Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2005
10/13/2005US20050227457 Method of forming silicon-based thin film, silicon-based thin film, and photovoltaic element
10/13/2005US20050227456 Cutting thin layer(s) from semiconductor material(s)
10/13/2005US20050227455 Method of separating layers of material
10/13/2005US20050227454 Method for manufacturing silicon-on-insulator wafer
10/13/2005US20050227453 Group III nitride semiconductor crystal, production method thereof and group III nitride semiconductor epitaxial wafer
10/13/2005US20050227452 Method for producing semiconductor device
10/13/2005US20050227450 Methods of forming trench isolation regions
10/13/2005US20050227449 Method for manufacturing self-compensating resistors within an integrated circuit
10/13/2005US20050227448 High voltage double diffused drain MOS transistor with medium operation voltage
10/13/2005US20050227447 Method for fabricating semiconductor device
10/13/2005US20050227446 Sidewall spacer for semiconductor device and fabrication method thereof
10/13/2005US20050227445 P channel Rad Hard MOSFET with enhancement implant
10/13/2005US20050227444 Method of fabricating self-aligned source and drain contacts in a double gate fet with controlled manufacturing of a thin Si or non-Si channel
10/13/2005US20050227443 Multi-level memory cell and fabricating method thereof
10/13/2005US20050227442 Atomic layer deposited nanolaminates of HfO2/ZrO2 films as gate dielectrics
10/13/2005US20050227441 Method of forming a tantalum-containing gate electrode structure
10/13/2005US20050227440 Semiconductor device and its manufacturing method
10/13/2005US20050227439 Tri-gate low power device and method for manufacturing the same
10/13/2005US20050227438 Semiconductor device and method of manufacturing same
10/13/2005US20050227437 Method of forming ONO-type sidewall with reduced bird's beak
10/13/2005US20050227436 Semiconductor memory device having capacitors and method for forming the same
10/13/2005US20050227435 Non-volatile memory devices and method for forming the same
10/13/2005US20050227434 [method of manufacturing non-volatile memory cell]
10/13/2005US20050227433 Methods of forming capacitor constructions
10/13/2005US20050227432 Methods of forming metal-insulator-metal (MIM) capacitors with separate seed and main dielectric layers and MIM capacitors so formed
10/13/2005US20050227431 Memory device with platinum-rhodium stack as an oxygen barrier
10/13/2005US20050227430 Process of fabricating high resistance CMOS resistor
10/13/2005US20050227429 Electronic component mounting method and apparatus and ultrasondic bonding head
10/13/2005US20050227427 Formation of standard voltage threshold and low voltage threshold MOSFET devices
10/13/2005US20050227426 Charge-trapping memory cell array and method for production
10/13/2005US20050227425 Method for fabricating semiconductor devices using strained silicon bearing material
10/13/2005US20050227424 Semiconductor devices having a field effect transistor and methods of fabricating the same
10/13/2005US20050227423 Wing gate transistor for integrated circuits
10/13/2005US20050227422 Semiconductor device and manufacturing method of the same
10/13/2005US20050227421 Method of manufacturing a semiconductor on a silicon on insulator (SOI) substrate using solid epitaxial regrowth (SPER) and semiconductor device made thereby
10/13/2005US20050227420 Mask ROM and the method of forming the same and the scheme of reading the device
10/13/2005US20050227419 Semiconductor device and manufacturing method thereof
10/13/2005US20050227418 Method for creating a self-aligned soi diode by removing a polysilicon gate during processing
10/13/2005US20050227417 Packaging assembly utilizing flip chip and conductive plastic traces
10/13/2005US20050227416 Electronic device and method of manufacture the same
10/13/2005US20050227415 Method for fabricating encapsulated semiconductor components
10/13/2005US20050227414 Packaging method for integrated circuits
10/13/2005US20050227413 Method for depositing a solder material on a substrate
10/13/2005US20050227412 Flexible multi-chip module and method of making the same
10/13/2005US20050227411 Methods for fabricating electronic components to include supports for conductive structures
10/13/2005US20050227410 Manufacture of microelectronic fold packages
10/13/2005US20050227409 Microelectronics package assembly tool and method of manufacture therewith
10/13/2005US20050227408 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
10/13/2005US20050227407 Multi-passivation layer structure for organic thin-film transistors and method for fabricating the same
10/13/2005US20050227404 Manufacture of a semiconductor light-emitting device
10/13/2005US20050227403 Solid state image pickup device and manufacturing method thereof and semiconductor integrated circuit device and manufacturing method thereof
