonding tool and wire bonder
06/14/2005US6905026 Wafer carrying system
06/14/2005US6904921 Indium or tin bonded megasonic transducer systems
06/14/2005US6904920 Method and apparatus for cleaning containers
06/14/2005US6904702 Method and apparatus for drying substrate
06/14/2005US6904699 Vacuum processing apparatus and operating method therefor
06/14/2005US6904675 Method of forming electrical interconnects having electromigration-inhibiting plugs
06/14/2005US6904674 Producing a printed wiring board suitable as an interposer of chip size packages for electrically connecting a semiconductor chip to an external printed wiring board
06/14/2005US6904673 Using ink jet printing apparatus to form a non-polar ink stop line around a chip site on the polar surface of an organic laminate substrate which confines polar liquid flux from spreading after application of the flux prior to chip joining
06/14/2005US6904637 Scrubber with sonic nozzle
06/14/2005CA2249965C Slurry mixing apparatus and method
06/14/2005CA2113958C Semiconductor device and method for manufacturing the same
06/09/2005WO2005053091A1 Fabrication of ltcc t/r modules wih multiple cavities and an integrated ceramic ring frame
06/09/2005WO2005053083A2 Tunable dielectric device and process relating thereto
06/09/2005WO2005053042A1 Method for fabricating gan-based nitride layer
06/09/2005WO2005053034A1 Semiconductor element
06/09/2005WO2005053026A1 Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same
06/09/2005WO2005053023A1 Ultra-thin semiconductor circuit having contact bumps and corresponding production method
06/09/2005WO2005053020A1 Apparatus and method for vertical split-gate nrom memory
06/09/2005WO2005053019A1 Process for forming an electrically conductive interconnect
06/09/2005WO2005053018A1 Production of semiconductor substrates with buried layers by joining (bonding) semiconductor wafers
06/09/2005WO2005053017A1 Semiconductor surface protecting sheet and method
06/09/2005WO2005053016A1 Substrate treatment apparatus, substrate holding device, and semiconductor device manufacturing method
06/09/2005WO2005053015A1 Work handling apparatus
06/09/2005WO2005053014A1 Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium
06/09/2005WO2005053013A1 Flip chip bonding method for enhancing the performance of connection in flip chip packaging process and layered metal architecture of substrate for stud bump
06/09/2005WO2005053012A1 Method for galvanising and forming a contact boss
06/09/2005WO2005053011A1 Structure comprising tunable anti-reflective coating and method of forming thereof
06/09/2005WO2005053010A1 Annealed wafer and annealed wafer manufacturing method
06/09/2005WO2005053009A1 Porous insulating film, method for producing same, and semiconductor device using porous insulating film
06/09/2005WO2005053008A1 Method for forming insulating film, system for forming insulating film, and method for manufacturing semiconductor device
06/09/2005WO2005053007A1 Exposure method, device manufacturing method, exposure device, and program
06/09/2005WO2005053006A1 Conveyance system substrate treating apparatus
06/09/2005WO2005053005A2 A method to contact patterned electrodes on porous substrates and devices thereby
06/09/2005WO2005053004A1 Selective removal chemistries for sacrificial layers methods of production and uses thereof
06/09/2005WO2005052994A2 Protecting thin semiconductor wafers during back-grinding in high-volume production
06/09/2005WO2005052992A2 Semiconductor device with silicided source/drains
06/09/2005WO2005052991A2 High k dielectric film
06/09/2005WO2005052990A2 Semiconductor device with magneticaly permeable heat sink
06/09/2005WO2005052989A2 Dielectric films for narrow gap-fill applications
06/09/2005WO2005052988A2 Focused photon energy heating chamber
06/09/2005WO2005052893A1 Method of manufacturing display device
06/09/2005WO2005052892A1 Method of manufacturing display device
06/09/2005WO2005052693A1 Positive resist composition and method for forming resist pattern
06/09/2005WO2005052526A1 Method and apparatus for measuring temperature of semiconductor wafer
06/09/2005WO2005052109A1 Cleaning agent
06/09/2005WO2005052085A1 Hot melt adhesive composition
06/09/2005WO2005042426A3 Glass-ceramic (ltcc) capable of being assembled with silicon by anodic bonding
