Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2005
10/20/2005US20050233600 Semiconductor device and method of its manufacture
10/20/2005US20050233599 Method for producing material of electronic device
10/20/2005US20050233598 Method of fabricating high-k dielectric layer having reduced impurity
10/20/2005US20050233597 Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same
10/20/2005US20050233596 Self-aligned coating on released MEMS
10/20/2005US20050233595 Controlling the properties and uniformity of a silicon nitride film by controlling the film forming precursors
10/20/2005US20050233594 Semiconductor device, electro-optic device, integrated circuit, and electronic apparatus
10/20/2005US20050233592 Method of manufacturing semiconductor device using flexible tube
10/20/2005US20050233591 Techniques promoting adhesion of porous low K film to underlying barrier layer
10/20/2005US20050233590 Waferless automatic cleaning after barrier removal
10/20/2005US20050233589 Processes for removing residue from a workpiece
10/20/2005US20050233588 Semiconductor constructions
10/20/2005US20050233587 Method for making an anisotropic conductive film pointed conductive inserts
10/20/2005US20050233586 Method to reduce silanol and improve barrier properties in low K dielectric IC interconnects
10/20/2005US20050233585 Metal nanoline process and applications on growth of aligned nanostructure thereof
10/20/2005US20050233584 Semiconductor device having a contact window including a lower with a wider to provide a lower contact resistance
10/20/2005US20050233583 Method of manufacturing semiconductor device
10/20/2005US20050233582 Method of forming a conductive barrier layer within critical openings by a final deposition step after a re-sputter deposition
10/20/2005US20050233581 Method for manufacturing semiconductor device
10/20/2005US20050233580 Alignment pattern for a semiconductor device manufacturing process
10/20/2005US20050233579 Method for forming metal wires in semiconductor device
10/20/2005US20050233578 Method and composition for polishing a substrate
10/20/2005US20050233577 High aspect ratio contact structure with reduced silicon consumption
10/20/2005US20050233576 Method of depositing dielectric materials in damascene applications
10/20/2005US20050233575 Semiconductor device and manufacturing method thereof, integrated circuit, electro-optic device, and electronic equipment
10/20/2005US20050233574 Capacitance reduction by tunnel formation for use with a semiconductor device
10/20/2005US20050233573 Method for fabricating semiconductor device
10/20/2005US20050233572 Dual damascene structure formed of low-k dielectric materials
10/20/2005US20050233571 Flip chip package, semiconductor package with bumps and method for manufacturing semiconductor package with bumps
10/20/2005US20050233569 Bump structure for a semiconductor device and method of manufacture
10/20/2005US20050233568 Method for manufacturing semiconductor device having solder layer
10/20/2005US20050233567 Method of manufacturing multi-stack package
10/20/2005US20050233566 Lead frame and method of manufacturing the same
10/20/2005US20050233565 Methods for manufacturing a finfet using a conventional wafer and apparatus manufactured therefrom
10/20/2005US20050233564 Semiconductor device and method for fabricating the same
10/20/2005US20050233563 Recess reduction for leakage improvement in high density capacitors
10/20/2005US20050233562 Method for forming a gate electrode having a metal
10/20/2005US20050233561 Adhesion of a metal layer to a substrate and related structures
10/20/2005US20050233560 Silicon substrates with multi-grooved surface and production methods thereof
10/20/2005US20050233559 Method of forming a layer on a wafer
10/20/2005US20050233558 Semiconductor device and manufacturing method thereof
10/20/2005US20050233557 Semiconductor device and manufacturing method thereof
10/20/2005US20050233556 Method for crystallizing semiconductor with laser beams
10/20/2005US20050233555 Adhesion improvement for low k dielectrics to conductive materials
10/20/2005US20050233554 Manufacturing method for semiconductor device and semiconductor manufacturing apparatus
10/20/2005US20050233553 Method of fabricating semiconductor by nitrogen doping of silicon film
10/20/2005US20050233552 Strained channel on insulator device
10/20/2005US20050233551 Method for depositing silicon by pulsed cathodic vacuum arc
10/20/2005US20050233550 Method of laser marking, laser marking apparatus and method and apparatus for detecting a mark
