Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2005
11/01/2005US6960416 Method and apparatus for controlling etch processes during fabrication of semiconductor devices
11/01/2005US6960414 Determining overlay parameters for a plurality of sub-layouts; inputting the overlay parameters into an exposure system; exposing each sub-layout to photoresist on a wafer by using the exposure system; correction; development
11/01/2005US6960412 Uses as an intermediate layer of titanium and boron material easy in controlling a film stress so as to produce a mask prevented from being deformed to cause degradation in transfer accuracy
11/01/2005US6960411 For forming patterns on a semiconductor substrate
11/01/2005US6960381 For photolithographic patterning
11/01/2005US6960373 Continuous mode solder jet method
11/01/2005US6960372 Drying the coating film after forming the coating film in a state of the posture of the substrate is kept and with inhibiting the down flow from turning into a side of the surface to be coated
11/01/2005US6960366 Plated terminations
11/01/2005US6960365 Providing a wafer having a workpiece; depositing an insulating layer; patterning insulating layer with trenches, depositing conductive layer over insulating layer within trenches; depositing resist; removing depositing a thin dielectric layer
11/01/2005US6960306 Low Cu percentages for reducing shorts in AlCu lines
11/01/2005US6960284 Rotational and reciprocal radial movement of a sputtering magnetron
11/01/2005US6960282 Apparatus for cleaning residual material from an article
11/01/2005US6960278 Method of improving the properties of adhesion of a non-oxide ceramic substrate before gluing it
11/01/2005US6960265 Apparatus and method for collecting metallic impurity on a semiconductor wafer
11/01/2005US6960264 Process for fabricating films of uniform properties on semiconductor devices
11/01/2005US6960263 Shadow frame with cross beam for semiconductor equipment
11/01/2005US6960258 Discharge device and discharge method
11/01/2005US6960257 Semiconductor processing system with wafer container docking and loading station
11/01/2005US6960255 Framework assisted crystal growth
11/01/2005US6960123 Cleaning sheet for probe needles
11/01/2005US6960119 Method and system for deflashing mold compound
11/01/2005US6960115 Multiprobe detection system for chemical-mechanical planarization tool
11/01/2005US6960114 Pad conditioner of CMP equipment
11/01/2005US6960057 Substrate transport apparatus
11/01/2005US6959920 Protection against in-process charging in silicon-oxide-nitride-oxide-silicon (SONOS) memories
11/01/2005US6959863 Method for selectively transferring at least an element from an initial support onto a final support
11/01/2005US6959856 Solder bump structure and method for forming a solder bump
11/01/2005US6959854 Production method for bonded substrates
11/01/2005US6959823 Wafer guides for processing semiconductor substrates
11/01/2005US6959503 Method and apparatus for removing liquid from substrate surfaces using suction
11/01/2005US6959485 Bump ball crimping apparatus
11/01/2005US6959484 System for vibration control
11/01/2005CA2354080C Integral lens for high energy particle flow, method for producing such lenses and use thereof in analysis devices and devices for radiation therapy and lithography
11/01/2005CA2233876C Coating method of amorphous type titanium peroxide
10/2005
10/27/2005WO2005101943A2 Electronic component mounting apparatus and method of mounting electronic components
10/27/2005WO2005101927A1 Power supply circuit for plasma generation, plasma generating apparatus, plasma processing apparatus and plasma-processed object
10/27/2005WO2005101539A1 Layered resistance variable memory device and method of fabrication
10/27/2005WO2005101522A2 Process and device for cleaning and etching a substrate with a transparent conductive oxide layer
10/27/2005WO2005101520A1 Semiconductor device and manufacturing method thereof
10/27/2005WO2005101519A1 Semiconductor device and manufacturing method thereof
10/27/2005WO2005101518A1 Method for manufacturing semiconductor device
10/27/2005WO2005101517A1 Bipolar transistor incorporating resistor
10/27/2005WO2005101515A2 Process to improve transistor drive current through the use of strain
10/27/2005WO2005101509A1 Semiconductor device and process for fabricating the same
10/27/2005WO2005101508A1 Semiconductor device and method for manufacture thereof
10/27/2005WO2005101504A1 Power module
10/27/2005WO2005101501A1 Housing formed by a metallic layer
10/27/2005WO2005101499A2 Methods of forming solder bumps on exposed metal pads and related structures
