Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2005
10/19/2005CN1223705C Method of electroless plating layer and apparatus for electro less plating layer
10/19/2005CN1223703C Exhaust pipe with reactive by-product deposit preventing means and method of preventing the deposit
10/19/2005CN1223702C Plating method of metal film on surface of polymer
10/19/2005CN1223697C Method and apparatus for low pressure sputtering
10/19/2005CN1223500C Conveying positioning method and its equipment for conveyed articles
10/18/2005US6957410 Method and apparatus for adaptively selecting the wiring model for a design region
10/18/2005US6957377 Marking of and searching for initial defective blocks in semiconductor memory
10/18/2005US6957119 Method for monitoring matched machine overlay
10/18/2005US6957112 Industrial machine management system and method
10/18/2005US6956963 Imaging for a machine-vision system
10/18/2005US6956885 Electromagnetic radiation generation using a laser produced plasma
10/18/2005US6956879 Semiconductor laser device, optical pickup using the same, and apparatus and method for manufacturing the same
10/18/2005US6956783 Semiconductor memory device including fuse element
10/18/2005US6956767 Nonvolatile memory device using serial diode cell
10/18/2005US6956765 Magneto-resistance effect element, magnetic memory and magnetic head
10/18/2005US6956762 Method and system for data communication on a chip
10/18/2005US6956761 Method to manufacture polymer memory with copper ion switching species
10/18/2005US6956760 Ferroelectric random access memory
10/18/2005US6956759 Ferrodielectric non-volatile semiconductor memory
10/18/2005US6956757 Low cost high density rectifier matrix memory
10/18/2005US6956743 Electronic component, in particular regulator for generators in motor vehicles
10/18/2005US6956729 Capacitor element and production thereof
10/18/2005US6956655 Characterization and compensation of non-cyclic errors in interferometry systems
10/18/2005US6956644 Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination
10/18/2005US6956641 Method of forming resist pattern, and exposure device
10/18/2005US6956640 Light energy detecting apparatus for exposure condition control in semiconductor manufacturing apparatus
10/18/2005US6956638 Display device and method of manufacturing the same
10/18/2005US6956437 Metal-oxide-semiconductor device having integrated bias circuit
10/18/2005US6956402 Multi-device system and method for controlling voltage peaking of an output signal transmitted between integrated circuit devices
10/18/2005US6956385 Integrated circuit defect analysis using liquid crystal
10/18/2005US6956378 Signal supply apparatus and method for examining the same, and semiconductor device, electro-optical apparatus and electronic apparatus using the same
10/18/2005US6956333 Hot electron emission array for e-beam photolithography and display screens
10/18/2005US6956297 Electronic circuit unit that is easy to manufacture and method of manufacturing the same
10/18/2005US6956296 Transfer molding of integrated circuit packages
10/18/2005US6956295 Flip-chip image sensor packages
10/18/2005US6956293 Semiconductor device
10/18/2005US6956292 Bumping process to increase bump height and to create a more robust bump structure
10/18/2005US6956291 Apparatus and method for forming solder seals for semiconductor flip chip packages
10/18/2005US6956290 Flip-chip BGA semiconductor device for achieving a superior cleaning effect
10/18/2005US6956289 Semiconductor device
10/18/2005US6956288 Semiconductor device with folded film substrate and display device using the same
10/18/2005US6956287 Electronic component with flexible bonding pads and method of producing such a component
10/18/2005US6956283 Encapsulants for protecting MEMS devices during post-packaging release etch
10/18/2005US6956279 Semiconductor device having multi-layer oxygen barrier pattern
10/18/2005US6956278 Low-density, high-resistivity titanium nitride layer for use as a contact for low-leakage dielectric layers
10/18/2005US6956277 Diode junction poly fuse
10/18/2005US6956276 Semiconductor device with an L-shaped/reversed L-shaped gate side-wall insulating film
10/18/2005US6956270 Magnetic memory device having a plurality of magneto-resistance effect elements arranged in a matrix form and method for manufacturing the same
10/18/2005US6956267 Semiconductor with a nitrided silicon gate oxide and method
10/18/2005US6956266 Structure and method for latchup suppression utilizing trench and masked sub-collector implantation
10/18/2005US6956265 Semiconductor device and method for manufacturing partial SOI substrates
10/18/2005US6956264 Trenched semiconductor devices and their manufacture
