Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2005
10/20/2005US20050230846 Wafer level chip scale packaging structure and method of fabricating the same
10/20/2005US20050230844 Flip-chip image sensor packages and methods of fabrication
10/20/2005US20050230843 Flip-chip type semiconductor devices and conductive elements thereof
10/20/2005US20050230841 Integrated circuit package with low modulus layer and capacitor/interposer
10/20/2005US20050230840 Semiconductor wafer, semiconductor chip and method for manufacturing the same
10/20/2005US20050230839 Fabrication of silicon micro-mechanical structures
10/20/2005US20050230838 Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same
10/20/2005US20050230837 Semiconductor component with coreless transformer
10/20/2005US20050230836 Method of forming air gaps in a dielectric material using a sacrificial film and resulting structures
10/20/2005US20050230835 Semiconductor device
10/20/2005US20050230834 Multi-stage curing of low K nano-porous films
10/20/2005US20050230833 Semiconductor device
10/20/2005US20050230832 Three-level unitary interconnect structure
10/20/2005US20050230831 Structure to improve adhesion between top CVD low-k dielectiric and dielectric capping layer
10/20/2005US20050230830 Method and apparatus for production of metal film or the like
10/20/2005US20050230829 Semiconductor device
10/20/2005US20050230827 Semiconductor device, magnetic sensor, and magnetic sensor unit
10/20/2005US20050230826 Semiconductor device and multilayer substrate therefor
10/20/2005US20050230825 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
10/20/2005US20050230824 BGA semiconductor device having a dummy bump
10/20/2005US20050230821 Semiconductor packages, and methods of forming semiconductor packages
10/20/2005US20050230819 Semiconductor Heat-Dissipating Substrate, and Manufacturing Method and Package Therefor
10/20/2005US20050230817 Chip bonding heater with differential heat transfer
10/20/2005US20050230815 Interconnect alloys and methods and apparatus using same
10/20/2005US20050230811 Compliant contact pin assembly and card system
10/20/2005US20050230810 Compliant contact pin assembly and card system
10/20/2005US20050230809 Compliant contact pin assembly and card system
10/20/2005US20050230808 Methods for making semiconductor packages with leadframe grid arrays
10/20/2005US20050230807 Power semiconductor module
10/20/2005US20050230806 Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements
10/20/2005US20050230805 Semiconductor device, method for producing the same, circuit board, and electronic apparatus
10/20/2005US20050230804 Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
10/20/2005US20050230803 Leadframe packaging structure and the method of manufacturing the same
10/20/2005US20050230802 Stacked die BGA or LGA component assembly
10/20/2005US20050230801 Semiconductor device
10/20/2005US20050230799 Multi-chip module with embedded package and method for manufacturing the same
10/20/2005US20050230798 Method and apparatus for manufacturing semiconductor apparatus
10/20/2005US20050230797 Chip packaging structure
10/20/2005US20050230796 Semiconductor integrated circuit
10/20/2005US20050230795 LSI package provided with interface module, and transmission line header employed in the package
10/20/2005US20050230794 Semiconductor device with improved design freedom of external terminal
10/20/2005US20050230793 Semiconductor device
10/20/2005US20050230791 RFID-chip having RFID-tag or magnifying electrode
10/20/2005US20050230790 Tape carrier for TAB
10/20/2005US20050230789 Method for removing tiebars after molding of semiconductor chip
10/20/2005US20050230788 Magnetic shield member, magnetic shield structure, and magnetic memory device
10/20/2005US20050230787 Covert transformation of transistor properties as a circuit protection method
10/20/2005US20050230786 Semiconductor device having a measuring pattern and a method of measuring the semiconductor device using the measuring pattern
10/20/2005US20050230783 High performance system-on-chip discrete components using post passivation process
10/20/2005US20050230782 Semiconductor device and method for manufacturing the same
10/20/2005US20050230781 Semiconductor device and its manufacture method
10/20/2005US20050230780 Semiconductor device with STI structure and method of fabricating the same
10/20/2005US20050230779 Semiconductor device
10/20/2005US20050230777 Termination design with multiple spiral trench rings