10/27/2005WO2005101496A2 Method for structured application of a laminatable film to a substrate for a semiconductor module
10/27/2005WO2005101495A1 Flexible printed circuit board for mounting semiconductor chip
10/27/2005WO2005101492A2 Stacked die bga or lga component assembly
10/27/2005WO2005101490A2 Component that is situated on a cooling fin
10/27/2005WO2005101488A1 Nonvolatile semiconductor storage element having high charge holding characteristics and method for fabricating the same
10/27/2005WO2005101487A1 Laser processing apparatus
10/27/2005WO2005101486A1 Wafer processing device and wafer processing method
10/27/2005WO2005101485A1 Substrate processing equipment and substrate processing method
10/27/2005WO2005101484A1 Atmosphere replacement port connecting device for substrate storage vessels
10/27/2005WO2005101483A1 Semiconductor wafer inspection device and method
10/27/2005WO2005101482A1 Method for preparing electronic chips, and resulting set of chips
10/27/2005WO2005101481A2 Power semiconductor
10/27/2005WO2005101480A2 Circuit mounted on an especially electroconductive substrate by means of a planar connection technique
10/27/2005WO2005101479A1 Integrated circuit die and substrate coupling
10/27/2005WO2005101478A1 Packaging assembly utilizing flip chip and conductive plastic traces
10/27/2005WO2005101477A1 Semiconductor device and its manufacturing method
10/27/2005WO2005101476A1 Semiconductor element and semiconductor element manufacturing method
10/27/2005WO2005101475A1 Semiconductor element and semiconductor system
10/27/2005WO2005101474A1 Metal polishing liquid and polishing method using it
10/27/2005WO2005101473A1 Method of forming barrier film and method of forming electrode film
10/27/2005WO2005101472A1 Method for manufacturing semiconductor integrated circuit device
10/27/2005WO2005101471A1 Processing equipment for object to be processed
10/27/2005WO2005101470A1 Method of three-dimensional microfabrication and high-density three-dimensional fine structure
10/27/2005WO2005101469A1 End-point detection for fib circuit modification
10/27/2005WO2005101468A1 Rinse treatment method and development process method
10/27/2005WO2005101467A1 Coater/developer and coating/developing method
10/27/2005WO2005101466A2 Methods for fabricating isolated micro- and nano- structures using soft or imprint lithography
10/27/2005WO2005101465A2 Method and system for lattice space engineering
10/27/2005WO2005101464A2 Polymerase chain reaction using metallic glass-coated microwire
10/27/2005WO2005101463A1 Wafer scanning system with reciprocating rotary motion utilizing springs and counterweights
10/27/2005WO2005101462A2 Low permeable air-conditioning hose
10/27/2005WO2005101461A1 Apparatus for controlling gas flow in a semiconductor substrate processing chamber
10/27/2005WO2005101460A2 Bonding an interconnect to a circuit device and related devices
10/27/2005WO2005101459A2 Method for machining a workpiece on a workpiece support
10/27/2005WO2005101458A2 Method and use of a device for applying coatings onto band-shaped structures during the production of semiconductor components
10/27/2005WO2005101447A2 Led illumination device with layered phosphor pattern
10/27/2005WO2005101129A1 Radiation-sensitive resin composition
10/27/2005WO2005101128A1 Positive resist composition and process for the formation of resist patterns
10/27/2005WO2005101127A1 Resist composition
10/27/2005WO2005101100A2 Method and apparatus for in-situ film stack processing
10/27/2005WO2005100994A1 Partially oxidised macroporous silicon comprising discontinuous silicon walls
10/27/2005WO2005100962A1 Classification device and classification method
10/27/2005WO2005100647A1 Group iii nitride crystal substrate, method for producing same, and group iii nitride semiconductor device
10/27/2005WO2005100638A1 Etching method and etching liquid
10/27/2005WO2005100637A1 Liquid treatment device and liquid treatment method
10/27/2005WO2005100633A1 Coatings, and methods and devices for the manufacture thereof
10/27/2005WO2005100497A1 Cmp porous pad with component-filled pores
10/27/2005WO2005100496A2 Chemical-mechanical polishing composition and method for using the same
10/27/2005WO2005100236A1 Method of packaging mems device in vacuum state and mems device vacuum-packaged using the same
10/27/2005WO2005100070A1 Hydraulically operated automobile
10/27/2005WO2005099388A2 Chemical-mechanical polishing of sic surfaces using hydrogen peroixde or ozonated water solutions in combination with colloidal abrasive
10/27/2005WO2005099350A2 Non-contact support platforms for distance adjustment
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