Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2005
06/28/2005US6911097 Photoresist stripper using nitrogen bubbler
06/28/2005US6911096 For collecting impurities on the wafer surface and in a thin film formed on the wafer and analyzing the impurities; applying liquid in drops
06/28/2005US6911092 ALD apparatus and method
06/28/2005US6911091 Environment exchange control for material on a wafer surface
06/28/2005US6911088 Substrate processing apparatus and slit nozzle
06/28/2005US6911084 Low temperature epitaxial growth of quaternary wide bandgap semiconductors
06/28/2005US6911079 Method for reducing the resistivity of p-type II-VI and III-V semiconductors
06/28/2005US6911059 Abrasive pad and process for the wet-chemical grinding of a substrate surface
06/28/2005US6910955 Rotary drive device of a polishing device
06/28/2005US6910954 Method of supplying slurry and a slurry supply apparatus having a mixing unit at a point of use
06/28/2005US6910947 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
06/28/2005US6910944 Method of forming a transparent window in a polishing pad
06/28/2005US6910943 Planarization apparatus and method
06/28/2005US6910907 Contact for use in an integrated circuit and a method of manufacture therefor
06/28/2005US6910898 Socket for semiconductor device
06/28/2005US6910874 Semiconductors packages
06/28/2005US6910615 Solder reflow type electrical apparatus packaging having integrated circuit and discrete components
06/28/2005US6910613 Device and method for forming bump
06/28/2005US6910612 Capillary with contained inner chamfer
06/28/2005US6910583 Apparatus for carrying substrates
06/28/2005US6910497 Semiconductor component manufacturing plant with ventilated false floor
06/28/2005US6910489 Composition for eliminating thermosetting resin
06/28/2005US6910487 Method and apparatus for liquid-treating and drying a substrate
06/28/2005US6910441 Pressure regulating system of plasma processing equipment
06/28/2005US6910403 Method for cutting semiconductor wafer protecting sheet
06/28/2005US6910268 An interconnect system employing a vertical signal path along an edge of an integrated circuit (IC) chip
06/28/2005US6910240 Wafer bevel edge cleaning system and apparatus
06/28/2005CA2375956C Abrasive tools for grinding electronic components
06/28/2005CA2231377C Second-layer phase change memory array on top of a logic device
06/28/2005CA2230065C Anti-tamper bond wire shield for an integrated circuit
06/28/2005CA2144323C Methods and apparatus for producing integrated circuit devices
06/23/2005WO2005057664A2 Power mosfet and methods of making same
06/23/2005WO2005057663A2 Method and apparatus for fabrication of metal-oxide semiconductor integrated circuit devices
06/23/2005WO2005057662A2 Method and apparatus for fabricating ultra-shallow junction metal-oxide semiconductor integrated circuit devices.
06/23/2005WO2005057661A1 Semiconductor device and its manufacturing method
06/23/2005WO2005057658A1 Method for manufacturing thin film integrated circuit device, noncontact thin film integrated circuit device and method for manufacturing the same, and idtag and coin including the noncontact thin film integrated circuit device
06/23/2005WO2005057654A2 Wire-bonded semiconductor component with reinforced inner connection metallization
06/23/2005WO2005057653A1 High density integrated circuit package s and method of making same
06/23/2005WO2005057651A1 Production method of semiconductor chip
06/23/2005WO2005057650A1 A water jet singulation apparatus for semiconductor manufacture and singulation method thereof
06/23/2005WO2005057649A1 Semiconductor wafer carrier container
06/23/2005WO2005057648A1 Substrate treating apparatus
06/23/2005WO2005057647A1 Silicone adhesive agent
06/23/2005WO2005057646A1 Insulating film, method for forming same and composition for forming film
06/23/2005WO2005057645A1 Silicon wafer processing method
06/23/2005WO2005057644A1 Wafer processing tape and method of producing the same
06/23/2005WO2005057643A1 Deposition method, particularly on copper, and integrated circuit arrangement
06/23/2005WO2005057642A1 Gallium nitride-based compound semiconductor light-emitting device and negative electrode thereof
06/23/2005WO2005057641A1 Electrode, method for producing same and semiconductor device using same
06/23/2005WO2005057640A1 Epitaxial wafer and method for producing same
06/23/2005WO2005057639A1 Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials
06/23/2005WO2005057638A1 Multiple anneal induced disordering
06/23/2005WO2005057637A2 Method for the molecular bonding of microelectronic components to a polymer film
