Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2005
10/13/2005US20050223993 Deposition apparatuses; methods for assessing alignments of substrates within deposition apparatuses; and methods for assessing thicknesses of deposited layers within deposition apparatuses
10/13/2005US20050223990 Plasma processing system and its substrate processing process, plasma enhanced chemical vapor deposition system and its film deposition process
10/13/2005US20050223989 System for forming composite polymer dielectric film
10/13/2005US20050223987 Film forming apparatus
10/13/2005US20050223986 Gas diffusion shower head design for large area plasma enhanced chemical vapor deposition
10/13/2005US20050223985 Deposition apparatuses, methods of assessing the temperature of semiconductor wafer substrates within deposition apparatuses, and methods for deposition of epitaxial semiconductive material
10/13/2005US20050223982 Apparatus and method for depositing thin film on wafer using remote plasma
10/13/2005US20050223981 Processing device using shower head structure and processing method
10/13/2005US20050223980 Substrate processing device, substrate processing method, and developing device
10/13/2005US20050223978 Technique for high efficiency metalorganic chemical vapor deposition
10/13/2005US20050223975 Device for liquid treatment of disk-shaped objects
10/13/2005US20050223970 Crystallization apparatus, crystallization method, device and phase modulation element
10/13/2005US20050223917 Paste dispenser and method for controlling the same
10/13/2005US20050223837 Methods and systems for driving robotic components of a semiconductor handling system
10/13/2005US20050223791 Measuring apparatus and method for thin board
10/13/2005US20050223785 Scanning probe device and processing method by scanning probe
10/13/2005US20050223718 Thermophoretic wand to protect front and back surfaces of an object
10/13/2005US20050223588 Apparatus and method for drying substrates
10/13/2005US20050223570 Mechanical scribing apparatus with controlling force of a scribing cutter
10/13/2005US20050223552 Bonding an interconnect to a circuit device and related devices
10/13/2005DE3833161B4 Verfahren zum Gettern von Halbleiter-Bauelementen und nach dem Verfahren erhaltene Halbleiter-Bauelemente A method for gettering semiconductor devices and by the method obtained semiconductor devices
10/13/2005DE202005012099U1 Wet cleaning device for semiconductor disks in transport pod has cleaning device integrated into its structure of pod and has conveyer with line of cleaning stations and pod handling device
10/13/2005DE202004011907U9 Ausrichtvorrichtung für einen Wafer und Waferbearbeitungsvorrichtung Alignment for a wafer and wafer processing apparatus
10/13/2005DE19946153B4 Vermeidung von Schleifriefen und Kümpelfehlern beim chemisch-mechanischen Polieren in einem Herstellungsverfahren für einen Halbleiter Prevention of chatter marks and Kümpelfehlern in chemical-mechanical polishing in a method of manufacturing a semiconductor
10/13/2005DE19916071B4 Verfahren zum Vereinzeln von Halbleiterbauelementen und Trennvorrichtung A method of separating semiconductor devices and separating device
10/13/2005DE19810060B4 Verfahren zur Verbindung eines Bauelements mit einem Substrat und eine damit hergestellte elektrische Schaltung A method for connecting a component with a substrate and an electrical circuit thus produced
10/13/2005DE19728428B4 Halbleiterwafer-Poliermaschine Semiconductor wafer polishing machine
10/13/2005DE19649409B4 Verfahren zum Herstellen eines Diamantfilms auf einem Substrat A method for producing a diamond film on a substrate
10/13/2005DE19610322B4 Verfahren zur Passivierungsbehandlung eines Rohrleitungssystems für hochreines Gas und seine Verwendung Process for the passivation of a piping system for high purity gas and its use
10/13/2005DE19507279B4 Verfahren zum Bilden eines isolierenden Bereichs in einem Halbleiterbauelement A method of forming an insulating region in a semiconductor device
10/13/2005DE10393850T5 Ferroelektrischer Kondensator und Prozeß zu seiner Herstellung A ferroelectric capacitor and process for its preparation
10/13/2005DE10393627T5 Lateraler Kurzkanal-dmos, Verfahren zur Herstellung desselben und Halbleiterbauelement A lateral short-channel DMOS, the same method for producing the semiconductor component and
