Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2005
06/16/2005US20050128462 Holding system, exposure apparatus, and device manufacturing method
06/16/2005US20050128461 Lithographic apparatus and device manufacturing method, and measurement systems
06/16/2005US20050128460 Lithographic apparatus and device manufacturing method
06/16/2005US20050128459 Lithographic apparatus and device manufacturing method
06/16/2005US20050128458 System and method for custom-polarized photolithography illumination
06/16/2005US20050128456 Method and systems for improving focus accuracy in a lithography system
06/16/2005US20050128455 Exposure apparatus, alignment method and device manufacturing method
06/16/2005US20050128454 Exposure method and apparatus
06/16/2005US20050128453 Exposure apparatus
06/16/2005US20050128451 Alignment method
06/16/2005US20050128448 Lithographic apparatus and device manufacturing method
06/16/2005US20050128447 Measuring method and apparatus, exposure method and apparatus using the same, and device manufacturing method
06/16/2005US20050128446 Exposure apparatus and device manufacturing method
06/16/2005US20050128445 Lithographic apparatus and device manufacturing method
06/16/2005US20050128415 Thin film transistor array panel
06/16/2005US20050128410 Thin film transistor array substrate and fabricating method thereof
06/16/2005US20050128404 Liquid crystal cell process for in-plane switching mode liquid crystal display device
06/16/2005US20050128399 Array substrate, method of manufacturing the same and liquid crystal display apparatus having the same
06/16/2005US20050128398 Method for designing mask and fabricating panel
06/16/2005US20050128383 Liquid crystal display panel and method of fabricating the same
06/16/2005US20050128337 Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device
06/16/2005US20050128326 Image pick-up device and camera system comprising an image pick-up device
06/16/2005US20050128029 Ferroelectric epitaxial thin film for microwave tunable device and microwave tunable device using the same
06/16/2005US20050127985 Semiconductor device having logic circuit and macro circuit
06/16/2005US20050127941 Semiconductor device
06/16/2005US20050127936 Test pad array for contact resistance measuring of ACF bonds on a liquid crystal display panel
06/16/2005US20050127930 Die level testing using machine grooved storage tray with vacuum channels
06/16/2005US20050127927 Indexing rotatable chuck for a probe station
06/16/2005US20050127926 Method using conductive atomic force microscopy to measure contact leakage current
06/16/2005US20050127898 Stage driving apparatus and probe method
06/16/2005US20050127844 High-frequency power supply structure and plasma cvd device using the same
06/16/2005US20050127821 Field emission display
06/16/2005US20050127810 Method of manufacturing electro-optical device, electro-optical device, and electronic apparatus comprising the same
06/16/2005US20050127786 System and method for moving an object employing piezo actuators
06/16/2005US20050127688 Wafer container and door with cam latching mechanism
06/16/2005US20050127619 Electrostatic clampless holder module and cooling system
06/16/2005US20050127536 Conductor composition, a mounting substrate and a mounting structure utilizing the composition
06/16/2005US20050127535 Method of manufacturing a semiconductor device and a semiconductor device
06/16/2005US20050127533 Patterned plasma treatment to improve distribution of underfill material
06/16/2005US20050127530 Structure and method for fabricating a bond pad structure
06/16/2005US20050127529 Structure and method for reinforcing a bond pad on a chip
06/16/2005US20050127528 Underfill integration for optical packages
06/16/2005US20050127527 Electronic component with flexible contacting pads and method for producing the electronic component
06/16/2005US20050127526 Semi conductor device
06/16/2005US20050127523 Semiconductor device, method of manufacturing semiconductor device, semiconductor chip, electronic module and electronic equipment
06/16/2005US20050127522 Semiconductor device and electronic device, as well as method for manufacturing the same
06/16/2005US20050127521 Electronic component with compliant elevations having electrical contact areas and method for producing it
06/16/2005US20050127519 High density contact to relaxed geometry layers
06/16/2005US20050127518 Copper tungsten phosphide formed by electrodeposition of layers