06/09/2005WO2005038930A3 Structuring method, and field effect transistors
06/09/2005WO2005036615A3 Apparatus to improve wafer temperature uniformity for face-up wet processing
06/09/2005WO2005024900A3 Bipolar transistor having raised extrinsic base with selectable self-alignment and methods of forming same
06/09/2005WO2005022580A8 Heterojunction bipolar transistor with tunnelling mis emitter junction
06/09/2005WO2005017937A3 Sensor array for measuring plasma characteristics in plasma processing enviroments
06/09/2005WO2005008760A3 Method for anisotropically etching a recess in a silicon substrate and use of a plasma etching system
06/09/2005WO2005006405A3 Reduced movement wafer box
06/09/2005WO2005004208A3 Wafer inspection device
06/09/2005WO2005001899A3 Non-volatile electromechanical field effect devices and circuits using same and methods of forming same
06/09/2005WO2004107399A3 Transistor with independant gate structures
06/09/2005WO2004105968A3 Systems and methods for ultrasonic cleaning using phased transducer arrays
06/09/2005WO2004093167A3 Substrate support having temperature controlled surface
06/09/2005WO2004091792A3 Microfluidic device with ultraphobic surfaces
06/09/2005WO2004088570A3 Chip attachment in an rfid tag
06/09/2005WO2004070785A3 Backside thinning of image array devices
06/09/2005WO2004066356A3 Structures, materials and methods for fabrication of nanostructures by transposed split of ion cut materials
06/09/2005WO2004059697B1 Adaptive negative differential resistance device
06/09/2005WO2004049398A3 Porogen material
06/09/2005WO2004034430A3 Apparatus for alignment and orientation of a wafer for processing
06/09/2005US20050125765 Method and apparatus for decomposing semiconductor device patterns into phase and chrome regions for chromeless phase lithography
06/09/2005US20050125748 Circuit area minimization using scaling
06/09/2005US20050125588 Semiconductor integrated circuit
06/09/2005US20050125587 Semiconductor integrated circuit
06/09/2005US20050125202 Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection
06/09/2005US20050125184 Method and apparatus for monitoring integrated circuit fabrication
06/09/2005US20050125178 Apparatus for correcting a plurality of exposure tools, method for correcting a plurality of exposure tools, and method for manufacturing semiconductor device
06/09/2005US20050125095 Stocker utilization self-balancing system and method
06/09/2005US20050125090 Method and apparatus for evaluating processing apparatus status and predicting processing result
06/09/2005US20050125089 Method and apparatus for integrating large and small lot electronic device fabrication facilities
06/09/2005US20050124785 Microelectronics; molding integrated circuits; using phase transfer catalyst
06/09/2005US20050124767 Units of 9,9-bis(hydroxyphenyl)fluorene and heteroaromatic rings such as pyridine and thiophene moieties as low k dielectric material with good thermal stability, for forming a metal interconnect; traps copper or copper ions to prevent undesirable diffusion from conductive layer
06/09/2005US20050124518 Substrate treating apparatus
06/09/2005US20050124517 Aqueous solution containing fluorine compound, amine and chelate compound
06/09/2005US20050124516 Composition and method for removing photoresist materials from electronic components
06/09/2005US20050124273 Method of forming a polishing pad for endpoint detection
06/09/2005US20050124269 Polishing head and polishing apparatus
06/09/2005US20050124264 Double side polishing device for wafer and double side polishing method
06/09/2005US20050124242 Laminates of a textile material and a polymer film having regions of differing translucency made by selectively compressing regions of the polymer film; breathable and/or waterproof for garments, tents
06/09/2005US20050124232 Semiconductor packaging
06/09/2005US20050124176 Semiconductor device and method for fabricating the same and semiconductor device application system
06/09/2005US20050124175 Lanthanide oxide/zirconium oxide atomic layer deposited nanolaminate gate dielectrics
06/09/2005US20050124174 Lanthanide doped TiOx dielectric films by plasma oxidation
06/09/2005US20050124172 Process for making air gap containing semiconducting devices and resulting semiconducting device
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