10/20/2005US20050233549 Multi-elevation singulation of device laminates in wafer scale and substrate processing
10/20/2005US20050233548 Method for fabricating semiconductor wafer
10/20/2005US20050233547 Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
10/20/2005US20050233546 Method of transferring devices, method of arranging devices using the same, and method of manufacturing an image display system
10/20/2005US20050233545 Method and system for lattice space engineering
10/20/2005US20050233544 Method of smoothing the outline of a useful layer of material transferred onto a support substrate
10/20/2005US20050233543 Method of fabricating microelectromechanical system structures
10/20/2005US20050233542 Semiconductor device including a channel stop structure and method of manufacturing the same
10/20/2005US20050233541 Semiconductor device having dual isolation structure and method of fabricating the same
10/20/2005US20050233540 Minimizing transistor variations due to shallow trench isolation stress
10/20/2005US20050233539 Method for manufacturing semiconductor device having trench in silicon carbide semiconductor substrate
10/20/2005US20050233538 Integrated dynamic memory cell and method for fabricating it
10/20/2005US20050233537 Method and system for high-speed, precise micromachining an array of devices
10/20/2005US20050233536 Method for the production of a bipolar transistor
10/20/2005US20050233535 Bipolar transistor self-alignment with raised extrinsic base extension and methods of forming same
10/20/2005US20050233534 Silicon germanium heterojunction bipolar transistor with carbon incorporation
10/20/2005US20050233533 Semiconductor device having multiple work functions and method of manufacture therefor
10/20/2005US20050233532 Method of forming sidewall spacers
10/20/2005US20050233531 Method of manufacturing semiconductor devices
10/20/2005US20050233530 Enhanced gate structure
10/20/2005US20050233529 Integration of high k gate dielectric
10/20/2005US20050233528 ONO formation method
10/20/2005US20050233527 Method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode
10/20/2005US20050233526 Semiconductor device, production method and production device thereof
10/20/2005US20050233525 Gate electrode for a semiconductor fin device
10/20/2005US20050233524 Method for manufacturing flash memory device and flash memory device
10/20/2005US20050233523 Method of manufacturing non-volatile memory cell
10/20/2005US20050233522 Method of manufacturing a nonvolatile semiconductor memory device having a stacked gate structure
10/20/2005US20050233521 Method for forming dielectric layer between gates in flash memory device
10/20/2005US20050233520 Semiconductor device and method for fabricating the same
10/20/2005US20050233519 Method of manufacturing semiconductor device
10/20/2005US20050233518 Electronic circuit device having silicon substrate
10/20/2005US20050233517 Semiconductor device and method for manufacturing same
10/20/2005US20050233516 Semiconductor device and manufacturing method thereof
10/20/2005US20050233515 Method of etching a semiconductor device
10/20/2005US20050233514 PMD liner nitride films and fabrication methods for improved NMOS performance
10/20/2005US20050233513 MOS transistor having a recessed gate electrode and fabrication method thereof
10/20/2005US20050233512 Method of manufacturing a semiconductor device
10/20/2005US20050233511 Laser mask and method of crystallization using the same
10/20/2005US20050233510 Semiconductor device, electro-optical device, integrated circuit and electronic equipment
10/20/2005US20050233508 Semiconductor device and method of manufacturing the same
10/20/2005US20050233507 Semiconductor display device and method of manufacturing the same
10/20/2005US20050233505 Method of manufacturing a semiconductor memory device
10/20/2005US20050233504 Device transfer method and display apparatus
10/20/2005US20050233503 Method for the production of structured layers on substrates
10/20/2005US20050233502 Methods of fabrication for flip-chip image sensor packages
10/20/2005US20050233500 Method of manufacturing semiconductor package having multiple rows of leads
10/20/2005US20050233499 Semiconductor device and manufacturing method of the same
10/20/2005US20050233495 Novel technique to grow high quality ZnSe epitaxy layer on Si substrate
10/20/2005US20050233494 Image sensor and method for fabricating the same
10/20/2005US20050233492 Method of fabricating silicon-based mems devices
1 ... 3655 3656 3657 3658 3659 3660 3661 3662 3663 3664 3665 3666 3667 3668 3669 3670 3671 3672 3673 3674 3675 ... 6590