06/16/2005US20050127517 Semiconductor device
06/16/2005US20050127516 Small viatops for thick copper connectors
06/16/2005US20050127515 Sidewall sealing of porous dielectric materials
06/16/2005US20050127514 Line level air gaps
06/16/2005US20050127513 Semiconductor device
06/16/2005US20050127512 Semiconductor device and the method of producing the same
06/16/2005US20050127511 Interconnect structures and methods of making thereof
06/16/2005US20050127510 Metal interconnection lines of semiconductor devices and methods of forming the same
06/16/2005US20050127509 Semiconductor device and method for fabricating the same
06/16/2005US20050127508 Solder bump structure for flip chip package and method for manufacturing the same
06/16/2005US20050127506 Method and an apparatus for a hard-coded bit value changeable in any layer of metal
06/16/2005US20050127504 Semiconductor device, semiconductor chip, method for manufacturing semiconductor device, and electronic apparatus
06/16/2005US20050127503 Power semiconductor module and method for producing it
06/16/2005US20050127500 Local reduction of compliant thermally conductive material layer thickness on chips
06/16/2005US20050127498 Copper-based chip attach for chip-scale semiconductor packages
06/16/2005US20050127497 Arrangement with a semiconductor chip and support therefore and method for a bonded wire connection
06/16/2005US20050127496 Bonding pads with dummy patterns in semiconductor devices and methods of forming the same
06/16/2005US20050127493 Semiconductor device and electronic device, and methods for manufacturing thereof
06/16/2005US20050127489 Microelectronic device signal transmission by way of a lid
06/16/2005US20050127487 Semiconductor package with improved solder joint reliability
06/16/2005US20050127486 Chip-scale package and carrier for use therewith
06/16/2005US20050127482 Method of forming a semiconductor package and leadframe therefor
06/16/2005US20050127481 Semiconductor device
06/16/2005US20050127479 Interconnect structures and methods for their fabrication
06/16/2005US20050127478 Microelectronic devices and methods for filling vias in microelectronic devices
06/16/2005US20050127477 High resistivity silicon wafer and method for fabricating the same
06/16/2005US20050127476 Transistor
06/16/2005US20050127475 Apparatus and method for electronic fuse with improved esd tolerance
06/16/2005US20050127474 Semiconductor device and manufacturing method thereof
06/16/2005US20050127473 Semiconductor device and method of fabricating the same
06/16/2005US20050127472 Trench isolated integrated circuit devices including grooves
06/16/2005US20050127471 Semiconductor device having a dummy active region for controlling high density plasma chemical vapor deposition
06/16/2005US20050127470 Dielectric isolation type semiconductor device and method for manufacturing the same
06/16/2005US20050127469 Method for preventing sneakage in shallow trench isolation and STI structure thereof
06/16/2005US20050127468 Semiconductor device and method for manufacturing the same
06/16/2005US20050127467 Semiconductor device and method of fabrication thereof, electronic module, and electronic instrument
06/16/2005US20050127466 Wrap-around gate field effect transistor
06/16/2005US20050127465 Trench schottky barrier diode with differential oxide thickness
06/16/2005US20050127464 Schottky barrier diode and method of making the same
06/16/2005US20050127463 Image sensor with light guides
06/16/2005US20050127462 Image sensor applied with device isolation technique for reducing dark signals and fabrication method thereof
06/16/2005US20050127460 Semiconductor device and method of manufacturing the same
06/16/2005US20050127459 Novel gate structure and method of forming the gate dielectric with mini-spacer
06/16/2005US20050127458 Incorporating dopants to enhance the dielectric properties of metal silicates
06/16/2005US20050127456 Semiconductor device and method of fabricating the same
06/16/2005US20050127454 Contactless mask programmable rom
06/16/2005US20050127453 Method of forming self-aligned contact structure with locally etched gate conductive layer
06/16/2005US20050127452 Resistive isolation between a body and a body contact
06/16/2005US20050127451 Semiconductor device
06/16/2005US20050127450 Semiconductor device
06/16/2005US20050127449 Semiconductor device and manufacturing method of the same
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