10/13/2005US20050227402 [method of manufacturing photodiode]
10/13/2005US20050227401 Method of packaging MEMS device in vacuum state and MEMS device vacuum-packaged using the same
10/13/2005US20050227400 Encapsulation wafer process
10/13/2005US20050227399 Method of fabricating liquid crystal display device
10/13/2005US20050227397 Active matrix display device and manufacturing method thereof
10/13/2005US20050227396 Method for warming-up an LCD (liquid crystal display) system
10/13/2005US20050227395 Array substrate of liquid crystal display and fabrication method thereof
10/13/2005US20050227394 Method for forming die protecting layer
10/13/2005US20050227392 Method of manufacturing a semiconductor light emitting device, semiconductor light emitting device, method of manufacturing a semiconductor device, semiconductor device, method of manufacturing a device, and device
10/13/2005US20050227391 Nanowire light emitting device and method of fabricating the same
10/13/2005US20050227389 Deformable organic devices
10/13/2005US20050227388 LED illumination device with layered phosphor pattern
10/13/2005US20050227387 Bonding a cover plate over encapsulated OLEDs
10/13/2005US20050227386 Method of forming quantum dots for extended wavelength operation
10/13/2005US20050227385 Method of and system for manufacturing organic EL devices
10/13/2005US20050227384 Method for manufacturing semiconductor device
10/13/2005US20050227383 Manufacturing method of semiconductor integrated circuit device and probe card
10/13/2005US20050227382 In-situ surface treatment for memory cell formation
10/13/2005US20050227381 Using cell voltage as a monitor for deposition coverage
10/13/2005US20050227379 Laser patterning of light emitting devices and patterned light emitting devices
10/13/2005US20050227378 Integrated circuit and method
10/13/2005US20050227377 Creation of electron traps in metal nitride and metal oxide electrodes in polymer memory devices
10/13/2005US20050227376 Semiconductor display device and method of manufacturing the same
10/13/2005US20050227363 Methods of monitoring rinsing solutions and related systems and reagents
10/13/2005US20050227187 Ionic fluid in supercritical fluid for semiconductor processing
10/13/2005US20050227172 Process for producing photoresist composition, filtration device, application device, and photoresist composition
10/13/2005US20050227170 Positive resist composition
10/13/2005US20050227153 Mask for proximity field optical exposure, exposure apparatus and method therefor
10/13/2005US20050227151 Mask pattern for semiconductor device fabrication, method of forming the same, method for preparing coating composition for fine pattern formation, and method of fabricating semiconductor device
10/13/2005US20050227118 Plasma resistant member
10/13/2005US20050227098 Structures including perovskite dielectric layers and variable oxygen concentration gradient layers
10/13/2005US20050227071 Redox-switchable materials
10/13/2005US20050227064 Dicing die bonding film
10/13/2005US20050227055 Depositing ultrathin layer comprising a polymer having repeating units derived from unsubstituted p-xylylene, substituted p-xylylene, phenylene vinylene, phenylene ethynylene, 1,4-methylene naphthalene, exposing to oxygen; depositing a metal layer comprising Be, B, Mg, Al, Si, Ti, V, Cr, Mn, Fe, Co, Ni
10/13/2005US20050227018 Application of a coating forming material onto at least one substrate
10/13/2005US20050227017 Low temperature deposition of silicon nitride
10/13/2005US20050227014 Use of "CAP coater" in which liquid level height, capillary gap distance, and relative scanning speed between coating nozzle and surface to be coated are adjusted by setting the thickness of the resist film at a predetermined value; the larger the coating gap, the smaller the thickness distribution rate
10/13/2005US20050226494 Pattern inspection apparatus, pattern inspection method, and recording medium
10/13/2005US20050226299 Vertical-cavity surface emitting laser diode
10/13/2005US20050226089 Memory chip architecture having non-rectangular memory banks and method for arranging memory banks
10/13/2005US20050226081 Semiconductor memory device
10/13/2005US20050226077 Static memory cell having independent data holding voltage
10/13/2005US20050226075 Master chip, semiconductor memory, and method for manufacturing semiconductor memory
10/13/2005US20050226068 Multi-layered memory cell structure
10/13/2005US20050226067 Nonvolatile memory cell operating by increasing order in polycrystalline semiconductor material
10/13/2005US20050226054 Integrated code and data flash memory
10/13/2005US20050226053 Semiconductor memory
10/13/2005US20050226052 Novel oxidation structure/method to fabricate a high-performance magnetic tunneling junction mram
10/13/2005US20050226048 NAND flash memory device and method of reading the same