10/13/2005DE10393466T5 Verfahren zum Erzeugen eines Keramik-Mehrschicht-Substrats A method for producing a ceramic multi-layer substrate
10/13/2005DE10345402B4 Verfahren zur Bearbeitung einer Halbleiterstruktur mit einer Vertiefung A method of processing a semiconductor structure with a recess
10/13/2005DE10344273B4 Verbesserter Kontakt für Speicherzellen Improved contact for memory cells
10/13/2005DE10341544B4 Verfahren zum Herstellen einer Leiterbahnanordnung und Leiterbahnanordnung A method for producing a conductive strip array and interconnect arrangement
10/13/2005DE10324055B4 Verfahren zur Herstellung eines integrierten Stapelkondensators A method for manufacturing an integrated stacked capacitor
10/13/2005DE102005014118A1 Packing for semiconductors has an integrated switching circuit chip with top and bottom sides and a conductor framework in direct contact with a surface on the top/bottom side
10/13/2005DE102005014052A1 Silicon block cutting method for use in e.g. electronic field, involves holding block in cut area after block is cut, such that individual slices are firmly clamped on opposite sides by membrane, and releasing portion of un-cut block
10/13/2005DE102005013904A1 Elektrostatische Haltevorrichtung und dieselbe verwendendes Substrathalteverfahren An electrostatic chuck and the same-use substrate holding method
10/13/2005DE102005013575A1 Niedertemperatur-, Langzeitwärmebehandlung von Nickelkontakten, um einen Zwischenflächenwiderstand zu verringern Low-temperature, long-term heat treatment of nickel contacts, to reduce an interface resistance
10/13/2005DE102005008068A1 Verfahren zum Analysieren eines Metallelementes auf einem Wafer A method for analyzing a metal element on a wafer
10/13/2005DE102005006614A1 Zusammensetzungen und Verfahren für das chemisch-mechanische Polieren von Siliciumdioxid und Siliciumnitrid Compositions and methods for chemical mechanical polishing of silicon dioxide and silicon nitride
10/13/2005DE102004063609A1 Fabrication of nonvolatile memory device, such as read only memory, comprises sequentially forming gate oxide layer, polysilicon layer for first control gates, buffer oxide layer, and buffer nitride layer on semiconductor substrate
10/13/2005DE102004054358A1 Verfahren zum Korrigieren eines Lithographieprozesses und Verfahren zur Herstellung einer Überlagerungsmarkierung A method for correcting a lithography process and a superposition process for producing marking
10/13/2005DE102004037011A1 LCD device for e.g. wall-mountable television, has two resistance compensation structures with recess or hole in gate and data link lines and gate and data lines, to compensate resistance value of gate and data link lines
10/13/2005DE102004032477A1 Transistor einer nicht flüchtigen Speichervorrichtung mit einer dielektrischen Gatestruktur, welche fähig zum Einfangen von Ladungen ist, und ein Verfahren zum Herstellen der Vorrichtung Transistor of a non-volatile memory device having a gate dielectric structure which is capable of trapping charges, and a method for manufacturing the device
10/13/2005DE102004016223A1 Method of layout of dynamic RAM (DRAM) memory chips etc., with generating automatically transfer data train with information about set-up and/or functions of data lines or current paths by place and route system
10/13/2005DE102004015092A1 Use of N-(cyclo)alkylpyrrolidones in the production of polyurethanes useful for preparing polyurethane dispersions
10/13/2005DE102004014928A1 High voltage transistor used in submicron technology comprises sinks of the same conductivity extending from the source and drain to the substrate
10/13/2005DE102004014644A1 Integrierter Schaltkreis Integrated circuit
10/13/2005DE102004012855A1 Herstellungsverfahren für einen Grabenkondensator mit Isolationskragen Manufacturing method of a grave capacitor insulation collar
10/13/2005DE102004012766A1 Carrier module for semiconductor device test handler, has bolting devices fastened such that it is rotated on opposite sides of other set of bolting devices, where two elastic units flexibly hold bolting devices
10/13/2005DE102004012629A1 Feldeffekt-Halbleiterschalter und Verfahren zu seiner Herstellung Field effect semiconductor switch and process for its preparation
10/13/2005DE10117306B4 Verfahren zur Herstellung einer strukturierten Dünnschicht-Anordnung A method for producing a structured thin-film arrangement