10/18/2005US6956263 Field effect transistor structure with self-aligned raised source/drain extensions
10/18/2005US6956261 Semiconductor device and method for manufacturing the same
10/18/2005US6956260 Integrated semiconductor memory with wordlines conductively connected to one another in pairs
10/18/2005US6956259 Semiconductor device and method of manufacturing the same
10/18/2005US6956258 Reprogrammable non-volatile memory using a breakdown phenomena in an ultra-thin dielectric
10/18/2005US6956255 Semiconductor device and drive circuit using the semiconductor devices
10/18/2005US6956254 Multilayered dual bit memory device with improved write/erase characteristics and method of manufacturing
10/18/2005US6956253 Color filter with resist material in scribe lines
10/18/2005US6956251 On-p-GaAs substrate Zn1−xMgxSySe1−y pin photodiode and on-p-GaAs substrate Zn1−xMgxSySe1−y avalanche photodiode
10/18/2005US6956241 Semiconductor light emitting element with improved light extraction efficiency
10/18/2005US6956239 Transistors having buried p-type layers beneath the source region
10/18/2005US6956238 Silicon carbide power metal-oxide semiconductor field effect transistors having a shorting channel and methods of fabricating silicon carbide metal-oxide semiconductor field effect transistors having a shorting channel
10/18/2005US6956237 Thin film transistor array substrate and method for manufacturing the same
10/18/2005US6956236 comprises electrode (wiring) having copper layer surrounded by a coating film made of titanium or titanium or titanium oxide; thin film transistors (TFT); liquid crystal displays (LCD)
10/18/2005US6956235 Semiconductor device
10/18/2005US6956231 Switchable circuit devices
10/18/2005US6956223 Multi-directional scanning of movable member and ion beam monitoring arrangement therefor
10/18/2005US6956222 Lithographic apparatus and method of manufacturing a device
10/18/2005US6956219 MEMS based charged particle deflector design
10/18/2005US6956186 Ceramic heater
10/18/2005US6956182 Method of forming an opening or cavity in a substrate for receiving an electronic component
10/18/2005US6956174 Tip structures
10/18/2005US6956167 Lid-holding frame used in production of hollow-package type electronic products, and sealing-process using such lid-holding frame
10/18/2005US6956165 for electronics with multiple areas of stiffness/coefficient of thermal expansion; comprises epoxy resin and curing substance (vaporized hydrofluoric acid)
10/18/2005US6956097 Siloxane polymer and an organic absorbing compound that strongly absorbs light at given wavelength, such as 9-anthracene carboxy-methyl triethoxysilane; for deep ultraviolet photolithography
10/18/2005US6955998 Method for forming low dielectric layer of semiconductor device
10/18/2005US6955997 Laser thermal annealing method for forming semiconductor low-k dielectric layer
10/18/2005US6955996 Method for stabilizing high pressure oxidation of a semiconductor device
10/18/2005US6955995 Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates
10/18/2005US6955994 Method of manufacturing semiconductor device and method of manufacturing optical wave guide
10/18/2005US6955992 One mask PT/PCMO/PT stack etching process for RRAM applications
10/18/2005US6955991 Atmospheric process and system for controlled and rapid removal of polymers from high depth to width aspect ratio holes
10/18/2005US6955990 Methods for forming a gate in a semiconductor device
10/18/2005US6955989 Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in silicon
10/18/2005US6955988 Method of forming a cavity and SOI in a semiconductor substrate
10/18/2005US6955987 Comparison of chemical-mechanical polishing processes
10/18/2005US6955986 Atomic layer deposition methods for forming a multi-layer adhesion-barrier layer for integrated circuits
10/18/2005US6955985 Domain epitaxy for thin film growth
10/18/2005US6955984 Surface treatment of metal interconnect lines
10/18/2005US6955983 Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layer
10/18/2005US6955982 Flip chip C4 extension structure and process
10/18/2005US6955981 Pad structure to prompt excellent bondability for low-k intermetal dielectric layers
10/18/2005US6955980 Reducing the migration of grain boundaries
10/18/2005US6955979 Methods for making metallization structures for semiconductor device interconnects
10/18/2005US6955978 Uniform contact
10/18/2005US6955977 Single step pendeo-and lateral epitaxial overgrowth of group III-nitride epitaxial layers with group III-nitride buffer layer and resulting structures
10/18/2005US6955976 Method for dicing wafer stacks to provide access to interior structures
10/18/2005US6955975 Method for joining a silicon plate to a second plate
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