10/20/2005US20050230776 Low temperature texturing layer to enhance adhesion of subsequent layers
10/20/2005US20050230773 Electronic component, mounted structure, electro-optical device, and electronic device
10/20/2005US20050230771 Magnetic tunnel junction structures having bended tips at both ends thereof, magnetic random access memory cells employing the same and photomasks used in formation thereof
10/20/2005US20050230770 Magnetic sensor having vertical hall device and method for manufacturing the same
10/20/2005US20050230766 Non-volatile semiconductor memory device and method for producing same
10/20/2005US20050230765 Semiconductor device, mask for impurity implantation, and method of fabricating the semiconductor device
10/20/2005US20050230764 Method for forming 1 TRAM cell and structure formed thereby
10/20/2005US20050230763 Method of manufacturing a microelectronic device with electrode perturbing sill
10/20/2005US20050230762 Semiconductor device and method of fabricating same
10/20/2005US20050230760 Methods for selective deposition to improve selectivity
10/20/2005US20050230759 Semiconductor device and method of manufacturing semiconductor device
10/20/2005US20050230758 Transistor well bias scheme
10/20/2005US20050230756 CMOS device and method of manufacture
10/20/2005US20050230755 Semiconductor thin film and its manufacturing method and semiconductor device and it's manufacturing method
10/20/2005US20050230754 Preventive treatment method for a multilayer semiconductor wafer
10/20/2005US20050230753 LTPS TFT substrate and manufacturing process thereof
10/20/2005US20050230752 Semiconductor device and manufacturing method thereof
10/20/2005US20050230751 Semiconductor device
10/20/2005US20050230749 Semiconductor device having a side wall insulating film and a manufacturing method thereof
10/20/2005US20050230748 Semiconductor memory device and manufacturing method therefor
10/20/2005US20050230747 Semiconductor device
10/20/2005US20050230745 Vertical power JFET with low on-resistance for high voltage applications
10/20/2005US20050230744 Schottky barrier diode and method of making the same
10/20/2005US20050230743 Non-volatile semiconductor memory device
10/20/2005US20050230742 Semiconductor memory device
10/20/2005US20050230741 Direct tunneling memory with separated transistor and tunnel areas
10/20/2005US20050230740 Flash memory cell transistor and method for fabricating the same
10/20/2005US20050230739 Content addressable matrix memory cell and manufacture thereof
10/20/2005US20050230738 NAND type flash memory device, and method for manufacturing the same
10/20/2005US20050230737 Method for using drain coupling to suppress the second bit effect of localized split floating gate devices
10/20/2005US20050230736 Nonvolatile semiconductor memory device
10/20/2005US20050230735 Methods for forming conductive structures and structures regarding same
10/20/2005US20050230734 Field effect transistors having trench-based gate electrodes and methods of forming same
10/20/2005US20050230733 Semiconductor device having landing pad and fabrication method thereof
10/20/2005US20050230732 Semiconductor memory device having capacitor and method of forming the same
10/20/2005US20050230731 Metal thin film and method of manufacturing the same, dielectric capacitor and method of manufacturing the same, and semiconductor device
10/20/2005US20050230730 Semiconductor integrated circuit device and frequency modulation device
10/20/2005US20050230729 Capacitor having metal electrode and method of fabricating the same
10/20/2005US20050230728 Semiconductor device and method of manufacturing the same
10/20/2005US20050230727 Ferroelectric memory device and method of manufacturing the same
10/20/2005US20050230726 Ferroelectric rare-earth manganese-titanium oxides
10/20/2005US20050230725 Ferroelectric capacitor having an oxide electrode template and a method of manufacture therefor
10/20/2005US20050230721 CMOS imager with enhanced transfer of charge and low voltage operation and method of formation
10/20/2005US20050230718 Method of manufacturing a semiconductor device
10/20/2005US20050230717 Semiconductor device of transistor structure having strained semiconductor layer
10/20/2005US20050230716 Semiconductor integrated circuit equipment and its manufacture method
1 ... 3657 3658 3659 3660 3661 3662 3663 3664 3665 3666 3667 3668 3669 3670 3671 3672 3673 3674 3675 3676 3677 ... 6590