06/23/2005WO2005057634A1 Pattern-forming process utilizing nanoimprint and apparatus for performing such process
06/23/2005WO2005057633A1 Substrate treatment device control method and substrate treatment device
06/23/2005WO2005057632A1 Umbilical cord facilities connection for an ion beam implanter
06/23/2005WO2005057631A2 Planar substrate with selected semiconductor crystal orientations formed by localized amorphzation and recrystallization of stacked template layers
06/23/2005WO2005057630A2 Manufacturable low-temperature silicon carbide deposition technology
06/23/2005WO2005057629A2 Assembly and adhesive layer for semiconductor components
06/23/2005WO2005057627A2 Manufacturing system and apparatus for balanced product flow with application to low-stress underfiling of flip-chip electronic devices
06/23/2005WO2005057625A2 Method of differentially patterning layers of organic thin film material without damaging underlying layers
06/23/2005WO2005057622A2 Structure and method for iii-nitride device isolation
06/23/2005WO2005057615A2 Closed cell trench metal-oxide-semiconductor field effect transistor
06/23/2005WO2005057614A2 Extractor/buffer
06/23/2005WO2005057612A2 SILICON DEVICE ON Si:C-OI and SGOI AND METHOD OF MANUFACTURE
06/23/2005WO2005057530A1 Thin film transistor integrated circuit device, active matrix display device, and manufacturing method of the same
06/23/2005WO2005057288A1 Resist polymer solution and process for producing the same
06/23/2005WO2005057287A1 Positive resist composition and method for forming resist pattern
06/23/2005WO2005057284A1 Photoresist composition and method for forming resist pattern
06/23/2005WO2005057281A2 Resist, barc and gap fill material stripping chemical and method
06/23/2005WO2005057280A2 Lithographic apparatus and device manufacturing method
06/23/2005WO2005057247A2 Metallic nano-optic lenses and beam shaping devices
06/23/2005WO2005057195A1 Use of scanning beam for differential evaluation of adjacent regions for change in reflectivity
06/23/2005WO2005057177A1 Systems and methods for detecting contaminants
06/23/2005WO2005056874A1 Arrangement for the thermal processing of silicon wafers in a process chamber
06/23/2005WO2005056675A1 Dual-stage wafer applied underfills
06/23/2005WO2005056499A2 Oligo(p-phenylene vinylene) amphiphiles and methods for self-assembly
06/23/2005WO2005056294A1 Method and apparatus for printing a patterned layer on a flatsubstrate with a flat-type-bed
06/23/2005WO2005056290A1 Novel polymer films and textile laminates containing such polymer films
06/23/2005WO2005056202A2 Apparatus and method for cleaning surfaces
06/23/2005WO2005056200A1 Stencil and method for depositing a viscous product about solder balls therewith
06/23/2005WO2005048318A9 Nitride metal oxide semiconductor integrated transistor devices
06/23/2005WO2005043613A9 Substrate holder
06/23/2005WO2005033357A3 Low-pressure deposition of metal layers from metal-carbonyl precursors
06/23/2005WO2005031810A3 Formation of a silicon germanium-on-insulator structure by oxidation of a buried porous silicon layer
06/23/2005WO2005031809A3 The production of a germanium oxynitride layer on a ge-based material
06/23/2005WO2005031807A3 Wafer-level moat structures
06/23/2005WO2005031799A3 Exposure apparatus, exposure method, and device manufacturing method
06/23/2005WO2005018864A8 Capillary with contained inner chamfer
06/23/2005WO2005013002A3 Process sequence for photoresist stripping and/or cleaning of photomasks for integrated circuit manufacturing
06/23/2005WO2004114386A3 Methods and system for processing a microelectronic topography
06/23/2005WO2004102642A3 Envelope follower end point detection in time division multiplexed processes
06/23/2005WO2004097894A9 Self-organized nanopore arrays with controlled symmetry and order
06/23/2005WO2004092831A3 Photoresists and methods for use thereof
06/23/2005WO2004061953A3 Method of forming a multi-layer semiconductor structure incorporating a processing handle member
06/23/2005WO2004061851A3 An improved method for making high-density nonvolatile memory
06/23/2005WO2004056162A8 Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package
06/23/2005WO2004032190A3 Integrated displays using nanowire transistors
06/23/2005US20050138598 Method for providing layout design and photo mask
06/23/2005US20050138593 Semiconductor integrated circuit having diagonal wires, semiconductor integrated circuit layout method, and semiconductor integrated circuit layout design program
1 ... 3810 3811 3812 3813 3814 3815 3816 3817 3818 3819 3820 3821 3822 3823 3824 3825 3826 3827 3828 3829 3830 ... 6590