10/13/2005DE10056869B4 Halbleiterbauteil mit einer strahlungsabsorbierenden leitenden Schutzschicht und Verfahren zur Herstellung derselben A semiconductor device comprising a radiation-conducting protective layer and method of manufacturing the same
10/13/2005DE10029269B4 Verfahren zur Herstellung eines elektronischen Bauteiles aus gehäusebildenden Substraten A process for producing an electronic component from housing forming substrates
10/13/2005DE10017746B4 Verfahren zur Herstellung eines elektronischen Bauteils mit mikroskopisch kleinen Kontaktflächen A method of manufacturing an electronic component with microscopically small contact surfaces
10/13/2005CA2558591A1 Susceptor
10/13/2005CA2554815A1 Sequential lithographic methods to reduce stacking fault nucleation sites and structures having reduced stacking fault nucleation sites
10/12/2005EP1585222A2 Output driver circuit having adjustable swing width, method of adjusting a swing width of an output signal, and high speed input circuit
10/12/2005EP1585180A2 Dielectric member, piezoelectric member, ink jet head, ink jet recording apparatus, and production methods thereof
10/12/2005EP1585177A2 Masterslice, semiconductor memory, and method for manufacturing semiconductor memory
10/12/2005EP1585176A1 Ferroelectric capacitor and method for fabricating the same
10/12/2005EP1585174A1 Circuit device and manufacturing method of the same
10/12/2005EP1585173A2 Aluminium bonding member and method for producing same
10/12/2005EP1585172A1 Magnetic memory device
10/12/2005EP1585171A1 An SOI circuit having reduced crosstalk interference and a method for forming the same
10/12/2005EP1585170A2 Dicing die bonding film
10/12/2005EP1585166A2 Controlled charge neutralization of Ion-implanted articles
10/12/2005EP1585138A2 A magnetic random access memory array with free layer locking mechanism
10/12/2005EP1585101A2 Spatial light modulator and method of performing photolithography using the same
10/12/2005EP1585002A1 Flow control method for clustering fluid and flow control device for clustering fluid
10/12/2005EP1584983A2 Exposure apparatus, and device manufacturing method
10/12/2005EP1584982A2 Method of optimizing imaging performance
10/12/2005EP1584980A2 Method of optical proximity correction using chamfers and rounding at corners
10/12/2005EP1584973A1 Arrangement of TFT and pixel electrodes for liquid crystal display
10/12/2005EP1584935A1 Configuration of unused external pins during the test mode in a semiconductor integrated circuit
10/12/2005EP1584934A1 Device for releasable connecting an interface to a test equipment
10/12/2005EP1584932A1 Method of testing semiconductor wafers with non-penetrating probes
10/12/2005EP1584919A2 Apparatus for handling of a disklike member, especially for handling of a wafer
10/12/2005EP1584706A1 Copper alloy sputtering target and semiconductor element wiring
10/12/2005EP1584634A1 Polymeric compound for photoresist and resin composition for photoresist
10/12/2005EP1584109A2 Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier
10/12/2005EP1584108A1 High performance embedded dram technology with strained silicon
10/12/2005EP1584107A2 Adaptive negative differential resistance device
10/12/2005EP1584106A2 Shallow trench isolation process for strained silicon processes
10/12/2005EP1584104A2 Re-crystallization of semiconductor surface film and doping of semiconductor by energetic cluster irradiation
10/12/2005EP1584102A1 Encapsulation of ferroelectric capacitors
10/12/2005EP1584100A2 A method and apparatus for forming a high quality low temperature silicon nitride layer
10/12/2005EP1583998A2 Method of forming resist pattern, positive resist composition, and layered product
10/12/2005EP1583997A2 Photoresist removal
10/12/2005EP1583858A2 Sacrificial template method of fabricating a nanotube
10/12/2005EP1485439A4 Improved chemical-mechanical polishing slurry for polishing of copper or silver films
10/12/2005EP1478494B1 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
10/12/2005EP1397808B1 Steering gate and bit line segmentation in non-volatile memories
10/12/2005EP1368136A4 Methods for cleaning microelectronic structures
10/12/2005EP1268133B1 Polishing head for wafer, and method for polishing
10/12/2005EP0922301B1 Substrate with conductor formed of low-resistance aluminum alloy
10/12/2005CN2733596Y 半导体结构 Semiconductor structure
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